Image sensors with in-pixel anti-blooming drains
View Patent ↗An imaging system may include an image sensor having an array of image pixels formed in a substrate. Each image pixel may include a photodiode directly coupled to an anti-blooming diode. The anti-blooming diode may be connected to a positive voltage supply line and may be configured to drain excess charge from the photodiode when the photodiode is saturated. The anti-blooming drain may be formed from an n-type diffusion region partially surrounded by a p-type doped layer. The p-type doped layer may be interposed between and in contact with the n-type diffusion region of the anti-blooming diode and an n-type doped region of the photodiode. The anti-blooming diode may begin to drain excess charge from the photodiode in response to the photodiode reaching a threshold potential during integration. If desired, multiple pixels may share a common anti-blooming diode.
1. An image sensor pixel comprising:
substrate;
a photodiode formed in the substrate; and
an anti-blooming diode formed in the substrate that is directly coupled to the photodiode, wherein the anti-blooming diode is configured to begin draining excess charge in response to the photodiode reaching a threshold voltage and wherein the threshold voltage corresponds to a level of doping in the anti-blooming diode.
2. The image sensor pixel defined in claim 1 wherein the anti-blooming diode comprises an n-type diffusion region at least partially surrounded by a p-type doped region.
3. The image sensor pixel defined in claim 1 wherein the anti-blooming diode is configured to drain excess charge from the photodiode when the photodiode is saturated.
4. The image sensor pixel defined in claim 2 wherein the photodiode comprises an n-type doped region and wherein the p-type doped region is interposed between and in contact with the n-type diffusion region and the n-type doped region.
5. The image sensor pixel defined in claim 4 further comprising:
an electrical contact formed in the substrate in the n-type diffusion region; and
a voltage supply line connected to the electrical contact.
6. The image sensor pixel defined in claim 5 wherein the substrate comprises a surface, the image sensor pixel further comprising:
a p-type doped potential pinning layer interposed between the n-type doped region and the surface of the substrate, wherein the p-type doped potential pinning layer is in contact with the p-type doped region of the anti-blooming diode.
7. The image sensor pixel defined in claim 5 wherein the voltage supply line comprises a positive voltage supply line.
8. An image sensor having an image pixel array, comprising:
a first image pixel comprising a first photodiode;
a second image pixel comprising a second photodiode; and
an anti-blooming diode interposed between and directly coupled to the first and second photodiodes.
9. The image sensor defined in claim 8 wherein the anti-blooming diode is coupled to a voltage supply line.
10. The image sensor defined in claim 8 wherein the anti-blooming diode is configured to drain excess charge from the first photodiode when the first photodiode is saturated and to drain excess charge from the second photodiode when the second photodiode is saturated.
11. The image sensor defined in claim 8 further comprising third and fourth image pixels having respective third and fourth photodiodes, wherein the anti-blooming diode is interposed between and directly coupled to the third and fourth photodiodes.
12. The image sensor defined in claim 9 wherein the anti-blooming diode comprises an n-type diffusion region at least partially surrounded by a p-type doped region.
13. The image sensor defined in claim 12 wherein the first and second photodiodes comprise respective first and second n-type doped regions and wherein the p-type doped region of the anti-blooming diode is interposed between and in contact with the first and second n-type doped regions.
14. The image sensor defined in claim 13 further comprising a p-well formed under the anti-blooming diode and interposed between the first and second photodiodes.
15. A system, comprising:
a central processing unit;
memory;
input-output circuitry; and
an imaging device, wherein the imaging device comprises:
a pixel array having a plurality of image pixels, wherein each image pixel comprises a photodiode, and wherein each photodiode in the pixel array is directly coupled to an anti-blooming diode.
16. The system defined in claim 15 wherein each anti-blooming diode is coupled to a positive voltage supply line.
17. The system defined in claim 15 wherein the photodiodes and the anti-blooming diodes are formed in a substrate having an upper surface, wherein the photodiodes extend to a first depth in the substrate relative to the upper surface, and wherein the anti-blooming diodes extend to a second depth in the substrate relative to the upper surface, and wherein the first depth is greater than the second depth.
18. The system defined in claim 16 wherein each anti-blooming diode comprises an n-type diffusion region surrounded by a p-type doped region.
19. The system defined in claim 18 wherein each photodiode comprises an n-type doped region, wherein the n-type doped region is in contact with the p-type doped region of an associated one of the anti-blooming diodes.