IP Library › Granted Patent US 772,181
Granted Patent S1
US 772,181 · App. 29/522,732 · Granted Nov 22, 2016

Light emitting diode package substrate

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Quick Facts
Patent No.
US 772,181
App. No.
29/522,732
Granted
Nov 22, 2016
Kind
S1
Claims (1)

The ornamental design for a light emitting diode package substrate, as shown and described.

Assignments (3)
ADDRESS CHANGE REGISTRATION FORM Recorded Dec 15, 2023
From: GENESIS PHOTONICS INC.
To: GENESIS PHOTONICS INC.
Reel/Frame 066044/0133 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2023
From: GENESIS PHOTONICS INC.
To: NICHIA CORPORATION
Reel/Frame 066044/0807 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 7, 2015
From: LEE, HAO-CHUNG; LIN, YU-FENG; ZHAN, XUN-XAIN
To: GENESIS PHOTONICS INC.
Reel/Frame 035343/0569 →