Semiconductor device and method of assembling same
View Patent ↗A semiconductor device has a die support and external leads formed integrally from a single sheet of electrically conductive material. A die mounting substrate is mounted on the die support, with bonding pads coupled to respective external connection pads on an external connector side of the substrate. A die is attached to the die mounting substrate with die connection pads. Bond wires selectively electrically couple the die connection pads to the external leads and the bonding pads and electrically conductive external protrusions are mounted to the external connection pads. An encapsulant covers the die and bond wires. The external protrusions are located at a central region of a surface mounting side of the package and the external leads project outwardly from locations near the die support towards peripheral edges of the package.
1. A semiconductor device, comprising:
a die support and external leads formed integrally from a single sheet of electrically conductive material;
a die mounting substrate having a die mounting side and an opposite external connector side mounted on the die support, wherein the die mounting side has bonding pads coupled to respective external connection pads on the external connector side of the substrate;
a semiconductor die having a die support mounting surface attached to the die mounting side of the die mounting substrate, and an opposite die connection pad surface with associated die connection pads, wherein the die connection pads are circuit nodes of the semiconductor die;
bond wires selectively electrically coupling the die connection pads to the external leads and the bonding pads;
electrically conductive external protrusions attached to the external connection pads; and
an encapsulating material at least partially encapsulating the die and the bond wires,
wherein the external protrusions are located at a central region of a surface mounting side of the device, and the external leads project outwardly from the surface mounting side from locations proximal to the die support towards peripheral edges of the device.
2. The semiconductor device of claim 1 , wherein the die support includes two spaced parallel members at least partially enclosing the central region.
3. The semiconductor device of claim 2 , wherein the die mounting substrate spans the two spaced parallel members.
4. The semiconductor device of claim 1 , wherein the die support is a frame enclosing the central region.
5. The semiconductor device of claim 4 , wherein the frame is rectangular.
6. The semiconductor device of claim 1 , wherein the external protrusions form a grid array.
7. The semiconductor device of claim 1 , wherein the external protrusions are balls forming a ball grid array.
8. The semiconductor device of claim 1 , wherein each of the external leads has a peripheral end flush with a one of the peripheral edges.
9. The semiconductor device of claim 8 , wherein each of the peripheral edges has a peripheral end with at least one of the external leads flush therewith.
10. The semiconductor device of claim 1 , wherein channels are formed in the surface mounting side of the encapsulating material between the die support and the external leads.
11. The semiconductor device of claim 10 , wherein each of the channels is parallel to a peripheral edge.
12. The semiconductor device of claim 1 , wherein the die mounting substrate has thermally conductive runners thermally coupling the semiconductor die to the die support.
13. A method for assembling a semiconductor device, the method comprising:
providing a die support and external leads formed integrally from a single sheet of electrically conductive material;
mounting a die mounting substrate on the die support, the die mounting substrate having a die mounting side and an opposite external connector side mounted on the die support, wherein the die mounting side has bonding pads coupled to respective external connection pads on the external connector side of the substrate;
mounting a semiconductor die to the die mounting substrate, the semiconductor die having a die support mounting surface attached to the die mounting side of the die mounting substrate, and an opposite die connection pad surface with associated die connection pads, wherein the die connection pads are circuit nodes of the semiconductor die;
selectively electrically coupling the die connection pads to the external leads and the bonding pads;
attaching electrically conductive external protrusions to the external connection pads; and
encapsulating at least part of the die with an encapsulating material to form the semiconductor device,
wherein the external protrusions are located at a central region of a surface mounting side of the device and the external leads project outwardly on the surface mounting side of the device from locations proximal to the die support towards peripheral edges of the device.
14. The method for assembling a semiconductor device of claim 13 , further including electrically isolating the die support from the leads.
15. The method for assembling a semiconductor device of claim 14 , wherein the electrically isolating the die support from the leads includes cutting channels therebetween.
16. The method for assembling a semiconductor device of claim 15 , wherein the channels are cut into the surface mounting side of the encapsulating material.
17. The method for assembling a semiconductor device of claim 13 , wherein the die support includes two spaced parallel members at least partially enclosing the central region.
18. The method for assembling a semiconductor device of claim 17 , wherein the die mounting substrate spans the two spaced parallel members.
19. The method for assembling a semiconductor device of claim 13 , wherein the external protrusions form a grid array.
20. The method for assembling a semiconductor device of claim 13 , wherein each of the external leads has a peripheral end flush with one of the peripheral edges.