IP Library Granted Patent US 8,953,047
Granted Patent B2
US 8,953,047 · App. 13/872,665 · Granted Feb 10, 2015

Imaging systems with signal chain verification circuitry

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Quick Facts
Patent No.
US 8,953,047
App. No.
13/872,665
Granted
Feb 10, 2015
Kind
B2
Abstract

An imaging system may include an array of image pixels and verification circuitry. The verification circuitry may inject a test voltage into the pixel signal chain of a test pixel. The test voltage may be output on a column line associated with the column of pixels in which the test pixel is located. The test signal may be provided to a column ADC circuit for conversion from an analog test signal to a digital test signal. Verification circuitry may compare the digital output test signal with a predetermined reference signal to determine whether the imaging system is functioning properly (e.g., to determine whether column ADC circuits or other circuit elements in the pixel signal chain are functioning properly). If the output test signals do not match the expected output signals, the imaging system may be disabled and/or a warning signal may be presented to a user of the system.

Claims (26)

1. An image sensor, comprising:

an array of image pixels having a plurality of light-receiving image pixels that generate image pixel signals and a plurality of dummy test pixels that do not gather image data, wherein each dummy test pixel comprises a source follower transistor;

a digital-to-analog converter circuit configured to apply a test signal to the source follower transistor of each dummy test pixel; and

a plurality of column readout lines configured to convey the image pixel signals from the image pixels and test signals from the dummy test pixels.

2. The image sensor defined in claim 1 further comprising verification circuitry configured to receive the test signals and to compare each test signal with a reference signal.

3. The image sensor defined in claim 1 further comprising a plurality of analog-to-digital converter circuits, wherein each analog-to-digital converter circuit is coupled to a respective one of the column readout lines.

4. The image sensor defined in claim 3 further comprising column decoder circuitry coupled between the source follower transistors and the analog-to-digital converter circuits, wherein the column decoder circuitry is configured to connect each column line to a respective one of the source follower transistors.

5. The image sensor defined in claim 1 wherein the digital-to-analog converter circuit comprises an adjustable resistor chain.

6. The image sensor defined in claim 1 wherein the light-receiving image pixels are arranged in rows and columns and wherein the dummy test pixels are arranged in a row adjacent to the light-receiving image pixels.

7. The image sensor defined in claim 1 further comprising a buffer coupled between the digital-to-analog converter circuit and the plurality of dummy test pixels.

8. A system, comprising:

a central processing unit;

memory;

input-output circuitry; and

an imaging device, wherein the imaging device comprises:

an array of image pixels arranged in pixel rows and pixel columns and having a plurality of light-receiving image pixels and a plurality of test pixels, wherein each test pixel comprises a source follower transistor,

pixel row control circuitry coupled to each pixel row of the array via a respective row control line,

a digital-to-analog converter circuit that is separate from the pixel row control circuitry and that is configured to apply a test signal to the source follower transistor of each test pixel,

a plurality of voltage supply lines, wherein each voltage supply line of the plurality of voltage supply lines is coupled to a respective pixel column of the array, wherein the digital-to-analog converter circuit is configured to apply the test signal to the source follower transistor of each of the test pixels via the voltage supply lines, and

a plurality of column readout lines configured to convey image pixel signals from the image pixels and test signals from the test pixels.

9. The image sensor defined in claim 8 further comprising verification circuitry configured to receive the test signals and to compare each test signal with a reference signal.

10. The image sensor defined in claim 8 further comprising a plurality of analog-to-digital converter circuits, wherein each analog-to-digital converter circuit is coupled to a respective one of the column readout lines.

11. The image sensor defined in claim 10 further comprising column decoder circuitry coupled between the source follower transistors and the analog-to-digital converter circuits, wherein the column decoder circuitry is configured to connect each column line to a respective one of the source follower transistors.

12. The image sensor defined in claim 8 wherein the digital-to-analog converter circuit comprises an adjustable resistor chain.

13. The image sensor defined in claim 8 wherein the light-receiving image pixels are arranged in rows in columns and wherein the test pixels are arranged in a row adjacent to the light-receiving image pixels.

14. The image sensor defined in claim 8 further comprising a buffer coupled between the digital-to-analog converter circuit and the plurality of test pixels.

Assignments (6)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2014
From: APTINA IMAGING CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034673/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT APPL. NO. 13/872,655 PREVIOUSLY RECORDED AT REEL: 030309 FRAME: 0280. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 18, 2014
From: MARTINUSSEN, TORE
To: APTINA IMAGING CORPORATION
Reel/Frame 035001/0060 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 29, 2013
From: MARTINUSSEN, TORE
To: APTINA IMAGING CORPORATION
Reel/Frame 030309/0280 →