IP Library › Granted Patent US 762,596
Granted Patent S1
US 762,596 · App. 29/522,734 · Granted Aug 2, 2016

Light emitting diode package substrate

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Quick Facts
Patent No.
US 762,596
App. No.
29/522,734
Granted
Aug 2, 2016
Kind
S1
Claims (1)

The ornamental design for a light emitting diode package substrate, as shown and described.

Assignments (3)
ADDRESS CHANGE REGISTRATION FORM Recorded Dec 15, 2023
From: GENESIS PHOTONICS INC.
To: GENESIS PHOTONICS INC.
Reel/Frame 066044/0133 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2023
From: GENESIS PHOTONICS INC.
To: NICHIA CORPORATION
Reel/Frame 066044/0807 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 8, 2015
From: LEE, HAO-CHUNG; LIN, YU-FENG; ZHAN, XUN-XAIN
To: GENESIS PHOTONICS INC.
Reel/Frame 035388/0948 →