Light emitting module
A light emitting module including a light emitting device package structure and a heat dissipation structure is provided. The light emitting device package structure includes light emitting devices, a patterned reflective element and a patterned conductive layer. The patterned reflective element is disposed around side surfaces of the light emitting devices and exposes a first bottom surface of a first pad and a second bottom surface of a second pad. The patterned conductive layer is disposed on the first bottom surface of the first pad and the second bottom surface of the second pad. The light emitting devices are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection through the patterned conductive layer. The heat dissipation structure is disposed below the light emitting device package structure and includes a heat dissipation unit and a patterned circuit layer disposed on the heat dissipation unit.
1. A light emitting device, comprising:
a carrier substrate having a patterned circuit layer formed thereon;
at least one light emitting unit having a first pad and a second pad located on a lower surface thereof, and the light emitting unit disposed on the carrier substrate wherein the first pad and the second pad are electrically connected to the patterned circuit layer;
a reflective element disposed on the carrier substrate and encapsulating the light emitting unit and exposing the first pad and the second pad and an upper surface of the light emitting unit, wherein an upper surface of the reflective element is flush with the upper surface of the light emitting unit, and the reflective element directly contacts the entirety of a side surface of the light emitting unit and has an inclined reflective surface toward the light emitting unit; and
a molding layer disposed on the upper surface of the light emitting unit and the upper surface of the reflective element.
2. The light emitting device as claimed in claim 1 , wherein the molding layer comprises a flat top surface.
3. The light emitting device as claimed in claim 1 , wherein the molding layer comprises a wavelength conversion layer or a light transmissive layer without wavelength conversion function or a light transmissive layer for light scattering.
4. The light emitting device as claimed in claim 1 , wherein the light emitting device has a flat lateral surface comprising a wavelength conversion layer and the reflective element.
5. The light emitting device as claimed in claim 1 , further comprising an extensive conductive layer disposed between the first pad and the second pad of the light emitting unit and the patterned circuit layer.
6. The light emitting device as claimed in claim 5 , wherein the extensive conductive layer comprising a first portion and a second portion respectively coupled to the first pad and the second pad, along a bottom surface of reflective element.
7. A light emitting device, comprising:
at least one light emitting unit having a first pad and a second pad located on a lower surface thereof;
a reflective element encapsulating the light emitting unit and exposing the first pad and the second pad and an upper surface of the light emitting unit, wherein an upper surface of the reflective element is flush with the upper surface of the light emitting unit, and the reflective element directly contacts the entirety of a side surface of the light emitting unit and has an inclined reflective surface toward the light emitting unit; and
a molding layer disposed on the upper surface of the light emitting unit and the upper surface of the reflective element, wherein the light emitting device has a flat lateral surface comprising the molding layer and the reflective element.
8. The light emitting device as claimed in claim 7 , further comprising an extensive conductive layer comprising a first portion and a second portion coupled to the first pad and the second pads respectively.
9. The light emitting device as claimed in claim 7 , wherein the molding layer comprises a flat top surface.
10. The light emitting device as claimed in claim 7 , wherein the molding layer comprises a wavelength conversion layer or a light transmissive layer without wavelength conversion function or a light transmissive layer for light scattering.
11. The light emitting device as claimed in claim 8 , wherein the extensive conductive layer is disposed along a bottom surface of reflective element.