IP Library Granted Patent US 9,258,536
Granted Patent B2
US 9,258,536 · App. 13/874,771 · Granted Feb 9, 2016

Imaging systems with plasmonic color filters

Inventor: Brian Vaartstra (Nampa, ID)
Assignee: Semiconductor Components Industries, LLC
H04N9/045G02B5/008
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Quick Facts
Patent No.
US 9,258,536
App. No.
13/874,771
Granted
Feb 9, 2016
Kind
B2
Abstract

An image sensor integrated circuit may contain image sensor pixels. A channel for receiving a fluid with particles such as fluorescent biological samples may be formed on top of the image sensor. Light-control layers may be interposed between the fluid channel and the top of the image sensor. The light-control layers may include a color filter array, a microlens array over the color filter array, and a plasmonic color filter. The plasmonic color filter may be formed from a patterned metal layer on the color filter array or on the microlens array. The patterned metal layer may include openings that are configured to use plasmonic effects to control the colors of light that pass through the plasmonic color filter. The color filter array and the plasmonic color filter, in combination, may block light from a light source in the system while passing fluorescent light from the sample.

Claims (39)

1. An apparatus, comprising:

an image sensor integrated circuit containing image sensor pixels;

a color filter array formed over the image sensor pixels;

a plasmonic color filter formed over the color filter array that comprises a patterned metal layer;

an array of microlenses interposed between the color filter array and the plasmonic color filter;

a passivation layer formed over the patterned metal layer; and

at least one array selected from the group consisting of: an array of metal nano-dots that are located on the passivation layer and an array of nano-cavities that are located in the passivation layer.

2. The apparatus defined in claim 1 , further comprising:

a planarization layer on the array of microlenses, wherein the patterned metal layer is formed on the planarization layer.

3. The apparatus defined in claim 2 wherein the plasmonic color filter layer comprises a cover layer on the patterned metal layer.

4. The apparatus defined in claim 3 wherein the patterned metal layer comprises a plurality of openings and wherein the plurality of openings are configured to prevent light having a color from passing through the openings using plasmonic effects.

5. The apparatus defined in claim 4 wherein the plurality of openings comprises a plurality of linear extended openings that form a grating pattern.

6. The apparatus defined in claim 4 wherein the plurality of openings comprises a plurality of circular openings.

7. The apparatus defined in claim 1 , wherein the color filter array comprises a plurality of color filter elements and a container material that is configured to act as a light pipe that is interposed between each color filter element in the plurality of color filter elements.

8. An opto-fluidic system, comprising:

an image sensor integrated circuit containing image sensor pixels that form at least one imager;

a fluid channel above the image sensor integrated circuit that is configured to receive fluid containing a fluorescent sample, wherein the at least one imager is located below the fluid channel and is configured to acquire image data using fluorescent light from the fluorescent sample;

a color filter layer interposed between the image sensor integrated circuit and the fluid channel; and

a plasmonic color filter interposed between the color filter layer and the fluid channel comprising:

a patterned metal layer;

a passivation layer formed over the patterned metal layer; and

at least one array selected from the group consisting of: an array of metal nano-dots that are located on the passivation layer and an array of nano-cavities that are located in the passivation layer.

9. The opto-fluidic system defined in claim 8 wherein a surface of the passivation layer is adjacent to the fluid channel.

10. The opto-fluidic system defined in claim 9 , further comprising:

a layer of microlenses interposed between the plasmonic color filter and the color filter layer.

11. The opto-fluidic system defined in claim 10 wherein the color filter layer comprises a plurality of color filter elements, each corresponding to a selected one of the image sensor pixels.

12. The opto-fluidic system defined in claim 8 , further comprising:

a light source configured to emit excitation light that excites fluorescent molecules of the fluorescent sample.

13. The opto-fluidic system defined in claim 12 wherein, in combination, the color filter layer and the plasmonic color filter are configured to block the excitation light and to pass the fluorescent light.

14. A system, comprising:

a central processing unit;

memory;

input-output circuitry; and

an imaging device, wherein the imaging device comprises:

an image sensor integrated circuit containing image sensor pixels,

a color filter array formed over the image sensor pixels;

a plasmonic color filter formed over the color filter array;

an array of microlenses interposed between the color filter array and the plasmonic color filter; and

a planarization layer on the array of microlenses, wherein the plasmonic color filter comprises at least one array selected from the group consisting of: an array of patterned nano-dots that are located on the planarization layer and an array of patterned nano-cavities that are located in the planarization layer.

Assignments (5)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2014
From: APTINA IMAGING CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034673/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2013
From: VAARTSTRA, BRIAN
To: APTINA IMAGING CORPORATION
Reel/Frame 030327/0717 →
Continuity (2)
Provisional Application 61642386 · May 3, 2012
Related Publication 20130293749A1 · Nov 7, 2013