IP Library Granted Patent US 9,432,033
Granted Patent B2
US 9,432,033 · App. 14/039,562 · Granted Aug 30, 2016

System and method for enabling maximum performance operation within an extended ambient temperature range

Inventor: Jaideep Dastidar (Austin, TX)
Assignee: FREESCALE SEMICONDUCTOR, INC.
H03L7/16H03L1/022
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Quick Facts
Patent No.
US 9,432,033
App. No.
14/039,562
Granted
Aug 30, 2016
Kind
B2
Abstract

A system method of initializing operation of a semiconductor device including detecting de-assertion of an external reset signal while the semiconductor device in a reset state, monitoring a temperature level of the semiconductor device, and while the temperature level is below a predetermined minimum operating temperature level that allows the semiconductor device to operate at a maximum performance level, keeping the semiconductor device in the reset state and asserting at least one operating parameter on the semiconductor device at an elevated level to generate heat on the semiconductor device, and releasing the reset condition when the temperature level is at least the predetermined minimum operating temperature level. The operating parameter may be clock frequency or supply voltage level or a combination of both. Different elevated clock frequencies and/or different minimum operating temperature levels are contemplated. Additionally turning off an external cooling system during the heating process is contemplated.

Claims (33)

1. A method of initializing operation of a semiconductor device, comprising:

detecting de-assertion of an external reset signal while the semiconductor device is in a reset condition;

monitoring a temperature level of the semiconductor device;

while the temperature level is below a predetermined minimum operating temperature level that allows the semiconductor device to operate at a maximum performance level,

keeping the semiconductor device in the reset condition; and

asserting a clock signal to a high frequency block incorporating at least one clock tree on the semiconductor device at an elevated frequency level to generate resistive heat on the semiconductor device while receiving the clock signal; and

releasing the reset condition when the temperature level is at least the predetermined minimum operating temperature level.

2. The method of claim 1 , wherein the clock signal is provided to a high frequency block of the semiconductor device that is unable to operate at the maximum performance level while the temperature level is below the predetermined minimum operating temperature level and the clock signal is at the elevated frequency level.

3. The method of claim 1 , wherein said asserting a clock signal comprises asserting a clock signal at a maximum frequency level of a frequency generator of the semiconductor device.

4. The method of claim 1 , further comprising commanding a supply voltage provided to the semiconductor device to be greater than a predetermined normal operating voltage level.

5. The method of claim 1 , further comprising commanding a supply voltage provided to the semiconductor device to be asserted at a maximum voltage level tolerable by the semiconductor device.

6. The method of claim 1 , wherein said monitoring a temperature level comprises measuring a plurality of temperatures at a plurality of locations on the semiconductor device, and wherein said releasing the reset condition comprises releasing the reset condition when a minimum one of the plurality of temperatures is at least the predetermined minimum operating temperature level.

7. The method of claim 1 , wherein said monitoring a temperature level comprises measuring a plurality of temperature levels at a corresponding plurality of locations of the semiconductor device, wherein each of the plurality of locations of the semiconductor device has a corresponding one of a plurality of minimum operating temperature levels, and wherein said releasing the reset condition comprises releasing the reset condition when a temperature level of each of the plurality of locations has reached a corresponding one of the plurality of minimum operating temperature levels.

8. The method of claim 1 , further comprising commanding that an external cooling system be turned off while the semiconductor device is in the reset condition.

9. A semiconductor device, comprising:

a thermal monitor that monitors a temperature of the semiconductor device and that provides a temperature value indicative thereof;

a frequency control block that asserts a clock signal;

a high frequency block incorporating at least one clock tree that generates resistive heating while receiving said clock signal;

sequence logic that, in response to an external reset signal being de-asserted when said temperature value indicates that the temperature is below a predetermined minimum operating temperature level, commands said frequency control block to assert said clock signal at an elevated frequency level to generate heat on the semiconductor device while maintaining an internal reset state; and

wherein said sequence logic releases said reset state to allow the semiconductor device to operate at a maximum performance level when said temperature value indicates that the temperature is at least said predetermined minimum operating temperature level.

10. The semiconductor device of claim 9 , wherein said clock signal is provided to a high frequency block of the semiconductor device that is unable to operate at said maximum performance level while the temperature is below said predetermined minimum operating temperature level and said clock signal is at the elevated frequency level.

11. The semiconductor device of claim 9 , further comprising:

a voltage control block that asserts a supply voltage request signal; and

wherein said sequence logic commands said voltage control block to request a supply voltage provided to the semiconductor device to be at an elevated voltage level.

12. The semiconductor device of claim 9 , wherein said thermal monitor controls operation of an external cooling system, and wherein said sequence logic further commands said thermal monitor to turn off said external cooling system while said temperature value indicates that the temperature is below a predetermined minimum operating temperature level.

13. A method of initializing operation of a semiconductor device, comprising:

detecting de-assertion of an external reset signal while the semiconductor device is in a reset condition;

monitoring a temperature level of the semiconductor device;

while the temperature level is below a predetermined minimum operating temperature level that allows the semiconductor device to operate at a maximum performance level,

keeping the semiconductor device in the reset condition;

asserting a clock signal to a high frequency block incorporating at least one clock tree on the semiconductor device at an elevated frequency level to generate resistive heat on the semiconductor device while receiving the clock signal; and

commanding a supply voltage provided to the semiconductor device to be greater than a predetermined normal operating voltage level to generate heat on the semiconductor device; and

releasing the reset condition when the temperature level is at least the predetermined minimum operating temperature level.

Assignments (26)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
MERGER Recorded Jan 3, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041144/0363 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PCT NUMBERS IB2013000664, US2013051970, US201305935 PREVIOUSLY RECORDED AT REEL: 037444 FRAME: 0787. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Oct 17, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 040450/0715 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 5, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037444/0787 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0874 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Nov 13, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031627/0201 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Nov 13, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 031627/0158 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 27, 2013
From: DASTIDAR, JAIDEEP
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 031300/0234 →
Continuity (1)
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