Cascode structures for GaN HEMTs
View Patent ↗A multi-stage transistor device is described. One embodiment of such a device is a dual-gate transistor, where the second stage gate is separated from a barrier layer by a thin spacer layer and is grounded through a connection to the source. In one embodiment the thin spacer layer and the second stage gate are placed in an aperture in a spacer layer. In another embodiment, the second stage gate is separated from a barrier layer by a spacer layer. The device can exhibit improved linearity and reduced complexity and cost.
1. A multi-gate transistor, comprising:
a plurality of active semiconductor layers on a substrate;
a two-dimensional electron gas (2DEG) at the interface of two of said active semiconductor layers;
a source and a drain in electrical contact with said 2DEG;
a first spacer layer;
a first gate between said source and drain and directly on said plurality of active semiconductor layers, said first gate in electrical contact with one or more of said plurality of active semiconductor layers;
a second gate between said first gate and said drain, said first and second gates within respective apertures in said first spacer layer; and
a second spacer layer between said second gate and said plurality of active semiconductor layers.
2. The multi-gate transistor of claim 1 , wherein said second spacer layer comprises a dielectric material.
3. The multi-gate transistor of claim 1 , wherein the thickness of said second spacer layer is approximately 100 Å to 800 Å.
4. The multi-gate transistor of claim 1 , wherein said first spacer layer is shaped to define first and second apertures;
wherein a portion of said plurality of active semiconductor layers is exposed through each of said first and second apertures.
5. The multi-gate transistor of claim 4 , wherein said portion exposed through said second aperture is covered by said second spacer layer.
6. The multi-gate transistor of claim 5 , wherein said second spacer layer is thinner than said first spacer layer.
7. The multi-gate transistor of claim 1 , further comprising a first field plate.
8. The multi-gate transistor of claim 7 , wherein said first field plate is over said second gate.
9. The multi-gate transistor of claim 7 , wherein said first field plate is connected to said source.
10. The multi-gate transistor of claim 1 , wherein said second gate is connected to said source.
11. The multi-gate transistor of claim 10 , wherein said second gate is connected to said source by one or more conductive paths;
wherein said one or more conductive paths collectively cover less than all of the topmost surface of said multi-gate transistor between said second gate and said source.
12. The multi-gate transistor of claim 1 , wherein said second gate is longer than said first gate.
13. The multi-gate transistor of claim 1 , wherein at least one of said first gate and said second gate comprises an overhanging section.
14. The multi-gate transistor of claim 1 , wherein said second gate is at least partially recessed into at least one of said plurality of active semiconductor layers; and
wherein said second spacer layer separates all of the recessed portion of said second gate from said plurality of active semiconductor layers.
15. The multi-gate transistor of claim 1 , wherein said multi-gate transistor has a first stage and a second stage; and
wherein said second stage has a more negative threshold voltage than said first stage.
16. The multi-gate transistor of claim 1 , wherein said transistor is a high electron mobility transistor (HEMT).
17. A cascode structure, comprising:
a plurality of active semiconductor layers;
a first stage comprising a first gate; and
a second stage comprising a second gate, said first and second gates within respective apertures in a first spacer layer;
wherein said first gate is in electrical contact with one or more of said plurality of active semiconductor layers;
wherein said second gate is separated from said plurality of active semiconductor layers by a second spacer layer, said second spacer layer below said second gate and above said first gate; and
wherein said second stage has a more negative threshold voltage than said first stage.
18. The cascode structure of claim 17 , wherein the thickness of said spacer layer is approximately 100 Å to 800 Å.
19. The cascode structure of claim 17 , wherein said cascode structure is an amplifier.
20. An integrated circuit comprising a transistor, said transistor comprising:
a plurality of active semiconductor layers on a substrate;
a two-dimensional electron gas (2DEG) at the interface of two of said active semiconductor layers;
a source and a drain in contact with said 2DEG;
a first spacer layer;
a first gate between said source and drain and directly on said plurality of active semiconductor layers, said first gate in electrical contact with one or more of said plurality of active semiconductor layers;
a second gate between said first gate and said drain, said first and second gates within respective apertures in said first spacer layer;
a second spacer layer between said second gate and said plurality of active semiconductor layers; and
a third spacer layer over said second spacer layer and over said first and second gates.
21. The integrated circuit of claim 20 , further comprising a field plate on said third spacer layer.
22. The multi-gate transistor of claim 1 , wherein said first gate has top and bottom surfaces, said bottom surface directly on said plurality of active semiconductor layers, and
wherein said second spacer layer between said second gate and said plurality of active semiconductor layers extends over the top surface of said first gate.