Silicon carbide semiconductor device

1. A silicon carbide semiconductor device, comprising:

a silicon carbide layer having a first main surface and a second main surface opposite to said first main surface, said silicon carbide layer including a drift layer forming said first main surface and having a first conductivity type, a body region provided on said drift layer and having a second conductivity type different from said first conductivity type, a source region provided on said body region to be spaced apart from said drift layer by said body region, forming said second main surface, and having said first conductivity type, and a relaxing region provided within said drift layer and having said second conductivity type, said relaxing region having an impurity dose amount D rx and a distance L d from said first main surface, said drift layer having an impurity concentration N d between said first main surface and said relaxing region, and relation of D rx >L d ·N d being satisfied;

a gate insulating film provided on said body region so as to connect said source region and said drift layer to each other;

a gate electrode provided on said gate insulating film;

a first electrode opposed to said first main surface; and

a second electrode opposed to said second main surface.

2. The silicon carbide semiconductor device according to claim 1 , wherein relation of L d ≧5 μm is satisfied.

3. The silicon carbide semiconductor device according to claim 1 , wherein relation of D rx ≧1×10 13 cm −2 is satisfied.

4. The silicon carbide semiconductor device according to claim 1 , wherein

a breakdown voltage across said first and second electrodes is equal to or higher than 600 V.

5. The silicon carbide semiconductor device according to claim 1 , further comprising a single crystal substrate provided between said first main surface of said silicon carbide layer and said first electrode, being in contact with each of said first main surface of said silicon carbide layer and said first electrode, composed of silicon carbide, having said first conductivity type, and having an impurity concentration higher than said impurity concentration N d .

6. The silicon carbide semiconductor device according to claim 1 , wherein

said second main surface of said silicon carbide layer is provided with a trench, said trench has a sidewall surface passing through said source region and said body region to reach said drift layer and a bottom surface located on said drift layer,

said gate insulating film covers each of said sidewall surface and said bottom surface of said trench, and

said relaxing region is provided at a position deeper than said bottom surface of said trench.

7. The silicon carbide semiconductor device according to claim 6 , wherein

a distance L tr between said relaxing region and said bottom surface of said trench is not greater than 4 μm.

8. The silicon carbide semiconductor device according to claim 1 , wherein

said second main surface of said silicon carbide layer includes a flat surface having said source region, said body region, and said drift layer, and

said gate insulating film is provided on said flat surface.

9. The silicon carbide semiconductor device according to claim 8 , wherein

said body region is a well region having a side surface and a bottom surface as well as a corner portion between said side surface and said bottom surface, and

a distance L pn between said relaxing region and said corner portion of said well region is not greater than 4 μm.