Devices and stacked microelectronic packages with in-trench package surface conductors and methods of their fabrication
View Patent ↗Embodiments of methods for forming microelectronic device packages include forming a trench on a surface of a package body between exposed ends of first and second device-to-edge conductors, and forming a package surface conductor in the trench to electrically couple the first and second device-to-edge conductors. In one embodiment, the package surface conductor is formed by first forming a conductive material layer over the package surface, where the conductive material layer substantially fills the trench, and subsequently removing portions of the conductive material layer from the package surface adjacent to the trench. In another embodiment, the package surface conductor is formed by dispensing one or more conductive materials in the trench between the first and second exposed ends (e.g., using a technique such as spraying, inkjet printing, aerosol jet printing, stencil printing, or needle dispense). Excess conductive material may then be removed from the package surface adjacent to the trench.
1. A device, comprising: a package body having a package surface, a first device-to-edge conductor, and a second device-to-edge conductor; a trench formed in the package surface between a first exposed end of the first device-to-edge conductor and a second exposed end of the second device-to-edge conductor; and a package surface conductor in the trench which electrically couples the first device-to-edge conductor and the second device-to-edge conductor, one or more additional trenches in the package surface between one or more additional first exposed ends of one or more additional first device-to-edge conductors and one or more additional second exposed ends of one or more additional second device-to-edge conductors; and one or more additional package surface conductors in the one or more additional trenches to electrically couple the one or more additional first device-to-edge conductors and the one or more additional second device-to-edge conductors.
2. The device of claim 1 , wherein the package surface conductor has a surface that is co-planar with the package surface.
3. The device of claim 1 , wherein the package body comprises:
a first microelectronic package that has an embedded first microelectronic device that is electrically coupled with the first device-to-edge conductor, and a first sidewall that forms a first portion of the package surface;
a second microelectronic package stacked on the first microelectronic package, wherein the second microelectronic package has an embedded second microelectronic device that is electrically coupled with the second device-to-edge conductor, and a second sidewall that forms a second portion of the package surface.
4. The device of claim 1 , wherein the package surface conductor is formed from one or more conductive materials selected from an electrically conductive adhesive, conductive polymer, a polymer filled with conductive particles, a metal alloy, metal coated organic particles, metal coated ceramic particles, solder paste, solder-filled adhesive, nanoparticle-filled ink, a liquid metal, a metal-containing adhesive, a metal-containing epoxies, electrically-conductive pastes, indium, and bismuth.