X-ray detector assembly with shield
An X-ray detector assembly includes an integrated circuit, which includes an array of detector elements and a readout circuit adjacent to the array and coupled to read charge out of the detector elements. A non-metallic shield is positioned over the readout circuit so as to prevent X-rays from striking the readout circuit.
1. An X-ray detector assembly, comprising:
an integrated circuit comprising an array of detector elements and a readout circuit adjacent to the array and coupled to read charge out of the detector elements; and
a non-metallic shield comprising a mono-crystalline material positioned over the readout circuit so that X-rays diffracted from the shield are directed away from the readout circuit in order to prevent the X-rays from striking the readout circuit.
2. The assembly according to claim 1 , wherein the mono-crystalline material comprises a semiconductor material.
3. The assembly according to claim 2 , wherein the semiconductor material comprises a strip cut from a wafer of silicon or germanium.
4. The assembly according to claim 1 , wherein an edge of the non-metallic shield is polished to prevent stray reflections and diffraction at the edge.
5. The assembly according to claim 1 , wherein the readout circuit comprises a charge-coupled device (CCD), which comprises a register line, and wherein the non-metallic shield covers the register line.
6. A method for X-ray detection, comprising:
providing an integrated circuit comprising an array of detector elements and a readout circuit adjacent to the array and coupled to read charge out of the detector elements; and
positioning a non-metallic shield comprising a mono-crystalline material over the readout circuit, and orienting the mono-crystalline material so that X-rays diffracted from the shield are directed away from the readout circuit in order to prevent the X-rays from striking the readout circuit.
7. The method according to claim 6 , wherein the mono-crystalline material comprises a semiconductor material.
8. The method according to claim 7 , and comprising cutting a strip from a wafer of silicon or germanium to form the shield.
9. The method according to claim 6 , and comprising polishing an edge of the non-metallic shield in order to prevent stray reflections and diffraction at the edge.
10. The method according to claim 6 , wherein the readout circuit comprises a charge-coupled device (CCD), which comprises a register line, and wherein positioning the non-metallic shield comprises placing the non-metallic shield so as to cover the register line.
11. The method according to claim 10 , wherein placing the non-metallic shield comprises irradiating the array with X-rays and monitoring an output signal from the array, and sliding the shield across the array until the signal shows that the register line is covered.