Lead frame package having discharge holes and method of manufacturing the same
View Patent ↗In one embodiment, a lead frame package structure includes a lead frame having sides that surround a die paddle and on which a plurality of leads are formed. An electronic chip is attached to the die paddle and a case is attached to the lead frame to seal the leads and the electronic chip. One or more discharge holes are formed on and extending through one or more specific leads and/or on and extending through a predetermined position of the die paddle. The discharge holes are configured to discharge air pressure that forms during the assembly process thereby improving the reliability of the packaged electronic chip.
1. A lead frame package structure comprising:
a lead frame including a die paddle and plurality of leads in proximity to the die paddle;
a discharge hole extending through at least one specific lead of the plurality of leads;
an electronic chip on the die paddle; and
a case attached to the lead frame, the case defining a cavity between the lead frame and an upper portion of the case, wherein the discharge hole, the electronic chip and at least portions of the plurality of leads are within the cavity, and wherein the discharge hole is open and configured to discharge air pressure in the cavity.
2. The structure of claim 1 , wherein:
the lead frame has a quadrangle shape;
at least two leads of the plurality of leads include discharge holes; and
the two leads are provided in proximity to corners of the quadrangle shape that face each other in a diagonal direction in the lead frame.
3. The structure of claim 1 , wherein four leads of the plurality of leads are provided in proximity to four corners of the lead frame with each of the four leads including a discharge hole open in the lead frame package structure.
4. The structure of claim 1 , wherein:
the discharge hole has a first hole portion on one side of the at least one specific lead and a second hole portion on the opposite side; and
the first hole portion has a diameter that is smaller than the diameter of the second hole portion.
5. The structure of claim 4 , further comprising a slot in the at least one specific lead in proximity to the first hole portion.
6. The structure of claim 5 , wherein the slot is a concave groove that surrounds the first hole portion.
7. The structure of claim 1 , wherein the case is attached to the lead frame with one of a solder paste adhesive or an epoxy paste adhesive.
8. A lead frame package structure comprising:
a lead frame having sides, which surround a die paddle and on which a plurality of leads are formed in proximity to a die paddle, wherein one or more discharge holes extend through predetermined locations on the lead frame;
an electronic chip on the die paddle; and
a cover adhered to the lead frame defining a cavity between the lead frame and the cover, wherein the electronic chip, the one or more discharge holes, at least portions of plurality of leads, and the die paddle are within the cavity, and wherein the one or more discharge holes are open in the lead frame package structure.
9. The structure of claim 8 , wherein the die paddle includes a discharge hole.
10. The structure of claim 8 , wherein at least one lead of the plurality of leads includes a discharge hole.
11. The structure of claim 8 , wherein:
at least one discharge hole has a first hole portion on one side of the lead frame and a second hole portion on an opposite side of the lead frame; and
the first hole portion has a diameter that is smaller than that of the second hole portion.
12. The structure of claim 11 , further comprising a slot in proximity to the at least one discharge hole.
13. The structure of claim 12 , wherein the slot is a concave groove surrounding the first hole portion.
14. The structure of claim 8 , wherein the cover is adhered to the lead frame by one of a solder paste adhesive or an epoxy paste adhesive.
15. A method for manufacturing a lead frame package, comprising:
providing a lead frame having sides, which surround a die paddle and on which a plurality of leads are formed, and discharge holes extending through the lead frame on one or more locations;
attaching an electronic chip to the die paddle; and
attaching a case for sealing the plurality of leads and the electronic chip to the lead frame, the case defining a cavity between a portion of the lead frame and an upper surface of the case, wherein the discharge holes are configured to discharge air pressure in the cavity.
16. The method of claim 15 , wherein providing the lead frame includes providing the lead frame having at least one discharge hole in a lead of the plurality of leads.
17. The method of claim 15 , wherein providing the lead frame includes providing the lead frame having at least one discharge hole in the die paddle.
18. The method of claim 15 , wherein:
providing the lead frame includes providing the lead frame having at least one discharge hole comprising a first hole portion on one side of the lead frame and a second hole portion on an opposite side of the lead frame; and
the first hole portion has diameter that is smaller than that of the second hole portion.
19. The method of claim 15 , wherein:
providing the lead frame includes providing a lead frame further comprising a slot formed in proximity to at least one discharge hole, and where the slot and the electronic chip are on the same side of the lead frame; and
attaching the case to the lead frame comprises attaching the case with an adhesive layer.
20. The method of claim 19 , wherein providing the lead frame includes providing the lead frame where the slot comprises a concave groove surrounding the at least one discharge hole.