Patent Application

App. No. 14/056,644

Abstract

Claims (41)

1 . A device package comprising:

one or more electrical components;

a molding compound overlying the one or more electrical components;

a frame structure circumscribing the one or more electrical components; and

a shielding structure overlying the frame structure and the one or more electrical components, wherein:

the shielding structure contacts a first surface of the frame structure;

at least a portion of the molding compound resides between the shielding structure and the one or more electrical components; and

the first surface of the frame structure is aligned with a second surface of the portion of the molding compound.

2 . The device package of claim 1 , wherein the shielding structure is planar.

3 . The device package of claim 1 , wherein a planar surface of the shielding structure abuts the first surface and the second surface.

4 . The device package of claim 1 , wherein the second surface is planar.

5 . The device package of claim 4 , wherein the shielding structure contacts the second surface.

6 . The device package of claim 5 , wherein the shielding structure comprises a planar surface abutting the first surface and the second surface.

7 . The device package of claim 1 , wherein the shielding structure is bonded to the frame structure.

8 . The device package of claim 1 , wherein:

a second portion of the molding compound resides laterally between the frame structure and the one or more electrical components; and

the frame structure resides laterally between the second portion of the molding compound and a third portion of the molding compound.

9 . The device package of claim 1 , further comprising a routing structure, wherein the one or more electrical components, the frame structure, and the molding compound overlie the routing structure.

10 . The device package of claim 9 , further comprising a connection structure to receive a reference voltage, wherein the routing structure provides an electrical connection between the connection structure and the frame structure.

11 . A device package comprising:

a routing structure;

one or more electrical components overlying the routing structure;

a molding compound overlying the routing structure and the one or more electrical components, the molding compound having a planar upper surface;

a frame structure overlying the routing structure and circumscribing the one or more electrical components, the frame structure having an upper surface aligned with the planar upper surface, wherein at least a first portion of the molding compound resides between the frame structure and the one or more electrical components and a second portion of the molding compound circumscribes the frame structure; and

a shielding structure overlying the frame structure and the one or more electrical components, wherein the shielding structure contacts the upper surface of the frame structure and at least a third portion of the molding compound resides between the shielding structure and the one or more electrical components.

12 . The device package of claim 11 , further comprising a connection structure to receive a ground reference voltage, wherein the routing structure provides an electrical connection between the connection structure and the frame structure.

13 . A method of fabricating a device package, the method comprising:

providing a frame structure circumscribing one or more electrical components, the frame structure having a first surface;

forming a molding compound overlying the one or more electrical components, the molding compound having a second surface aligned with the first surface, wherein a first portion of the molding compound resides between the frame structure and the one or more electrical components; and

providing a shielding structure overlying the frame structure and the one or more electrical components, wherein the shielding structure contacts the first surface of the frame structure and a second portion of the molding compound resides between the one or more electrical components and the shielding structure.

14 . The method of claim 13 , wherein forming the molding compound comprises:

forming the molding compound overlying the one or more electrical components and the frame structure; and

removing portions of the molding compound to obtain the second surface of the molding compound that is substantially aligned with the first surface of the frame structure.

15 . The method of claim 14 , wherein removing portions of the molding compound comprises planarizing the molding compound to remove excess portions of the molding compound overlying the frame structure to expose the first surface.

16 . The method of claim 14 , wherein removing portions of the molding compound comprises uniformly grinding the molding compound to a thickness that results in the first surface of the frame structure being exposed.

17 . The method of claim 13 , wherein forming the molding compound comprises forming the molding compound overlying the one or more electrical components to a height of the frame structure.

18 . The method of claim 13 , wherein providing the shielding structure comprises depositing a layer of a conductive material overlying the frame structure and the molding compound.

19 . The method of claim 13 , wherein providing the shielding structure comprises bonding a conductive material to the frame structure.

20 . The method of claim 13 , further comprising:

forming a routing structure on the frame structure and the one or more electrical components; and

forming a connection interface for receiving a ground reference voltage on the routing structure, wherein the routing structure provides an electrical connection between the connection interface and the frame structure.

Assignments (22)