IP Library › Granted Patent US 9,184,377
Granted Patent B2
US 9,184,377 · App. 13/915,228 · Granted Nov 10, 2015

Resistance variable memory cell structures and methods

Inventors: Sachin V. Joshi (Boise, ID); F Daniel Gealy (Kuna, ID)
Assignee: Micron Technology, Inc.
H01L45/06H01L27/2409H01L27/2463H01L45/1233H01L45/165H01L45/1641H01L45/1675
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Quick Facts
Patent No.
US 9,184,377
App. No.
13/915,228
Granted
Nov 10, 2015
Kind
B2
Abstract

Resistance variable memory cell structures and methods are described herein. A number of embodiments include a first resistance variable memory cell comprising a number of resistance variable materials in a super-lattice structure and a second resistance variable memory cell comprising the number of resistance variable materials in a homogeneous structure.

Claims (16)

1. An array of resistance variable memory cells, comprising:

a first resistance variable memory cell comprising a number of resistance variable materials in a super-lattice structure; and

a second resistance variable memory cell comprising the number of resistance variable materials in a homogeneous structure.

2. The array of claim 1 , wherein the number of resistance variable materials include phase change materials.

3. The array of claim 1 , wherein the number of resistance variable materials in the super-lattice structure include portions of each of the number of resistance variable materials stacked upon each other to form the super-lattice structure.

4. The array of claim 1 , wherein the super-lattice structure is a storage element of the first resistance variable memory cell and the homogeneous structure is a storage element of the second resistance variable memory cell.

5. The array of claim 1 , wherein the super-lattice structure is a select device of the first resistance variable memory cell and the homogeneous structure is a select device of the second resistance variable memory cell.

6. The array of claim 1 , wherein the number of resistance variable materials in the homogeneous structure are ion implanted resistance variable materials.

7. The array of claim 1 , wherein the first resistance variable memory cell is located in a first portion of the array configured to store a first type of data and the second resistance variable memory cell is located in a second portion of the array configured to store a second type of data.

8. An array of resistance variable memory cells, comprising:

a first number of resistance variable memory cells in a first portion of the array, wherein the first number of resistance variable memory cells each include a number of resistance variable materials having a super-lattice structure; and

a second number of resistance variable memory cells in a second portion of the array, wherein the second number of resistance variable memory cells each include the number of resistance variable materials having a homogeneous structure.

9. The array of claim 8 , wherein the first portion of the array is configured to store a first type of data, and the second portion of the array is configured to store a second type of data.

10. The array of claim 8 , wherein the second number of resistance variable memory cells have a higher associated retention capability than the first number of resistance variable memory cells.

11. The array of claim 8 , wherein the first number of resistance variable memory cells have a higher associated programming throughput than the second number of resistance variable memory cells.

12. The array of claim 8 , wherein the array is configured to store dynamic data in the first number of resistance variable memory cells and static data in the second number of resistance variable memory cells.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 11, 2013
From: JOSHI, SACHIN V.; GEALY, F. DANIEL
To: MICRON TECHNOLOGY, INC.
Reel/Frame 030589/0461 →
Continuity (1)
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