Stacked protection devices and related fabrication methods
View Patent ↗Protection device structures and related fabrication methods and devices are provided. An exemplary device includes a first interface, a second interface, a first protection circuitry arrangement coupled to the first interface, and a second protection circuitry arrangement coupled between the first protection circuitry arrangement and the second interface. The second protection circuitry arrangement includes a first transistor and a diode coupled to the first transistor, wherein the first transistor and the diode are configured electrically in series between the first protection circuitry arrangement and the second interface.
1. A device comprising:
a first interface;
a second interface;
a first protection circuitry arrangement coupled to the first interface; wherein the first protection circuitry arrangement comprises:
a second transistor coupled to the first interface; and
a third transistor;
a second protection circuitry arrangement coupled between the first protection circuitry arrangement and the second interface, the second protection circuitry arrangement comprising:
a first transistor; and
a diode comprising an anode connected to an emitter of the third transistor and a cathode connected to a collector of the first transistor, wherein:
the first transistor and the diode are configured electrically in series between the first protection circuitry arrangement and the second interface;
the diode is configured electronically is series between the first protection circuitry arrangement and the first transistor; and
the third transistor is coupled electrically in series between the second transistor and the diode.
2. The device of claim 1 , wherein:
the first interface comprises a higher voltage terminal; and
the second interface comprises a lower voltage terminal.
3. The device of claim 2 , further comprising functional circuitry coupled between the higher voltage terminal and the lower voltage terminal.
4. The device of claim 1 , wherein the diode comprises a vertical P-N diode.
5. The device of claim 1 , wherein:
the third transistor comprises a base coupled to the anode; and
the first transistor comprises:
a second emitter coupled to the second interface; and
a second base coupled to the second interface.
6. The device of claim 5 , wherein:
the third transistor comprises a second collector; and
the second transistor comprises:
a third collector coupled to the second collector;
a third emitter coupled to the first interface; and
a third base coupled to the first interface.
7. A semiconductor device comprising:
a base region of semiconductor material having a first conductivity type;
an emitter region of semiconductor material within the base region, the emitter region having a second conductivity type opposite the first conductivity type;
a collector region of semiconductor material having the second conductivity type, wherein at least a portion of the base region resides between the emitter region and the collector region;
a buried region of semiconductor material having the second conductivity type, wherein the collector region overlies the buried region and is electrically connected to the buried region;
a cathode region of semiconductor material overlying the buried region and adjacent to the base region, the cathode region having the second conductivity type, wherein the cathode region is electrically connected to the buried region; and
an anode region of semiconductor material overlying and abutting the cathode region, the anode region having the first conductivity type.
8. The semiconductor device of claim 7 , further comprising:
a second base region of semiconductor material having the first conductivity type; and
a second emitter region of semiconductor material having the second conductivity type, wherein the anode region is electrically connected to the second base region and the second emitter region.
9. The semiconductor device of claim 8 , further comprising:
a second collector region of semiconductor material having the second conductivity type, wherein at least a portion of the second base region resides between the second emitter region and the second collector region;
a third base region of semiconductor material having the first conductivity type;
a third emitter region of semiconductor material having the second conductivity type; and
a third collector region of semiconductor material having the second conductivity type, wherein:
at least a portion of the third base region resides between the third emitter region and the third collector region; and
the third collector region is electrically connected to the second collector region.
10. The semiconductor device of claim 9 , further comprising:
a higher voltage terminal; and
a lower voltage terminal, wherein:
the base region and the emitter region are electrically connected to the lower voltage terminal; and
the third base region and the third emitter region are electrically connected to the higher voltage terminal.
11. The semiconductor device of claim 10 , further comprising a substrate shunt region adjacent to the third collector region, the substrate shunt region having the first conductivity type, wherein the substrate shunt region is electrically connected to the lower voltage terminal.
12. The semiconductor device of claim 7 , wherein:
the cathode region and the buried region are abutting; and
the collector region and the buried region are abutting.
13. A method of fabricating an electronic device, the method comprising:
forming a first protection circuitry arrangement on a substrate, wherein forming the first protection circuitry arrangement comprises:
forming a second transistor element in the substrate, the second transistor element including a second base region and a second emitter region electrically connected to the second base region; and
forming a third transistor element in the substrate, the third transistor element including a third base region and a third emitter region electrically connected to the third base region, wherein a third collector region of the third transistor element is electrically connected to a second collector region of the second transistor element;
forming a second protection circuitry arrangement on the substrate, the second protection circuitry arrangement comprising a first transistor element and a diode element formed on the substrate, the diode element including an anode and a cathode, wherein cathode of the diode element is connected to a collector of the first transistor element and the diode element and the first transistor element are configured electrically in series;
providing a first electrical connection between a first device terminal, the second base region, and the second emitter region;
providing a second electrical connection between the second protection circuitry arrangement and a second device terminal; and
providing a third electrical connection between the third emitter region of the third transistor element and the anode of the diode element, wherein the third electrical connection results in the first protection circuitry arrangement and the second protection circuitry arrangement being configured electrically in series between the first device terminal and the second device terminal and the diode element is configured electrically in series between the first protection circuitry arrangement and the first transistor element.
14. The method of claim 13 , wherein forming the second protection circuitry arrangement comprises:
forming a base region of the first transistor element in the substrate, the base region having a first conductivity type;
forming an emitter region of the first transistor element within the base region, the emitter region having a second conductivity type opposite the first conductivity type;
forming a collector region of the first transistor element in the substrate, the collector region having the second conductivity type, wherein at least a portion of the base region resides between the emitter region and the collector region;
forming a cathode region of the diode element in the substrate adjacent to the base region, the cathode region having the second conductivity type; and
forming an anode region of the diode element in the substrate abutting the cathode region, the anode region having the first conductivity type.
15. The method of claim 14 , wherein forming the anode region comprises forming the anode region overlying the cathode region.
16. The method of claim 14 , wherein forming the base region comprises forming the base region adjacent to the collector region.
17. The method of claim 14 , wherein forming the second protection circuitry arrangement further comprises forming a buried region of semiconductor material having the second conductivity type, wherein:
the collector region overlies the buried region and is electrically connected to the buried region;
the cathode region overlies and abuts the buried region; and
the anode region overlies the cathode region.