Image sensors having buried light shields with antireflective coating
View Patent ↗An image sensor with an array of image sensor pixels is provided. Each image pixel may include a photodiode and associated pixel circuits formed in a semiconductor substrate. Buried light shielding structures may be formed on the substrate to prevent pixel circuitry that is formed in the substrate between two adjacent photodiodes from being exposed to incoming light. The buried light shielding structures may be lined with absorptive antireflective coating material to prevent light from being reflected off the surface of the buried light shielding structures. Forming buried light shielding structures with absorptive antireflective coating material can help reduce optical pixel crosstalk and enhance global shutter efficiency.
1. An image sensor, comprising:
a substrate;
first and second neighboring photodiodes formed in the substrate; and
buried light shield structures formed on the substrate between the first and second photodiodes, wherein the buried light shield structures are lined with absorptive antireflective coating material.
2. The image sensor defined in claim 1 , further comprising:
a storage diode formed in the substrate directly below the buried light shield structures.
3. The image sensor defined in claim 2 , further comprising:
a transistor coupled between the storage diode and the first photodiode.
4. The image sensor defined in claim 3 , further comprising:
a dielectric stack formed on top of the substrate; and
conductive interconnect routing structures that is formed in the dielectric stack and that is coupled to the transistor via a gap in the buried light shield structures.
5. The image sensor defined in claim 1 , further comprising:
an antireflective coating liner formed on the substrate directly over the first and second photodiodes.
6. The image sensor defined in claim 5 , wherein the antireflective coating liner and the absorptive antireflective coating material on the buried light shield structures are formed from different materials.
7. The image sensor defined in claim 1 , wherein the absorptive antireflective coating material comprises silicon nitride.
8. The image sensor defined in claim 1 , wherein the buried light shield structures are formed from tungsten.
9. A method of manufacturing an image sensor, comprising:
forming first and second adjacent photodiodes in a substrate;
forming light shielding structures on the substrate between the first and second photodiodes; and
forming a layer of antireflective coating material on the light shielding structures.
10. The method defined in claim 9 , further comprising:
forming a storage diode associated with the first photodiode in the substrate directly under the light shielding structures.
11. The method defined in claim 10 , further comprising:
forming a transistor in the substrate, wherein the transistor is coupled between the storage diode and the first photodiode.
12. The method defined in claim 9 , wherein forming the layer of antireflective coating material comprises forming a layer of silicon nitride on the light shielding structures.
13. The method defined in claim 9 , further comprising:
forming a dielectric stack on the substrate, wherein the dielectric stack has a first refractive index, wherein the light shielding structures has a second refractive index, and wherein the layer of antireflective coating material has a third refractive index that is between the first and second refractive indices.
14. The method defined in claim 9 , further comprising:
forming a layer of antireflective coating material on the first and second photodiodes, wherein the layer of antireflective coating material on the photodiodes and the layer of antireflective coating material on the light shielding structures are formed from different materials.
15. The method defined in claim 9 , wherein forming the layer of antireflective coating material on the light shielding structures comprises selectively depositing the layer of antireflective coating material on the light shielding structures via a selected one of physical vapor deposition, chemical vapor deposition, and electrochemical deposition.
16. A system, comprising:
a central processing unit;
memory;
a lens;
input-output circuitry; and
an imaging device, wherein the imaging device comprises:
an image sensor having a plurality of image sensor pixels, wherein each image sensor pixel in the plurality of image sensor pixels includes buried light shield structures on which absorptive antireflective coating material is formed.
17. The system defined in claim 16 , wherein the buried light shield structures are formed from tungsten, and wherein the absorptive antireflective coating material is formed from silicon nitride.
18. The system defined in claim 16 , wherein the buried light shield structures are formed between adjacent image sensor pixels in the plurality of image sensor pixels.
19. The system defined in claim 16 , wherein the buried light shield structures are formed from reflective material having a first index of refraction, and wherein the absorptive antireflective coating material has a second index of refraction that is less than the first index of refraction.
20. The system defined in claim 19 , wherein silicon oxide has a third index of refraction, and wherein second index of refraction associated with the absorptive antireflective coating material is greater than the third index of refraction.