Overlap capacitance nanowire
View Patent ↗A device and method for fabricating a nanowire include patterning a first set of structures on a substrate. A dummy structure is formed over portions of the substrate and the first set of structures. Exposed portions of the substrate are etched to provide an unetched raised portion. First spacers are formed about a periphery of the dummy structure and the unetched raised portion. The substrate is etched to form controlled undercut etched portions around a portion of the substrate below the dummy structure. Second spacers are formed in the controlled undercut etched portions. Source/drain regions are formed with interlayer dielectric regions formed thereon. The dummy structure is removed. The substrate is etched to release the first set of structures. Gate structures are formed including a top gate formed above the first set of structures and a bottom gate formed below the first set of structures to provide a nanowire.
1. A semiconductor device, comprising:
one or more fin structures formed on a substrate;
a top gate formed above the one or more fin structures and between first spacers;
a bottom gate formed below the one or fin structures and between second spacers such that the one or more fin structures are directly on the bottom gate, the second spacers formed on a portion of the first spacers, wherein the second spacers include a vertical portion having an inner sidewall that is in contact with the bottom gate that is aligned with a sidewall of the first spacers that are in contact with the top gate, and the second spacers having a horizontal portion present between the substrate and portions of the one or more fin structures that are adjacent to a portion of the substrate that the top gate is overlying, wherein the horizontal portion of the second spacer extends along an entire length of the one or more fin structures that extends beyond a sidewall of the top gate, the horizontal portion of the second spacer having an entirely planar upper surface; and
source/drain regions present on at least a portion of the length of the one or more fin structures that extends beyond the sidewall of the top gate, the source/drain regions having interlayer dielectric regions formed thereon.
2. The semiconductor device as recited in claim 1 , wherein edges of the top gate and the bottom gate are aligned.
3. The semiconductor device as recited in claim 1 , wherein the bottom gate is formed above the substrate.
4. The semiconductor device as recited in claim 1 , wherein the bottom gate is laterally disposed between undercut etched portions.
5. The semiconductor device as recited in claim 4 , wherein the undercut etched portions include dielectric material.
6. The semiconductor device as recited in claim 1 , wherein the top gate includes a top metal gate and the bottom gate includes a bottom metal gate.
7. The semiconductor device as recited in claim 5 , wherein the one or more fins include one or more fins for a nanowire.