IP Library Granted Patent US 9,780,255
Granted Patent B2
US 9,780,255 · App. 14/850,970 · Granted Oct 3, 2017

Nitride semiconductor structure and semiconductor light emitting device including the same

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Quick Facts
Patent No.
US 9,780,255
App. No.
14/850,970
Granted
Oct 3, 2017
Kind
B2
Abstract

A nitride semiconductor structure and a semiconductor light emitting device are revealed. The semiconductor light emitting device includes a substrate disposed with a first type doped semiconductor layer and a second type doped semiconductor layer. A light emitting layer is disposed between the first type doped semiconductor layer and the second type doped semiconductor layer. The second type doped semiconductor layer is doped with a second type dopant at a concentration larger than 5×10 19 cm −3 while a thickness of the second type doped semiconductor layer is smaller than 30 nm. Thereby the semiconductor light emitting device provides a better light emitting efficiency.

Claims (36)

1. A nitride semiconductor structure comprising:

a first type doped semiconductor layer;

a light emitting layer;

a gallium nitride based hole supply layer, containing aluminum and indium;

a carrier blocking layer; and

a second type doped semiconductor layer, wherein the light emitting layer is disposed between the first type doped semiconductor layer and the hole supply layer, the hole supply layer is disposed between the light emitting layer and the carrier blocking layer, the carrier blocking layer is disposed between the second type doped semiconductor layer and the hole supply layer, and the hole supply layer is doped with a quadrivalent element.

2. The nitride semiconductor structure as claimed in claim 1 , wherein the light emitting layer has a multiple quantum well (MQW) structure, and a band gap of the hole supply layer is larger than a band gap of a well layer of the MQW structure.

3. The nitride semiconductor structure as claimed in claim 2 , wherein the MQW structure comprises a plurality of gallium nitride based barrier layers, which contain aluminum and indium, and a plurality of gallium nitride based well layers, which contain indium.

4. The nitride semiconductor structure as claimed in claim 1 , wherein the second type doped semiconductor layer is doped with the concentration larger than 5×10 19 cm −3 and a thickness of the second type doped semiconductor layer is smaller than 30 nm.

5. The nitride semiconductor structure as claimed in claim 1 , wherein the quadrivalent element is carbon.

6. The nitride semiconductor structure as claimed in claim 1 , wherein the hole supply layer is doped with the quadrivalent element at a concentration ranging from 10 17 cm −3 to 10 20 cm −3 .

7. The nitride semiconductor structure as claimed in claim 1 , wherein the hole supply layer is doped with a second typed dopant at a concentration larger than 10 18 cm −3 .

8. A nitride semiconductor structure comprising:

a first type doped semiconductor layer;

a light emitting layer, comprising a multiple quantum well structure (MQW);

a gallium nitride based hole supply layer, containing aluminum and indium;

a carrier blocking layer; and

a second type doped semiconductor layer, wherein the light emitting layer is disposed between the first type doped semiconductor layer and the hole supply layer, the hole supply layer is disposed between the light emitting layer and the carrier blocking layer, the carrier blocking layer is disposed between the second type doped semiconductor layer and the hole supply layer, and a band gap of the hole supply layer is larger than that of a gallium nitride based well layer of the MQW structure.

9. The nitride semiconductor structure as claimed in claim 8 , wherein the MQW structure comprises a plurality of gallium nitride based barrier layers, which contain aluminum and indium, and the gallium nitride based well layers contain indium.

10. The nitride semiconductor structure as claimed in claim 8 , wherein the second type doped semiconductor layer is doped with the concentration larger than 5×10 19 cm −3 and a thickness of the second type doped semiconductor layer is smaller than 30 nm.

11. The nitride semiconductor structure as claimed in claim 8 , wherein the hole supply layer is doped with a Group IV-A element.

12. The nitride semiconductor structure as claimed in claim 11 , wherein the hole supply layer is doped with carbon at a concentration ranging from 10 17 cm −3 to 10 20 cm −3 .

13. The nitride semiconductor structure as claimed in claim 8 , wherein the hole supply layer is doped with a second typed dopant at a concentration larger than 10 18 cm −3 .

14. A nitride semiconductor structure comprising:

a first type doped semiconductor layer;

a gallium nitride based first type carrier blocking layer, containing aluminum;

a light emitting layer, comprising a multiple quantum well structure (MQW);

a gallium nitride based hole supply layer, containing aluminum and indium;

a gallium nitride based second type carrier blocking layer, containing aluminum;

a second type doped semiconductor layer, wherein the first type carrier blocking layer is disposed between the light emitting layer and the first type doped semiconductor layer, and the hole supple layer is disposed between the light emitting layer and the second type carrier blocking layer, and the second type carrier blocking layer is disposed between the second type doped semiconductor layer and the hole supply layer.

15. The nitride semiconductor structure as claimed in claim 14 , wherein the light emitting layer has a multiple quantum well (MQW) structure, and a band gap of the hole supply layer is larger than a band gap of a gallium nitride based well layer of the MQW structure.

16. The nitride semiconductor structure as claimed in claim 14 , wherein the MQW structure comprises a plurality of gallium nitride based barrier layers, which contain aluminum and indium, and a plurality of gallium nitride based well layers, which contain indium.

17. The nitride semiconductor structure as claimed in claim 14 , wherein the second type doped semiconductor layer is doped with the concentration larger than 5×10 19 cm −3 and a thickness of the second type doped semiconductor layer is smaller than 30 nm.

18. The nitride semiconductor structure as claimed in claim 14 , wherein the hole supply layer is doped with a Group IV-A element.

19. The nitride semiconductor structure as claimed in claim 18 , wherein the hole supply layer is doped with carbon at a concentration ranging from 10 17 cm −3 to 10 20 cm −3 .

20. The nitride semiconductor structure as claimed in claim 14 , wherein the hole supply layer is doped with a second typed dopant at a concentration larger than 10 18 cm −3 .

Assignments (2)
ADDRESS CHANGE REGISTRATION FORM Recorded Dec 15, 2023
From: GENESIS PHOTONICS INC.
To: GENESIS PHOTONICS INC.
Reel/Frame 066044/0133 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2023
From: GENESIS PHOTONICS INC.
To: NICHIA CORPORATION
Reel/Frame 066044/0807 →