IP Library Granted Patent US 8,778,742
Granted Patent B1
US 8,778,742 · App. 13/871,411 · Granted Jul 15, 2014

Methods and systems for gate dimension control in multi-gate structures for semiconductor devices

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Quick Facts
Patent No.
US 8,778,742
App. No.
13/871,411
Granted
Jul 15, 2014
Kind
B1
Abstract

Methods and systems are disclosed for gate dimension control in multi-gate structures for integrated circuit devices. Processing steps for formation of one or more subsequent gate structures are adjusted based upon dimensions determined for one or more previously formed gate structures. In this way, one or more features of the resulting multi-gate structures can be controlled with greater accuracy, and variations between a plurality of multi-gate structures can be reduced. Example multi-gate features and/or dimensions that can be controlled include overall gate length, overlap of gate structures, and/or any other desired features and/or dimensions of the multi-gate structures. Example multi-gate structures include multi-gate NVM (non-volatile memory) cells for NVM systems, such as for example, split-gate NVM cells having select gates (SGs) and control gates (CGs).

Claims (18)

1. A method for making an integrated circuit device including a plurality of multi-gate structures, comprising:

forming first gates for a plurality of multi-gate structures for an integrated circuit device, each multi-gate structure to have an overall gate length determined at least in part by a location for an outside edge of the first gate and by a location for an outside edge of a second gate for the multi-gate structure;

determining a location for the outside edge of each of the first gates;

adjusting processing parameters to adjust locations for the outside edges of the second gates based upon the outside edge locations of the first gates and based upon a desired overall gate length for the multi-gate structures; and

forming the second gates using the adjusted processing parameters.

2. The method of claim 1 , wherein at least one hundred or more multi-gate structures are formed, and wherein the overall gate lengths for the plurality of multi-gate structures vary by 10 percent or less.

3. The method of claim 2 , wherein gate lengths for the first gates vary by more than 10 percent.

4. The method of claim 1 , wherein the multi-gate structures comprise multi-gate structures for multi-gate non-volatile memory (NVM) cells.

5. The method of claim 4 , wherein the multi-gate NVM cells comprise split-gate NVM cells, and wherein each of the multi-gate structures comprises a select gate and a control gate.

6. The method of claim 5 , wherein the desired overall gate length comprises a combined gate length for the select gate and the control gate without including any gate overlap.

7. The method of claim 5 , wherein the first gates comprise the control gates for the split-gate NVM cells, and wherein the second gates comprise the select gates for the split-gate NVM cells.

8. The method of claim 5 , wherein the first gates comprise select gates for the split-gate NVM cells, and wherein the second gates comprise control gates for the split-gate NVM cells.

9. The method of claim 8 , wherein the determining step further comprises determining a location for an inside edge of each of the select gates, and wherein the adjusting step further comprises adjusting processing parameters to adjust locations for inside edges of the control gates based upon the inside edge locations for the select gates and based upon a desired overlap length for the inside edges of the control gates over the inside edges of the select gates.

10. The method of claim 5 , further comprising forming a charge storage layer between the select gates and the control gates for the split-gate NVM cells.

11. The method of claim 1 , wherein the adjusting step comprises adjusting processing parameters for a photoresist layer, and wherein the forming the second gates step comprises forming a patterned photoresist layer using the adjusted processing parameters for the photoresist layer, the patterned photoresist layer determining the locations for the outside edges of the second gates.

12. The method of claim 11 , wherein the forming the second gates step further comprises one or more etch processing steps.

13. The method of claim 1 , wherein the multi-gate structures comprise one or more additional gates in addition to the first gates and the second gates.

14. The method of claim 1 , wherein the determining step comprises using an overlay key to determine the outside edge locations for the first gates.

Assignments (21)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
MERGER Recorded Jan 3, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041144/0363 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
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SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
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To: MORGAN STANLEY SENIOR FUNDING, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0804 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0844 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Sep 20, 2013
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SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 26, 2013
From: KANG, SUNG-TAEG
To: FREESCALE SEMICONDUCTOR, INC.
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