Broken wafer recovery system
An apparatus and method for recovery and cleaning of broken substrates, especially beneficial for fabrication systems using silicon wafer carried on trays. Removal of broken wafers and particles from within the fabrication system is enabled without requiring disassembly of the system and without requiring manual labor. A placing mechanism moves a suction head to location of the broken substrate and a suction pump coupled to a flexible hose is used to remove the broken pieces. A hood is positioned at the inlet of the suction head, and setback extensions are provided at the bottom of the hood to allow air flow into the inlet and prevent thermal conductance from the tray to the hood. Pins are extendable about the inlet of the suction head to enable breakage of the wafer to smaller pieces for easy removal.
1. A substrate processing system, comprising:
a vacuum processing chamber;
a loadlock chamber coupled to the vacuum processing chamber via a vacuum valve;
a broken substrate removing apparatus comprising:
a placing mechanism movably supporting a suction head for moving the suction head to location of the broken substrate, the suction head comprising a suction inlet and a hood positioned at the inlet of the suction head and configured to allow sufficient air flow into the inlet to enable proper suction to remove broken pieces of the substrate;
a suction pump; and,
a flexible hose coupling the suction head to the suction pump;
wherein the hood comprises setback extensions to allow air flow into the inlet.
2. The system of claim 1 , further comprising:
a controller; and,
an optical sensor sending signals to the controller indicating presence or absence of a substrate.
3. The system of claim 2 , wherein the controller is operable to activate the placing mechanism and the suction head according to the signals received from the optical sensor.
4. The system of claim 3 , wherein the optical sensor comprises a camera.
5. The system of claim 1 , further comprising a plurality of movable pins extendable about the inlet of the suction head to further break the broken substrate.
6. The system of claim 5 , further comprising a frame coupled to a retracting mechanism, and wherein the plurality of movable pins are commonly connected to the frame.
7. The system of claim 1 , wherein the placing mechanism comprises a first gantry providing linear motion in one direction and a second gantry providing linear motion is a perpendicular direction.
8. The system of claim 1 , wherein the placing mechanism comprises a rotatable pivot providing rotational motion and an arm providing linear motion.
9. The system of claim 1 , further comprising a parking and disposal station enabling parking of the suction head when not in use and disposal of residual broken pieces removed by the suction head but not fully transferred to the suction pump.
10. The system of claim 1 , further comprising a loading chamber coupled to the loadlock chamber.
11. The system of claim 10 , further comprising:
a susceptor situated within the vacuum processing chamber; and,
a controller operable to transport the susceptor to the loading chamber and activate the placing mechanism to place the suction head at a specific location over the susceptor.
12. The system of claim 11 , further comprising extendable pins provided about an inlet of the suction head, and wherein the controller further activates the extendable pin so as to intentionally break a substrate situated on the susceptor.
13. The system of claim 12 , wherein the susceptor comprises a plurality of pucks and wherein the extendable pins are configured to secure one of the pucks while the suction head removes pieces of broken substrate.
14. The system of claim 13 , further comprising an optical sensor sending signals to the controller for at least one of verification of wafer breakage or verification of complete removal of broken wafer.
15. The system of claim 10 , further comprising:
at least one tray configured for supporting a plurality of substrates concurrently; and
a controller operable to transport the tray to the loading chamber and activate the placing mechanism to place the suction head at a specific location over the tray.
16. The system of claim 15 , further comprising an optical sensor sending signals to the controller for at least one of verification of wafer breakage or verification of complete removal of broken wafer.
17. The system of claim 10 , further comprising a flipping mechanism configured for flipping the substrates.
18. The system of claim 1 , further comprising:
an illumination source illuminating the interior of the processing chamber; and,
an imager imaging the interior of the processing chamber to identify broken substrates.
19. The system of claim 1 , further comprising a monitor enabling an operator to designate a wafer as broken.