IP Library Patent Application 14032041
Patent Application
App. No. 14/032,041

Semiconductor Device Manufacturing Line

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Quick Facts
Patent No.
US None
App. No.
14/032,041
Abstract

A semiconductor device manufacturing line includes a process system that includes a plurality of process units of a single wafer process type, and a carrier system that carries wafers to the plurality of process units. The carrier system includes a plurality of carrier units each carrying one wafer from one of the process units to another process unit of a next process.

Claims (9)

1 . A semiconductor device manufacturing line comprising:

a process system comprising a plurality of process units of a single wafer process type; and

a carrier system that carries wafers to the plurality of process units;

wherein the carrier system comprises a plurality of carrier units each carrying one wafer from one of the process units to another process unit of a next process.

2 . The semiconductor device manufacturing line according to claim 1 , wherein the carrier unit comprises an air-tightly closed container.

3 . The semiconductor device manufacturing line according to claim 1 , wherein the carrier system comprises an elevating unit that moves the carrier unit to a height where the carrier unit can be coupled with the process unit.

4 . The semiconductor device manufacturing line according to claim 1 , wherein the plurality of carrier units deliver the wafers to the plurality of process units, respectively, at a same timing.

5 . The semiconductor device manufacturing line according to claim 1 , wherein the process unit comprises at least one chamber processing the wafer.

6 . The semiconductor device manufacturing line according to claim 3 , wherein the process system comprises a high-throughput process unit which receives the wafer from the process system of another semiconductor device manufacturing line provided in a parallel manner, and which returns the processed wafer to the another semiconductor device manufacturing line.

Assignments (4)
CHANGE OF NAME Recorded May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038809/0672 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT LISTED PATENT NUMBER 8853569 TO THE CORRECT PATENT NUMBER 8883569 PREVIOUSLY RECORDED ON REEL 038300 FRAME 0665. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Apr 25, 2016
From: SANDISK 3D LLC
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038520/0552 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2016
From: SANDISK 3D LLC.
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038300/0665 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2013
From: KOIKE, ATSUYOSHI; WAKABAYASHI, TAKAYUKI; KISHI, HIDEKI
To: SANDISK 3D LLC
Reel/Frame 031281/0151 →