Light emitting diode package structure
View Patent ↗A LED package structure including a carrier substrate, a flip-chip LED and a molding compound is provided. The carrier substrate includes a main body and a patterned conductive layer embedded in the main body. The main body is composed of polymer material. The main body has a cavity, and a bottom surface of the cavity is aligned with an upper surface of the patterned conductive layer. A difference in coefficient of thermal expansion between the main body in a rubbery state and the patterned conductive layer is smaller than 30 ppm/° C. The flip-chip LED is disposed inside the cavity and electrically connected to the patterned conductive layer. The molding compound is disposed inside the cavity and encapsulates the flip-chip LED. A vertical distance between a top surface of the molding compound and the bottom surface of the cavity is smaller than or equal to a depth of the cavity.
1. A light emitting diode package structure, comprising:
a carrier substrate, comprising a main body and a patterned conductive layer embedded in the main body, the main body being composed of a polymer material, and the main body having a cavity, and a bottom surface of the cavity being aligned with an upper surface of the patterned conductive layer, wherein a difference in coefficient of thermal expansion between the main body in a rubbery state and the patterned conductive layer is smaller than 30 ppm/° C.;
a flip-chip light emitting diode, disposed inside the cavity of the carrier substrate, and straddling the patterned conductive layer; and
a molding compound, disposed inside the cavity of the carrier substrate, and encapsulating the flip-chip light emitting diode, wherein a vertical distance between a top surface of the molding compound and the bottom surface of the cavity is equal to a depth of the cavity.
2. The light emitting diode package structure as claimed in claim 1 , wherein the flip-chip light emitting diode and the patterned conductive layer are electrically connected through eutectic bonding.
3. The light emitting diode package structure as claimed in claim 1 , wherein the polymer material comprises epoxy resin or a siloxane compound.
4. The light emitting diode package structure as claimed in claim 1 , wherein a difference in coefficient of thermal expansion between the main body in the rubbery state and the main body in a glassy state is smaller than 35 ppm/° C.
5. The light emitting diode package structure as claimed in claim 1 , wherein a sidewall of the cavity surrounds the bottom surface, and the bottom surface and the sidewall include an included angle, wherein the included angle ranges between 95 degrees and 170 degrees.
6. The light emitting diode package structure as claimed in claim 1 , wherein a center point of the bottom surface and an edge of the bottom surface of the cavity are spaced by a straight-line distance, and the straight-line distance is greater than or equal to 1 cm and is smaller than or equal to 2 cm.
7. The light emitting diode package structure as claimed in claim 6 , wherein the top surface of the molding compound and the upper surface of the patterned conductive layer are spaced by a vertical height, and a ratio between the vertical height and the straight-line distance is between 0.15 and 0.25.
8. The light emitting diode package structure as claimed in claim 1 , wherein the top surface of the molding compound and an upper surface of the flip-chip light emitting diode are spaced by a vertical distance, and the vertical distance ranges between 0.05 cm and 0.3 cm.
9. The light emitting diode package structure as claimed in claim 1 , wherein the molding compound is doped with a fluorescent material, and the fluorescent material comprises a yellow fluorescent powder, a red fluorescent powder, a green fluorescent powder, a blue fluorescent powder or a yttrium aluminum garnet fluorescent powder, and a particle diameter of the fluorescent powder ranges between 3 μm and 50 μm.
10. The light emitting diode package structure as claimed in claim 9 , wherein a weight percentage concentration of the fluorescent material in the molding compound ranges between 20% and 40%.