Semiconductor package and manufacturing method thereof
View Patent ↗Various aspects of the present invention, for example and without limitation, comprise a semiconductor device package and/or method for manufacturing a semiconductor device package. Such a device package may, for example, comprise a MEMS device package.
1. A method for producing a semiconductor package, the manufacturing method comprising:
preparing a mother board having a plurality of N×M package device arrays, each package device of the package device arrays comprising at least one semiconductor chip and an active element attached to the mother board;
preparing a plurality of N×M window arrays corresponding to the package device arrays, each window of the window arrays comprising sidewalls forming cavity regions for the package device arrays;
coating an adhesive on adhering regions formed on the window arrays to be adhered to the mother board;
adhering the window arrays to a target position on the mother board using the adhesive; and
fabricating lidded package devices by severing the package device arrays and adhered window arrays by a cutting process.
2. The method of claim 1 , wherein said preparing a plurality of N×M window arrays comprises molding the window arrays from plastic.
3. The method of claim 2 , wherein said preparing a plurality of N×M window arrays comprises forming an EMI shielding layer at least inside respective windows of the window arrays.
4. The method of claim 3 , wherein said forming an EMI shielding layer comprises forming the EMI shielding layer by, at least in part, plating a copper/nickel layer.
5. The method of claim 1 , wherein the semiconductor chip is a MEMS microphone device.
6. The method of claim 1 , wherein the sidewalls and a top plate of each window of the window arrays are at a right angle to each other.
7. The method of claim 1 , wherein the adhesive is a solder paste.
8. The method of claim 1 , wherein said coating an adhesive comprises screen printing the adhesive on the window arrays.
9. The method of claim 1 , wherein N is different from M.
10. A method for producing a semiconductor package, the manufacturing method comprising:
preparing a mother board having an N×M package device array, each package device of the package device array comprising at least one semiconductor chip and an active element attached to the mother board;
providing a molded N×M window array corresponding to the package device array, each window of the window array comprising sidewalls forming cavity regions for the package device arrays and an electromagnetic interference (EMI) shielding layer inside said each window;
coating an adhesive on adhering regions formed on the window array to be adhered to the mother board;
adhering the window array to a target position on the mother board using the adhesive; and
fabricating lidded package devices by severing the package device array and adhered window array by a cutting process.
11. The method of claim 10 , wherein said molding an N×M window array comprises injection molding the window array from plastic.
12. The method of claim 10 , wherein said forming an EMI shielding layer comprises forming the EMI shielding layer by, at least in part, plating a copper/nickel layer.
13. The method of claim 10 , wherein the semiconductor chip is a MEMS microphone device.
14. The method of claim 13 , wherein the active element is a controller.
15. The method of claim 13 , wherein the sidewalls and a top plate of each window of the window arrays are at a right angle to each other.
16. The method of claim 13 , wherein the adhesive is a solder paste.
17. The method of claim 13 , wherein the adhesive is an epoxy paste.
18. The method of claim 1 , wherein said coating an adhesive comprises screen printing the adhesive on the window array.
19. The method of claim 1 , wherein N is different from M.
20. A method for producing a semiconductor package, the manufacturing method comprising:
preparing a mother board having an N×M package device array, each package device of the package device array having at least one semiconductor chip and an active element attached to the mother board in a respective cavity region;
providing a molded N×M window array corresponding to the package device array, wherein at least one groove separates adjacent windows of the window array and each window of the window array comprising sidewalls for each of the respective cavity regions;
coating an adhesive on adhering regions formed on the window array to be adhered to the mother board;
adhering the window array to a target position on the mother board using the adhesive; and
fabricating lidded package devices by severing the package device array and adhered window array by a cutting process.