Wire bonding capillary with working tip protrusion
View Patent ↗A method for bonding a wire to a substrate includes forming a wire ball at a working tip of a capillary and contacting the wire ball to a substrate via the capillary. The method also includes driving a protrusion at the working tip of the capillary into contact with a region of the substrate surrounding the wire ball. A capillary for wire bonding includes a working face, an annular chamfer section, and a cylindrical bore offsetting the annular chamfer section from the working face. A capillary for wire bonding includes a capillary body comprising a working tip having a working face. The capillary body defines an axial passage extending from the working face along a longitudinal axis of the capillary. The axial passage includes a cylindrical bore extending internally from the working face, and a first annular chamfer having a major diameter defined by the cylindrical bore.
1. A method for bonding a wire to a substrate, the method comprising:
forming a wire ball at a wire at a working tip of a capillary;
contacting the wire ball to a substrate via the capillary;
driving a protrusion at the working tip of the capillary into contact with a region of the substrate surrounding the wire ball;
forming a stitch bond with the wire at a substrate using the capillary; and
cleaving at least a portion of the wire at the stitch bond by penetrating the wire with the protrusion.
2. The method of claim 1 , wherein:
driving the protrusion at the working tip of the capillary into contact with the region of the substrate surrounding the wire ball comprises driving the protrusion of the working tip into the region of the substrate so that substrate material within the region is contained within a chamber formed by the working tip.
3. The method of claim 1 , wherein:
driving the protrusion into contact with the region of the substrate surrounding the wire ball comprises penetrating a surface of the substrate with the protrusion so that substrate material at the region is pressed against a sidewall of the wire ball.
4. The method of claim 1 , wherein:
the wire is composed of copper (Cu); and
the substrate comprises a pad composed of aluminum (Al).
5. The method of claim 1 , wherein the protrusion comprises at least one of: a protruding annular lip circumscribing an opening of an axial passage at a working face of the working tip; a perimeter edge of an opening of an axial passage at a flat working face of the working tip, the flat working face at a non-zero acute angle relative to a longitudinal axis of the axial passage; a protruding annular lip defines a portion of a cylindrical bore at the working face; and a protruding annular lip that is offset from an opening defined by a cylindrical bore at the working face.
6. A capillary for wire bonding a wire to a substrate, the capillary comprising:
a working face;
a first annular chamfer section;
a cylindrical bore offsetting the annular chamfer section from the working face; and
wherein the first annular chamfer section comprises:
a first annular chamfer; and
a second annular chamfer disposed between the first annular chamfer and the cylindrical bore and having an inside chamfer angle greater than an inside chamfer angle of the first annular chamfer.
7. The capillary of claim 6 , wherein:
the working face comprises a protruding annular lip that defines a portion of the cylindrical bore at the working face.
8. The capillary of claim 7 , wherein:
the working face further comprises a flat annular surface extending from the protruding annular lip.
9. The capillary of claim 6 , wherein:
the working face comprises a flat annular surface extending from a perimeter of the cylindrical bore.
10. The capillary of claim 6 , further comprising:
a capillary body comprising a working tip comprising the working face, the capillary body defining an axial passage extending from the working face along a longitudinal axis of the capillary, the axial passage comprising:
the cylindrical bore, wherein the cylindrical bore extends internally from the working face; and
the first annular chamfer having a major diameter defined by the cylindrical bore.
11. The capillary of claim 10 , wherein the
second annular chamfer has a major diameter defined by a minor diameter of the first annular chamfer.
12. The capillary of claim 10 , wherein a length of the cylindrical bore is at least one-fourth of a diameter of the cylindrical bore.
13. The capillary of claim 10 , wherein the working tip comprises a protruding annular lip.
14. The capillary of claim 10 , wherein the working face comprises a flat annular surface circumscribing an opening of the cylindrical bore.
15. A bonding tool comprising the capillary of claim 6 , the bonding tool further comprising:
a servo system to drive a protrusion at the working face of the capillary into contact with a surface of the substrate during formation of a wire bond at the substrate.
16. A method for bonding a wire to a substrate, the method comprising:
forming a wire ball at a wire at a working tip of a capillary;
contacting the wire ball to a substrate via the capillary;
performing an ultrasonic scrub process to initiate plastic deformation of the wire ball subsequent to contacting the wire ball to the substrate; and
after performing the ultrasonic scrub process, driving a protrusion at the working tip of the capillary into contact with a region of the substrate surrounding the wire ball.
17. The method of claim 16 , wherein:
driving the protrusion at the working tip of the capillary into contact with the region of the substrate surrounding the wire ball comprises driving the protrusion of the working tip into the region of the substrate so that substrate material within the region is contained within a chamber formed by the working tip.
18. The method of claim 16 , wherein:
driving the protrusion into contact with the region of the substrate surrounding the wire ball comprises penetrating a surface of the substrate with the protrusion so that substrate material at the region is pressed against a sidewall of the wire ball.
19. The method of claim 16 , wherein the protrusion comprises at least one of: a protruding annular lip circumscribing an opening of an axial passage at a working face of the working tip; a perimeter edge of an opening of an axial passage at a flat working face of the working tip, the flat working face at a non-zero acute angle relative to a longitudinal axis of the axial passage; a protruding annular lip that defines a portion of a cylindrical bore at the working face; and a protruding annular lip that is offset from an opening defined by a cylindrical bore at the working face.
20. A capillary for wire bonding a wire to a substrate, the capillary comprising:
a working face;
a first annular chamfer section;
a cylindrical bore offsetting the annular chamfer section from the working face; and
wherein the working face comprises:
a protruding annular lip that defines a portion of the cylindrical bore at the working face the protruding annular lip having a wedge profile formed by a parallel walled portion that forms a segment of the cylindrical bore and an angled wall portion at a non-zero angle relative to the parallel walled portion; and
a flat annular surface extending from the protruding annular lip at a non-zero acute angle relative to a longitudinal axis of the cylindrical bore.
21. The capillary of claim 20 , wherein:
the protruding annular lip is one of: a protruding annular lip that defines a portion of the cylindrical bore at the working face; and a protruding annular lip that is offset from an opening defined by a cylindrical bore at the working face.
22. A bonding tool comprising the capillary of claim 20 , the bonding tool further comprising:
a servo system to drive the protruding annular lip of the capillary into contact with a surface of the substrate during formation of a wire bond at the substrate.
23. The bonding tool of claim 22 , wherein the servo system further is to:
manipulate the capillary to form a stitch bond with the wire at a substrate; and
drive the protruding annular lip of the capillary into the wire to cleave at least a portion of the wire at the stitch bond.
24. The bonding tool of claim 22 , further comprising:
an ultrasonic transducer to perform an ultrasonic scrub process to initiate plastic deformation of a wire ball subsequent to contacting the wire ball to the substrate and prior to the servo system driving the protruding annular lip of the capillary into contact with the surface of the substrate.