Fluid cooled semiconductor die package
View Patent ↗A fluid cooled semiconductor die package includes a package support substrate with a die mounting surface and an opposite package mounting surface. The package support substrate has external connector solder deposits on respective external connector pads of the package mounting surface, and a package fluid inlet duct and a package fluid outlet duct each providing fluid communication between the die mounting surface and package mounting surface. A semiconductor die is mounted on the die mounting surface. The die has external terminals electrically connected to the external connector pads. An inlet solder deposit is soldered to an inlet pad of the package mounting surface. The inlet pad surrounds an entrance of the fluid inlet duct. An outlet solder deposit is soldered to an outlet pad of the package mounting surface. The outlet pad surrounds an exit of the package fluid inlet duct.
1. A fluid cooled semiconductor die package, comprising:
a package support substrate with a die mounting surface and an opposite package mounting surface, the package support substrate having external connector solder deposits on respective external connector pads of the package mounting surface, wherein the package support substrate has at least one package fluid inlet duct and at least one package fluid outlet duct each providing fluid communication between the die mounting surface and the package mounting surface;
a semiconductor die mounted on the die mounting surface of the package support substrate, the semiconductor die having external terminals selectively electrically connected to the external connector pads;
an inlet solder deposit soldered to an inlet pad of the package mounting surface, wherein the inlet pad surrounds an entrance of the package fluid inlet duct; and
an outlet solder deposit soldered to an outlet pad of the package mounting surface, wherein the outlet pad surrounds an exit of the package fluid inlet duct, wherein each of the external connector solder deposits is formed from a single solder ball, and the inlet solder deposit is formed from at least one solder ball that is the same size as the single solder ball.
2. The fluid cooled semiconductor die package of claim 1 , further comprising a lid mounted to the die mounting surface, wherein the lid has at least one heat transfer chamber therein that is hermetically coupled to the package fluid inlet duct and the package fluid outlet duct.
3. The fluid cooled semiconductor die package of claim 2 , wherein the heat transfer chamber is formed from a surface of the semiconductor die and a wall of the lid.
4. The fluid cooled semiconductor die package of claim 3 , wherein a wall of the heat transfer chamber abuts a surface of the semiconductor die.
5. The fluid cooled semiconductor die package of claim 2 , wherein the lid has at least one lid inlet passage in fluid communication, through the heat transfer chamber, with at least one lid outlet passage, the lid inlet passage having a passage entrance hermetically coupled to the package fluid inlet duct and the lid outlet passage having a passage exit hermetically coupled to the package fluid outlet duct.
6. The fluid cooled semiconductor die package of claim 1 , wherein the inlet pad is a metal-based annulus.
7. The fluid cooled semiconductor die package of claim 6 , further including an annular inlet pad in the die mounting surface.
8. The fluid cooled semiconductor die package of claim 7 , further including a metal based deposit on an inner surface of the package fluid inlet duct, the metal based deposit forming a tube coupling the inlet pad of the package mounting surface to the annular inlet pad.
9. The fluid cooled semiconductor die package of claim 6 , wherein the inlet solder deposit is a solder globule that covers the entrance to the package fluid inlet duct.
10. The fluid cooled semiconductor die package of claim 1 , wherein the external connector solder deposits form a ball grid array external connector arrangement.
11. A fluid cooled circuit board system, comprising:
a circuit board with mounting pads thereon, the circuit board having a board inlet duct and a board outlet duct;
a package support substrate with a die mounting surface and an opposite package mounting surface, the package support substrate having external connector solder deposits coupling between respective external connector pads of the package mounting surface and the mounting pads of the circuit board, wherein the package support substrate has at least one package fluid inlet duct and at least one package fluid outlet duct each providing fluid communication between the die mounting surface and package mounting surface;
a semiconductor die mounted on the die mounting surface of the package support substrate, the semiconductor die having external terminals selectively electrically connected to the external connector pads;
an inlet solder deposit coupling an inlet pad of the package mounting surface to an inlet pad of the circuit board, wherein the inlet pad of the package mounting surface surrounds an entrance of the package fluid inlet duct and the inlet pad of the circuit board surrounds an exit of the board inlet duct, and the inlet solder deposit has an inlet deposit aperture therein that provides a hermetic coupling between the board inlet duct and package fluid inlet duct; and
an outlet solder deposit coupling an outlet pad of the package mounting surface to an outlet pad of the circuit board, wherein the outlet pad of the package mounting surface surrounds an exit of the package fluid outlet duct and an outlet pad of the circuit board surrounds an entrance of the board outlet duct, and the outlet solder deposit has an outlet deposit aperture therein that provides a hermetic coupling between the board outlet duct and package fluid outlet duct,
wherein the circuit board is mounted on an additional substrate with an additional semiconductor die mounted thereon, the additional substrate being mounted on an additional circuit board that has an additional board inlet fluid duct and an additional board fluid outlet duct, the additional substrate having at least one intermediate inlet fluid duct with an associated solder deposit with an aperture therein that provides a hermetic coupling between the intermediate inlet fluid duct and the additional board inlet fluid duct.
12. The fluid cooled circuit board system of claim 11 , further comprising is a lid mounted to the die mounting surface, the lid having at least one heat transfer chamber therein that is hermetically coupled to the package fluid inlet duct and package fluid outlet duct.
13. The fluid cooled circuit board system of claim 12 , wherein the lid has at least one lid inlet passage in fluid communication, through the heat transfer chamber, with at least one lid outlet passage, the lid inlet passage having an passage entrance hermetically coupled to the package fluid inlet duct and the lid outlet passage having an passage exit hermetically coupled to the package fluid outlet duct.
14. The fluid cooled circuit board system of claim 11 , further comprising a coupling solder deposit with a coupling aperture therein that provides a hermetic coupling between the intermediate inlet fluid duct and the board inlet duct of the circuit board.
15. A method for assembling a fluid cooled semiconductor die package, the method including:
providing a package support substrate with a die mounting surface with external connector pads and an opposite package mounting surface, the package support substrate having at least one package fluid inlet duct and at least one package fluid outlet duct each providing fluid communication between the die mounting surface and package mounting surface;
mounting a semiconductor die on the die mounting surface, the semiconductor die having external terminals that are selectively electrically connected to the external connector pads; and
soldering external connector solder deposits to the external connector pads, an inlet solder deposit to an inlet pad that surrounds an entrance of the package fluid inlet duct, and an outlet solder deposit to an outlet pad that surrounds an exit of the package fluid inlet duct, wherein each of the external connector solder deposits is formed from a single solder ball, and the inlet solder deposit is formed from at least one solder ball that is the same size as the single solder ball.
16. The method of claim 15 , further including mounting a lid to the die mounting surface, the lid having at least one heat transfer chamber therein that is hermetically coupled to the package fluid inlet duct and the package fluid outlet duct.
17. The method of claim 15 , wherein the inlet solder deposit is a solder globule that covers the entrance to the package fluid inlet duct.
18. The method of claim 15 , wherein the external connector solder deposits form a ball grid array external connector arrangement.