IP Library Granted Patent US 9,177,641
Granted Patent B2
US 9,177,641 · App. 14/018,306 · Granted Nov 3, 2015

Memory device

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Quick Facts
Patent No.
US 9,177,641
App. No.
14/018,306
Granted
Nov 3, 2015
Kind
B2
Abstract

According to one embodiment, a memory device includes a memory cell, a sense amplifier, and a resistor. The sense amplifier includes a first input and a second input, outputs a signal in accordance with a difference between the first and second inputs, and is selectively coupled at a second input to the memory cell. The resistor is in a first path between the first input of the sense amplifier and a ground node.

Claims (38)

1. A memory device comprising:

a memory cell comprising a variable resistance;

a sense amplifier comprising a first input and a second input, the sense amplifier outputting a signal in accordance with a difference between the first and second inputs, and being selectively coupled at the second input to the memory cell;

a resistor in a first path between the first input of the sense amplifier and a ground node; and

a second path comprising the memory cell between the second input of the sense amplifier and the ground node,

wherein the resistor has a value between a first resistance of the second path including the memory cell holding first data and a second resistance of the second path including the memory cell holding second data, and

wherein the resistor comprises one of a gate resistance, a diffusion layer resistor, a metal resistor, a transistor resistor, and a combination thereof.

2. The device of claim 1 , wherein the resistor has a value greater than or equal to 10 kΩ.

3. The device of claim 1 , wherein:

the first path includes a first transistor coupled at a first end to the first input of the sense amplifier,

the memory device further comprises a second transistor between the second input of the sense amplifier and the memory cell, and

a gate of the first transistor is coupled to a gate of the second transistor.

4. The device of claim 3 , wherein:

the first transistor clamps a potential of a second end of the first transistor, and

the second transistor clamps a potential of the second transistor at a memory cell side.

5. The device of claim 1 , wherein:

the first path includes a first transistor coupled at a first end to the first input of the sense amplifier, and

the resistor is coupled between a second end of the first transistor and the ground node.

6. The device of claim 5 , wherein:

the second path includes a second transistor coupled at a first end to the second input of the sense amplifier,

the first resistance is a resistance between a second end of the second transistor and the ground node including the memory cell holding the first data, and

the second resistance is a resistance between the second end of the second transistor and the ground node including the memory cell holding the second data.

7. The device of claim 1 , wherein:

the first path includes a first transistor, and

a first end of the first transistor is coupled to the first input of the sense amplifier, and a second end of the first transistor is directly coupled to the resistor.

8. A memory device comprising:

a memory cell with a variable resistance;

a sense amplifier comprising a first input and a second input, the sense amplifier outputting a signal in accordance with a difference between the first and second inputs, and being selectively coupled at a second input to the memory cell;

a first transistor coupled at a first end to the first input of the sense amplifier and clamping a potential of a second end thereof;

a resistor between the second end of the first transistor and a ground node; and

a second transistor coupled at a first end thereof to the second input of the sense amplifier and clamping a potential of a second end thereof,

wherein the resistor has a value between a resistance of a path between the second end of the second transistor and the ground node including the memory cell holding first data and a resistance of a path between the second end of the second transistor and the ground node including the memory cell holding second data, and

wherein the resistor comprises one of a gate resistance, a diffusion layer resistor, a metal resistor, a transistor resistor, and a combination thereof.

9. The device of claim 8 , wherein the resistor has a value greater than or equal to 10 kΩ.

10. The device of claim 8 , wherein:

a gate of the first transistor is coupled to a gate of the second transistor.

11. The device of claim 8 , wherein:

the resistor is directly coupled to the second end of the first transistor.

Assignments (6)
MERGER AND CHANGE OF NAME Recorded Jan 20, 2022
From: TOSHIBA MEMORY CORPORATION; K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 058785/0124 →
CHANGE OF NAME Recorded Jan 20, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 058785/0197 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 8, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION; SK HYNIX, INC.
Reel/Frame 044342/0548 →
CORRECTIVE ASSIGNMENT TO CORRECT THE SECOND ASSIGNEE PREVIOUSLY RECORDED AT REEL: 038449 FRAME: 0194. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2016
From: TAKAHASHI, MASAHIRO; INABA, TSUNEO; KIM, DONG KEUN; LEE, JI WANG
To: KABUSHIKI KAISHA TOSHIBA; SK HYNIX INC.
Reel/Frame 038630/0034 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ADDRESS OF THE SECOND ASSIGNEE PREVIOUSLY RECORDED AT REEL 038270 FRAME 0769. THE ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Apr 16, 2016
From: TAKAHASHI, MASAHIRO; INABA, TSUNEO; KIM, DONG KEUN; LEE, JI WANG
To: KABUSHIKI KAISHA TOSHIBA; SK HYNIX INC.
Reel/Frame 038449/0194 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2016
From: TAKAHASHI, MASAHIRO; INABA, TSUNEO; KIM, DONG KEUN; LEE, JI WANG
To: KABUSHIKI KAISHA TOSHIBA; SK HYNIX INC.
Reel/Frame 038270/0769 →