IP Library Granted Patent US 10,388,838
Granted Patent B2
US 10,388,838 · App. 15/787,811 · Granted Aug 20, 2019

Light-emitting device and manufacturing method thereof

Inventors: Chin-Hua Hung (Tainan, TW); Cheng-Wei Hung (Tainan, TW); Yu-Feng Lin (Tainan, TW); Cheng-Chuan Chen (Tainan, TW)
Assignee: GENESIS PHOTONICS INC.
H01L33/56H01L25/0753H01L33/0075H01L33/26H01L33/387H01L33/642H01L33/507H01L33/62
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Quick Facts
Patent No.
US 10,388,838
App. No.
15/787,811
Granted
Aug 20, 2019
Kind
B2
Abstract

A light-emitting device includes a substrate, a light-emitting component, a translucent layer, an adhesive layer, a reflective layer and translucent encapsulant. The light-emitting component is disposed on the substrate. The adhesive layer is formed between the light-emitting component and the translucent layer. The reflective layer is formed above the substrate and covering a lateral surface of the light-emitting component, a lateral surface of the adhesive layer and a lateral surface of the translucent layer. The translucent encapsulant is formed on the substrate and encapsulating the light-emitting component, the translucent layer and the reflective layer.

Claims (17)

1. A light-emitting device, comprises:

a substrate;

a light-emitting component coupled to the substrate;

a wavelength conversion layer comprising a high-density phosphor layer and a low-density phosphor layer;

an adhesive layer adhering the wavelength conversion layer directly to an upper surface of the light-emitting component and covering a portion of a lateral surface of the light-emitting component, wherein the high-density phosphor layer faces to the upper surface of the light-emitting component;

a reflective layer formed above the substrate and covering the light-emitting component, the adhesive layer and the wavelength conversion layer to expose an upper surface of the wavelength conversion layer, wherein a curved surface of the reflective layer is inclined to the lateral surface of the light-emitting component and reflects a light emitted from the light-emitting component back into the high-density phosphor layer; and

a dome-shaped lens layer formed on the substrate and encapsulating the light-emitting component, the wavelength conversion layer, the adhesive layer and the reflective layer.

2. The light-emitting device according to claim 1 , wherein the dome-shaped lens layer encapsulates a lateral surface of an electrode of the light-emitting component.

3. The light-emitting device according to claim 1 , wherein the dome-shaped lens layer is spaced from the substrate.

4. The light-emitting device according to claim 1 , wherein the light-emitting device has a flat lateral surface comprising the dome-shaped lens layer and the substrate.

5. The light-emitting device according to claim 3 , wherein the reflective layer has a lower portion disposed between the dome-shaped lens and the substrate.

6. The light-emitting device according to claim 1 , wherein the reflective layer is spaced from the substrate.

7. The light-emitting device according to claim 5 , wherein the light-emitting device has a flat lateral surface comprising the dome-shaped lens layer, the reflective layer and the substrate.

8. The light-emitting device according to claim 6 , wherein the light-emitting component has a body and electrodes disposed on a bottom surface thereof, and a bottom surface of the reflective layer is not lower than the bottom surface of the body of the light-emitting component.

9. The light-emitting device according to claim 1 , wherein the dome-shaped lens layer comprises resin containing phosphor particles.

10. The light-emitting device according to claim 1 , wherein a thickness of the low-density phosphor layer is larger than a thickness of the high-density phosphor layer.

11. The light-emitting device according to claim 1 , wherein an upper surface of the reflective layer and the upper surface of the wavelength conversion layer are coplanar.

Assignments (3)
ADDRESS CHANGE REGISTRATION FORM Recorded Dec 15, 2023
From: GENESIS PHOTONICS INC.
To: GENESIS PHOTONICS INC.
Reel/Frame 066044/0133 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2023
From: GENESIS PHOTONICS INC.
To: NICHIA CORPORATION
Reel/Frame 066044/0807 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2017
From: HUNG, CHIN-HUA; HUNG, CHENG-WEI; LIN, YU-FENG; CHEN, CHENG-CHUAN
To: GENESIS PHOTONICS INC.
Reel/Frame 043900/0752 →
Continuity (2)
Provisional Application 62410376 · Oct 19, 2016
Related Publication 20180138378A1 · May 17, 2018
Cited By (8)
US 1,060,278 US 1,102,396 US 1,104,971 US 12,294,042 US 12,355,013 US 12,364,074 US 12,635,312 US 12,642,129