Gate height uniformity in semiconductor devices
View Patent ↗Methods of facilitating gate height uniformity by controlling recessing of dielectric material and semiconductor devices formed from the methods are provided. The methods include, for instance, forming a transistor of the semiconductor device with an n-type transistor and a p-type transistor, the n-type transistor and the p-type transistor including plurality of sacrificial gate structures and protective masks at upper surfaces of the plurality of sacrificial gate structures; providing a dielectric material over and between the plurality of sacrificial gate structures; partially densifying the dielectric material to form a partially densified dielectric material; further densifying the partially densified dielectric material to create a modified dielectric material; and creating substantially planar surface on the modified dielectric material, to control dielectric material recess and gate height.
1. A method comprising:
forming a semiconductor device with a p-type transistor and a n-type transistor, the p-type transistor and the n-type transistor comprising plurality of sacrificial gate structures and a protective mask at an upper surface thereof;
providing a dielectric material over and between the plurality of sacrificial gate structures;
partially densifying the dielectric material to form a partially densified dielectric material which extends, at least in part, over a protective mask overlap;
further densifying the partially densified dielectric material to create a modified dielectric material; and
creating substantially planar surface on the modified dielectric material and on the protective mask overlap, to control dielectric material recess and gate height.
2. The method of claim 1 wherein partially densifying the dielectric material comprises annealing the dielectric material.
3. The method of claim 1 wherein further densifying the partially densified dielectric material comprises exposing the partially densified dielectric material to remote plasma.
4. The method of claim 1 wherein further densifying comprises treating the modified dielectric material with at least one of a high density plasma deposition or a plasma-enhanced tetraethyl ortho silicate deposition.
5. The method of claim 1 wherein creating the substantially planar surface comprises planarization of the modified dielectric material.
6. The method of claim 5 wherein the modified dielectric material comprises a high aspect ratio oxide.
7. The method of claim 5 wherein the planarization forms a plasma-treated surface at the protective mask overlap of the p-type transistor and the n-type transistor.
8. The method of claim 1 wherein the dielectric material is conformally deposited about 0 nanometers to about 50 nanometers above the protective mask overlap of the p-type transistor and the n-type transistor.
9. The method of claim 1 wherein further densifying the dielectric material comprises performing controlled planarization of the partially densified dielectric material, the controlled planarization being performed prior to performing further densification of the partially densified dielectric material.
10. The method of claim 9 wherein further densifying the dielectric material comprising partially removing the partially densified dielectric material prior to further densifying the partially densified dielectric material.
11. The method of claim 10 wherein partially removing comprises planarization of the partially densified dielectric material to form a substantially planar surface of about 20 nanometers to about 50 nanometers over the protective mask overlap of the p-type transistor and the n-type transistor.
12. The method of claim 9 wherein creating the substantially planar surface comprises planarization of the modified dielectric material.
13. The method of claim 12 wherein the planarization forms a substantially planar surface at the protective mask overlap of the p-type transistor and the n-type transistor.
14. The method of claim 1 further comprising removing the protective masks to expose the sacrificial gate structures thereafter, and subsequently removing exposed sacrificial gate structures.