IP Library Granted Patent US 9,871,169
Granted Patent B2
US 9,871,169 · App. 14/019,553 · Granted Jan 16, 2018

Light emitting diode structure

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Quick Facts
Patent No.
US 9,871,169
App. No.
14/019,553
Granted
Jan 16, 2018
Kind
B2
Abstract

A light emitting diode structure including a substrate, a semiconductor epitaxial layer and a reflective conductive structure layer is provided. The semiconductor epitaxial layer is disposed on the substrate and exposes a portion of the substrate. The reflective conductive structure layer covers a part of the semiconductor epitaxial layer and the portion of the substrate exposed by the semiconductor epitaxial layer.

Claims (50)

1. A light emitting diode structure, comprising:

a substrate;

a semiconductor epitaxial layer, having a lateral surface and at least one recess formed therein, being disposed on the substrate and exposing an edge portion of the substrate, wherein the semiconductor epitaxial layer comprises a first type semiconductor layer, a light emitting layer and a second type semiconductor layer disposed on the substrate in sequence, and the recess is surrounded by the second type semiconductor layer and the light emitting layer and exposes a portion of the first type semiconductor layer;

a conductive contact layer, disposed on the semiconductor epitaxial layer;

a reflective layer, disposed on at least a portion of the conductive contact layer and substantially covering an entirety of the lateral surface of the semiconductor epitaxial layer and the edge portion of the substrate exposed by the semiconductor epitaxial layer;

a first insulating layer, disposed on the reflective layer;

a first electrode layer, disposed on the first insulating layer, the reflective layer and the conductive contact layer, wherein the first electrode layer is extended into the recess and electrically connected to the first type semiconductor layer; and

a second electrode layer, disposed on the reflective layer and the conductive contact layer, and electrically connected to the second type semiconductor layer through the conductive contact layer.

2. The light emitting diode structure as claimed in claim 1 , wherein the reflective layer is a metal layer or a distributed Bragg reflector.

3. The light emitting diode structure as claimed in claim 1 , wherein the edge portion of the substrate comprises a flat surface or a tilt surface or a combination thereof, and the first insulating layer substantially covers the entirety of the lateral surface of the semiconductor epitaxial layer and the edge portion of the substrate.

4. The light emitting diode structure as claimed in claim 1 , wherein the edge portion of the substrate comprises a flat surface or a tilt surface or a combination thereof.

5. The light emitting diode structure as claimed in claim 1 , further comprising:

a second insulating layer, disposed between the semiconductor epitaxial layer and the reflective layer, wherein the second insulating layer substantially covers the entirety of the lateral surface of the semiconductor epitaxial layer.

6. The light emitting diode structure as claimed in claim 1 , further comprising:

a barrier layer, disposed between the reflective layer and the first insulating layer.

7. The light emitting diode structure as claimed in claim 1 , further comprising:

an interconnecting layer, disposed in the recess and electrically connecting the first electrode layer and the first type semiconductor layer.

8. A light emitting diode structure, comprising:

a substrate;

a semiconductor epitaxial layer, having a lateral surface and at least one recess formed therein, being disposed on the substrate and exposing an edge portion of the substrate, wherein the semiconductor epitaxial layer comprises a first type semiconductor layer, a light emitting layer and a second type semiconductor layer disposed on the substrate in sequence, and the recess is surrounded by the second type semiconductor layer and the light emitting layer and exposes a portion of the first type semiconductor layer;

a first insulating layer, substantially covering an entirety of the lateral surface of the semiconductor epitaxial layer and exposing an upper portion of the second type semiconductor layer;

a reflective layer, disposed on the first insulating layer;

a second insulating layer, disposed on the reflective layer;

a first electrode layer, disposed on the second insulating layer, the reflective layer, the first insulating layer and the semiconductor epitaxial layer, wherein the first electrode layer is extended into the recess and electrically connected to the first type semiconductor layer; and

a second electrode layer, disposed on the reflective layer, the first insulating layer and the semiconductor epitaxial layer, and electrically connected to the second type semiconductor layer.

9. The light emitting diode structure as claimed in claim 8 , wherein the reflective layer is a metal layer or a distributed Bragg reflector.

10. The light emitting diode structure as claimed in claim 8 , wherein the edge portion of the substrate comprises a flat surface or a tilt surface or a combination thereof, and the first insulating layer substantially covers the edge portion of the substrate.

11. The light emitting diode structure as claimed in claim 8 , wherein the edge portion of the substrate comprises a flat surface or a tilt surface or a combination thereof, and the reflective layer substantially covers the entirety of the lateral surface of the semiconductor epitaxial layer and the edge portion of the substrate.

12. The light emitting diode structure as claimed in claim 8 , further comprising:

a conductive contact layer, disposed on the semiconductor epitaxial layer and electrically connecting the second type semiconductor layer and the second electrode layer.

13. The light emitting diode structure as claimed in claim 8 , further comprising:

a barrier layer, disposed between the reflective layer and the second insulating layer.

14. The light emitting diode structure as claimed in claim 8 , further comprising:

an interconnecting layer, disposed in the recess and electrically connecting the first electrode layer and the first type semiconductor layer.

15. A light emitting diode structure, comprising:

a semiconductor epitaxial layer, having a lateral surface and at least one recess formed therein, wherein the semiconductor epitaxial layer comprises a first type semiconductor layer, a light emitting layer and a second type semiconductor layer disposed on the substrate in sequence, and the recess is surrounded by the second type semiconductor layer and the light emitting layer and exposes a portion of the first type semiconductor layer;

a substrate, on which the semiconductor epitaxial layer is disposed and exposes an edge portion of the substrate, wherein the edge portion of the substrate comprises a flat surface or a tilt surface or a combination thereof;

a conductive contact layer, disposed on the semiconductor epitaxial layer;

a reflective layer, disposed on the conductive contact layer and substantially covering an entirety of the lateral surface of the semiconductor epitaxial layer and the edge portion of the substrate;

a first electrode layer, disposed on the semiconductor epitaxial layer, wherein the first electrode layer is extended into the recess and electrically connected the first type semiconductor layer;

a first insulating layer disposed between the first electrode layer and the semiconductor epitaxial layer; and

a second electrode layer, disposed on the semiconductor epitaxial layer, and electrically connected to the second type semiconductor layer through the conductive contact layer.

16. The light emitting diode structure as claimed in claim 15 , wherein the reflective layer is a metal layer or a distributed Bragg reflector.

17. The light emitting diode structure as claimed in claim 15 , wherein the first insulating layer substantially covers the entirety of the lateral surface of the semiconductor epitaxial layer.

18. The light emitting diode structure as claimed in claim 15 , further comprising:

a second insulating layer, disposed between the semiconductor epitaxial layer and the reflective layer, wherein the second insulating layer substantially covers the entirety of the lateral surface of the semiconductor epitaxial layer and the edge portion of the substrate.

19. The light emitting diode structure as claimed in claim 15 , further comprising:

a barrier layer, disposed between the reflective layer and the first insulating layer.

20. The light emitting diode structure as claimed in claim 15 , further comprising:

an interconnecting layer, disposed in the recess and electrically connecting the first electrode layer and the first type semiconductor layer.

Assignments (3)
ADDRESS CHANGE REGISTRATION FORM Recorded Dec 15, 2023
From: GENESIS PHOTONICS INC.
To: GENESIS PHOTONICS INC.
Reel/Frame 066044/0133 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2023
From: GENESIS PHOTONICS INC.
To: NICHIA CORPORATION
Reel/Frame 066044/0807 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2013
From: HUANG, YI-RU; LO, YU-YUN; WU, CHIH-LING; HUANG, JING-EN; TING, SHAO-YING
To: GENESIS PHOTONICS INC.
Reel/Frame 031169/0459 →