Single field zero mask for increased alignment accuracy in field stitching
View Patent ↗A method for stitching a first field mask to a second field mask on a wafer includes providing a photomask with a first set of targets and a second set of targets, printing images of the first set of targets and the second set of targets onto the wafer where the photomask is applied to the wafer having no previous alignment marks formed thereon for the photomask to align to. A first set of alignment marks is formed from the first set of targets and a second set of alignment marks is formed from the second set of targets. The method includes aligning a first field mask to the first set of alignment marks and aligning a second field mask to the second set of alignment marks. The images of the first field mask and the second field mask are thereby stitched together on the wafer.
1. A method for stitching a first field mask to a second field mask on a wafer, comprising:
providing a photomask with a first set of targets and a second set of targets, the first and second sets of targets being formed on opposite sides of the photomask;
printing images of the first set of targets and the second set of targets of the photomask onto the wafer coated with a photoresist layer, the photomask being applied to the wafer having no previous alignment marks formed thereon for the photomask to align to;
forming a first set of alignment marks from the first set of targets and forming a second set of alignment marks from the second set of targets;
forming a second photoresist layer on the wafer;
aligning a first field mask to the first set of alignment marks;
exposing the second photoresist layer to the first field mask to print an image of the first field mask onto the second photoresist layer;
aligning a second field mask to the second set of alignment marks; and
exposing the second photoresist layer to the second field mask to print an image of the second field mask onto the second photoresist layer, the images of the first field mask and the second field mask thereby being stitched together in the second photoresist layer with an overlap area.
2. The method of claim 1 , further comprising:
printing images of the first set of targets and the second set of targets of the photomask across the wafer by stepping the wafer from field to field.
3. The method of claim 1 , further comprising:
stepping the wafer to a next field; and
repeating aligning the first field mask, exposing the second photoresist layer, and stepping the wafer until the image of the first field mask is printed across the wafer.
4. The method of claim 1 , further comprising:
stepping the wafer to a next field; and
repeating aligning the second field mask, exposing the second photoresist layer, and stepping the wafer until the image of the second field mask is printed across the wafer.
5. The method of claim 1 , wherein the first set of targets and the second set of targets have the same shape.
6. The method of claim 1 , wherein the first set of targets and the second set of targets have different shapes.
7. The method of claim 1 , wherein the first set of targets and the second set of targets have a shape selected from one of a cross, a diamond, or a chevron.
8. The method of claim 1 , wherein the first set of targets has a first number of targets and the second set of targets has a second number of targets, the first number is the same as the second number.
9. The method of claim 1 , wherein the first set of targets has a first number of targets and the second set of targets has a second number of targets, the first number is different from the second number.
10. The method of claim 1 , wherein the first and second field masks have a field size no greater than a stepper field size and the first and second field masks stitched together to form an area greater than the stepper field size.