IP Library Granted Patent US 9,691,955
Granted Patent B2
US 9,691,955 · App. 14/046,719 · Granted Jun 27, 2017

Solid state lighting devices with improved contacts and associated methods of manufacturing

Inventor: Martin F. Schubert (Boise, ID)
Assignee: Micron Technology, Inc.
H01L33/62H01L33/10H01L33/36H01L33/38H01L33/385H01L33/387H01L33/40H01L33/405H01L33/42H01L33/44H01L33/46H01L33/60H01L33/382H01L51/5212H01L2251/5361H01L2924/0002H01L2933/0016H01L2933/0066
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,691,955
App. No.
14/046,719
Granted
Jun 27, 2017
Kind
B2
Abstract

Solid state lighting (“SSL”) devices with improved contacts and associated methods of manufacturing are disclosed herein. In one embodiment, an SSL device includes an SSL structure having a first semiconductor material, a second semiconductor material spaced apart from the first semiconductor material, and an active region between the first and second semiconductor materials. The SSL device also includes a first contact on the first semiconductor material and a second contact on the second semiconductor material, where the first and second contacts define the current flow path through the SSL structure. The first or second contact is configured to provide a current density profile in the SSL structure based on a target current density profile.

Claims (38)

1. A solid state lighting (“SSL”) device, comprising:

a substrate;

an SSL structure on the substrate, the SSL structure having a first semiconductor material proximate the substrate, a second semiconductor material spaced apart from the first semiconductor material, and an active region between the first and second semiconductor materials;

a first contact on the first semiconductor material;

a second contact on the second semiconductor material, wherein the first and second contacts define a current flow path through the SSL structure; and

wherein the second contact includes an insulative material and a transparent conductive material, and wherein

the insulative material has a surface facing away from the second semiconductor material and a plurality of openings at the surface, and wherein the insulative material has a first insulative portion and a second insulative portion positioned to straddle the first insulative portion, and wherein the first insulative portion has a first contact resistance, and wherein the second insulative portion has a second contact resistance, and wherein the first contact resistance is higher than the second contact resistance, and

the conductive material has a first portion in the openings and a second portion extending laterally on the surface of the insulative material, wherein at least a portion of light generated by the active region exits the SSL device through the conductive material, and

wherein the second contact is configured to provide defined current flow paths through the first and second semiconductor materials that provide a current density profile in the SSL structure based on a target current density profile.

2. The SSL device of claim 1 wherein the insulative material is configured to impede a current flow through a region of the SSL structure.

3. The SSL device of claim 1 wherein the conductive material is configured to increase a current conductance through a region of the SSL structure.

4. The SSL device of claim 1 wherein at least one of the openings has a shape that is different from the other openings.

5. The SSL device of claim 1 wherein at least one of the openings has a size that is different from the other openings.

6. The SSL device of claim 1 wherein at least one of the openings has a shape and size that are different from the other openings.

7. The SSL device of claim 1 wherein the plurality of openings extend from the second semiconductor material to the surface of the insulative material.

8. The SSL device of claim 1 wherein the conductive material is selected from the group consisting of indium tin oxide, aluminum zinc oxide, and fluorine-doped tin oxide.

9. The SSL device of claim 1 wherein

the first portion is selected from the group consisting of copper, aluminum, silver, gold, and platinum; and

the second portion is selected from the group consisting of indium tin oxide, aluminum zinc oxide, and fluorine-doped tin oxide.

10. The SSL device of claim 1 wherein the substrate includes silicon.

11. The SSL device of claim 1 wherein the second portion of the second contact is a contact portion.

12. An SSL device, comprising:

an SSL structure having a first semiconductor material, a second semiconductor material spaced apart from the first semiconductor material, and an active region between the first and second semiconductor materials;

a first contact on the first semiconductor material;

a second contact on the second semiconductor material; and

wherein the first or the second contact includes an insulative material and a transparent conductive material, and wherein

the insulative material has a surface facing away from the corresponding first or second semiconductor material and a plurality of openings at the surface, and wherein the insulative material has a first insulative portion and a second insulative portion positioned to straddle the first insulative portion, and wherein the first insulative portion has a first contact resistance, and wherein the second insulative portion has a second contact resistance, and wherein the first contact resistance is higher than the second contact resistance, and

the conductive material has a first portion in the openings and a second portion extending laterally on the surface of the insulative material, wherein at least a portion of light generated by the active region exits the SSL device through the conductive material.

13. An SSL device, comprising:

a substrate material including silicon;

a first semiconductor material on the substrate material;

a second semiconductor material;

an active region between the first and second semiconductor materials;

a first contact on the first semiconductor material;

a second contact on the second semiconductor material, wherein the second contact includes an insulative material and a transparent conductive material, and wherein

the insulative material has a surface facing away from the second semiconductor material and a plurality of openings at the surface, wherein at least one of the openings has a shape and size that is different from the other openings, and wherein the insulative material has a first insulative portion and a second insulative portion positioned to straddle the first insulative portion, and wherein the first insulative portion has a first contact resistance, and wherein the second insulative portion has a second contact resistance, and wherein the first contact resistance is higher than the second contact resistance, and

the conductive material has a first portion in the openings and a second portion extending laterally on the surface of the insulative material, wherein at least a portion of light generated by the active region exits the SSL device through the conductive material.

14. The SSL device of claim 13 wherein the conductive material is selected from the group consisting of indium tin oxide, aluminum zinc oxide, and fluorine-doped tin oxide.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Continuity (2)
Division 12872092 · Aug 31, 2010
Related Publication 20140042484A1 · Feb 13, 2014