Light emitting diode structure and manufacturing method thereof
View Patent ↗A light emitting diode (LED) structure including a substrate, a polymer layer, and an epitaxy layer is provided. The polymer layer is disposed on the substrate, wherein the polymer layer has a chemical formula of: wherein M represents sodium, zinc, magnesium, or potassium. The epitaxy layer is disposed on the polymer layer. The epitaxy layer is bonded to the substrate via the polymer layer.
1. A light emitting diode structure, comprising:
a substrate;
a polymer layer disposed on the substrate, wherein the polymer layer has a chemical formula of:
wherein M represents sodium, zinc, magnesium, or potassium; and
an epitaxy layer disposed on the polymer layer, wherein the epitaxy layer is bonded to the substrate via the polymer layer.
2. The light emitting diode structure as recited in claim 1 , wherein a molecular weight of the polymer layer is between 10,000 g/mol and 120,000 g/mol.
3. The light emitting diode structure as recited in claim 1 , wherein in the chemical formula, a is equal to 250 to 2,500 and b is equal to 10 to 300.
4. The light emitting diode structure as recited in claim 1 , wherein a value of a/b is between 12 and 20.
5. The light emitting diode structure as recited in claim 1 , wherein the substrate comprises a sapphire substrate.
6. The light emitting diode structure as recited in claim 1 , wherein the epitaxy layer comprises a first-type semiconductor layer, a light emitting layer, and a second-type semiconductor layer, and the second-type semiconductor layer is adjacent to the polymer layer and the light emitting layer is disposed between the first-type semiconductor layer and the second-type semiconductor layer.
7. A manufacturing method of a light emitting diode structure, comprising:
forming an epitaxy layer on an epitaxy substrate;
providing a transfer-substrate;
providing a polymer layer between the epitaxy layer of the epitaxy substrate and the transfer-substrate, wherein the polymer layer has a chemical formula of:
wherein M represents sodium, zinc, magnesium, or potassium;
performing a bonding process on the epitaxy layer and the transfer-substrate so that the epitaxy layer is bonded to the transfer-substrate via the polymer layer; and
removing the epitaxy substrate to expose the epitaxy layer.
8. The manufacturing method of the light emitting diode structure as recited in claim 7 , wherein a molecular weight of the polymer layer is between 10,000 g/mol and 120,000 g/mol.
9. The manufacturing method of the light emitting diode structure as recited in claim 7 , wherein in the chemical formula, a is equal to 250 to 2,500 and b is equal to 10 to 300.
10. The manufacturing method of the light emitting diode structure as recited in claim 7 , wherein a pressure applied in the bonding process is between 400 N/cm 2 and 4,500 N/cm 2 .
11. The manufacturing method of the light emitting diode structure as recited in claim 7 , wherein a temperature of the bonding process is between 90° C. and 200° C.
12. The manufacturing method of the light emitting diode structure as recited in claim 7 , wherein a time of the bonding process is between 1 minute and 360 minutes.
13. The manufacturing method of the light emitting diode structure as recited in claim 7 , wherein the steps of forming the epitaxy layer comprise, in order, forming a first-type semiconductor layer, a light emitting layer, and a second-type semiconductor layer on the epitaxy substrate.