IP Library Granted Patent US 9,171,584
Granted Patent B2
US 9,171,584 · App. 13/886,874 · Granted Oct 27, 2015

Three dimensional non-volatile storage with interleaved vertical select devices above and below vertical bit lines

Inventors: Roy E. Scheuerlein (Cupertino, CA); Chang Siau (Saratoga, CA)
Assignee: SanDisk 3D LLC
G11C5/06G11C5/063G11C7/18G11C13/003G11C13/0023H01L27/249H01L27/2454G11C2213/71H01L45/06H01L45/08H01L45/085H01L45/1226H01L45/142H01L45/143H01L45/146
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Quick Facts
Patent No.
US 9,171,584
App. No.
13/886,874
Granted
Oct 27, 2015
Kind
B2
Abstract

A three-dimensional array of memory elements reversibly change a level of electrical conductance/resistance in response to one or more voltage differences being applied across them. Memory elements are formed across a plurality of planes positioned different distances above a semiconductor substrate. Local bit lines to which the memory elements of all planes are connected are oriented vertically from the substrate and through the plurality of planes. Vertically oriented select devices are used to connect the local bit lines to global bit lines. A first subset of the vertically oriented select devices are positioned above the vertically oriented bit lines and a second subset of the vertically oriented select devices (interleaved with the first subset of the vertically oriented select devices) are positioned below the vertically oriented bit lines.

Claims (47)

1. A non-volatile storage system, comprising:

a substrate;

a monolithic three dimensional array of memory cells positioned above and not in the substrate;

a plurality of signal lines;

a plurality of vertically oriented bit lines that are above and not in the substrate, the vertically oriented bit lines are connected to the array of memory cells;

a plurality of vertically oriented select devices that are above the substrate but not in the substrate, the vertically oriented select devices are connected to the vertically oriented bit lines and the signal lines, a first subset of the vertically oriented select devices are positioned above the vertically oriented bit lines and a second subset of the vertically oriented select devices are positioned below the vertically oriented bit lines in an interleaved manner such that every other vertically oriented select device along a first direction are positioned above the vertically oriented bit lines with intervening vertically oriented select devices positioned below the vertically oriented bit lines, when the vertically oriented select devices are actuated the vertically oriented bit lines are in communication with the signal lines;

a plurality of word lines connected together and connected to a set of the memory cells, the word lines connected together form a first word line comb having multiple word line fingers, and

a controller for choosing slices of memory cells for a concurrent memory operation based on the slices being connected to the first word line comb but on different fingers of the first word line comb, at least one of the slices interacts with the vertically oriented bit lines that connect to a first subset of the signal lines including global bit lines positioned above the vertically oriented bit lines and the other at least one slice interacts with vertically oriented bit lines connecting to a second subset of the signal lines including global bit lines positioned below the vertically oriented bit lines.

2. The non-volatile storage system of claim 1 , further comprising:

the plurality of word lines connected together and connected to the set of the memory cells, the memory cells in combination with the vertically oriented bit lines and the word lines form a continuous mesh.

3. The non-volatile storage system of claim 2 , further comprising:

a word line driver in the substrate, below the set of the memory cells and in communication with the word lines connected together.

4. The non-volatile storage system of claim 2 , wherein:

the first word line comb is interleaved with two other word line combs.

5. The non-volatile storage system of claim 2 , wherein:

the monolithic three dimensional memory array of memory cells includes memory cells on multiple levels; and

the word lines connected together are on a common plane and the set of memory cells are on a common level.

6. The non-volatile storage system of claim 1 , further comprising:

a plurality of select lines arranged as sidewalls to the vertically oriented select devices and used to actuate the vertically oriented select devices.

7. The non-volatile storage system of claim 1 , wherein:

the vertically oriented select devices are wider than the vertically oriented bit lines.

8. The non-volatile storage system of claim 1 , wherein:

the vertically oriented select devices are twice as wide as the vertically oriented bit lines.

9. A method for operating a non-volatile storage system, comprising:

applying an unselected word line voltage to a plurality of word lines connected to a monolithic three dimensional array of memory cells positioned above and not in a substrate;

applying an unselected bit line voltage to a plurality of global bit lines, the global bit lines are connected to a plurality of vertically oriented select devices that are above the substrate but not in the substrate, the vertically oriented select devices are also connected to vertically oriented bit lines which are connected to the array of memory cells, a first subset of the vertically oriented select devices are positioned above the vertically oriented bit lines and a second subset of the vertically oriented select devices are positioned below the vertically oriented bit lines in an interleaved manner such that every other vertically oriented select device along a first direction are positioned above the vertically oriented bit lines with intervening vertically oriented select devices positioned below the vertically oriented bit lines;

choosing slices of memory cells for a concurrent memory operation based on the slices being connected to a first word line comb but on different fingers of the first word line comb, at least one of the slices interacts with the vertically oriented bit lines that connect to a first subset of the global bit lines positioned above the vertically oriented bit lines and the other at least one slice interacts with vertically oriented bit lines connecting to a second subset of the global bit lines positioned below the vertically oriented bit lines;

applying a selected bit line voltage to one or more selected global bit lines;

applying an actuating signal to a first selection line connected to the first subset of the vertically oriented select devices that are positioned above the vertically oriented bit lines;

applying an actuating signal to a second selection line connected to the second subset of the vertically oriented select devices that are positioned below the vertically oriented bit lines; and

applying a selected word line voltage to the first word line comb so that the concurrent memory operation is performed for the chosen slices of memory cells.

10. The method of claim 9 , wherein:

the vertically oriented select devices are on top of and are wider than the vertically oriented bit lines.

11. The method of claim 9 , wherein:

the applying an actuating signal to a first selection line comprises applying the actuating signal to a side wall of the first subset of the vertically oriented select devices to actuate the first subset of the vertically oriented select devices; and

the applying an actuating signal to a second selection line comprises applying the actuating signal to a side wall of the second subset of the vertically oriented select devices to actuate the second subset of the vertically oriented select devices.

12. A non-volatile storage system, comprising:

a plurality of non-volatile storage elements;

a plurality of signal lines;

a plurality of vertically oriented bit lines that are connected to the non-volatile storage elements;

a plurality of vertically oriented select devices that are connected to the vertically oriented bit lines and the signal lines, a first subset of the vertically oriented select devices are positioned above the vertically oriented bit lines and a second subset of the vertically oriented select devices are positioned below the vertically oriented bit lines in an interleaved manner such that every other vertically oriented select device along a first direction are positioned above the vertically oriented bit lines with intervening vertically oriented select devices positioned below the vertically oriented bit lines, when the vertically oriented select devices are actuated the vertically oriented bit lines are in communication with the signal lines;

a plurality of word lines connected together and connected to a set of the memory cells, the word lines connected together form a first word line comb having multiple word line fingers, and

a controller for choosing slices of memory cells for a concurrent memory operation based on the slices being connected to the first word line comb but on different fingers of the first word line comb, at least one of the slices interacts with the vertically oriented bit lines that connect to a first subset of the signal lines including global bit lines positioned above the vertically oriented bit lines and the other at least one slice interacts with vertically oriented bit lines connecting to a second subset of the signal lines including global bit lines positioned below the vertically oriented bit lines.

13. The non-volatile storage system of claim 12 , wherein:

the first word line comb is interleaved with two other word line combs.

14. The non-volatile storage system of claim 12 , further comprising:

a plurality of select lines arranged as sidewalls to the vertically oriented select devices and used to actuate the vertically oriented select devices.

Assignments (4)
CHANGE OF NAME Recorded May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038807/0898 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT LISTED PATENT NUMBER 8853569 TO THE CORRECT PATENT NUMBER 8883569 PREVIOUSLY RECORDED ON REEL 038300 FRAME 0665. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Apr 25, 2016
From: SANDISK 3D LLC
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038520/0552 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2016
From: SANDISK 3D LLC.
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038300/0665 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 3, 2013
From: SCHEUERLEIN, ROY E.; SIAU, CHANG
To: SANDISK 3D LLC
Reel/Frame 030349/0117 →
Continuity (2)
Provisional Application 61647488 · May 15, 2012
Related Publication 20130308363A1 · Nov 21, 2013