IP Library Granted Patent US 8,698,261
Granted Patent B2
US 8,698,261 · App. 13/955,039 · Granted Apr 15, 2014

Co/Ni multilayers with improved out-of-plane anisotropy for magnetic device applications

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Quick Facts
Patent No.
US 8,698,261
App. No.
13/955,039
Granted
Apr 15, 2014
Kind
B2
Abstract

A MTJ for a spintronic device is disclosed and includes a thin seed layer that enhances perpendicular magnetic anisotropy (PMA) in an overlying laminated layer with a (Co/X) n or (CoX) n composition where n is from 2 to 30, X is one of V, Rh, Ir, Os, Ru, Au, Cr, Mo, Cu, Ti, Re, Mg, or Si, and CoX is a disordered alloy. The seed layer is preferably NiCr, NiFeCr, Hf, or a composite thereof with a thickness from 10 to 100 Angstroms. Furthermore, a magnetic layer such as CoFeB may be formed between the laminated layer and a tunnel barrier layer to serve as a transitional layer between a (111) laminate and (100) MgO tunnel barrier. The laminated layer may be used as a reference layer, dipole layer, or free layer in a MTJ. Annealing between 300° C. and 400° C. may be used to further enhance PMA in the laminated layer.

Claims (7)

1. A magnetic tunnel junction (MTJ), comprising:

(a) a seed layer formed on a substrate and comprising one or more of Hf, NiFeCr, and NiCr that enhances perpendicular magnetic anisotropy (PMA) in an overlying laminated layer;

(b) a reference layer having a laminated structure with a plurality of “n” layers that are represented by (Co/X) n or (CoX) n where X is one of V, Rh, Ir, Os, Ru, Au, Cr, Mo, Cu, Ti, Re, Mg, and Si, CoX is a disordered alloy, and the reference layer contacts a top surface of the seed layer and has intrinsic PMA.

2. The MTJ of claim 1 wherein the seed layer has a thickness between about 10 and 300 Angstroms.

3. The MTJ of claim 1 further comprised of a magnetic layer made of CoFeB, CoFe, or combinations thereof that contacts a top surface of the laminated structure.

4. The MTJ of claim 3 wherein the magnetic layer consists of CoFeB and the MTJ is further comprised of a Ta layer about 0.5 to 3 Angstroms thick that is formed between the top surface of the laminated stack and the magnetic layer.

5. The MTJ of claim 1 wherein n is from 2 to 30.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 25, 2019
From: HEADWAY TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 048692/0917 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 20, 2018
From: MAGIC TECHNOLOGIES, INC.
To: HEADWAY TECHNOLOGIES, INC.
Reel/Frame 047604/0081 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 22, 2018
From: JAN, GUENOLE; TONG, RU-YING; WANG, YU-JEN
To: MAGIC TECHNOLOGIES, INC.
Reel/Frame 047257/0345 →