Granted Patent B2

US 9,129,951 · App. 14/056,930 · Granted Sep 8, 2015

Abstract

Claims (11)

1. A semiconductor device, comprising:

a package;

a semiconductor die embedded in the package;

a plurality of leads including at least one lead that has a first end extending outside of the package and a second end embedded in the package, the lead being formed of a conductive material and having opposing first and second main surfaces and opposing first and second side surfaces each extending between the first and second main surfaces;

a bond wire embedded in the package and having a first end electrically connected to the semiconductor die and a second end electrically connected proximate to the second end of the lead; and

an insulative layer formed on the first main surface and the first and second side surfaces of the lead at least proximate the second end of the lead, wherein the insulative layer fills a gap between the lead and an adjacent lead at least at an area proximate the second end of the lead, the bond wire extending through an opening in the insulative layer on the first main surface of the lead to electrically connect with the lead.

2. The semiconductor device of claim 1 , wherein the insulative layer is made from a polymeric material having a melting temperature above about 250° C.

3. The semiconductor device of claim 2 , wherein the polymeric material is polytetrafluoroethylene.

4. The semiconductor device of claim 1 , wherein the insulative layer has a thickness of greater than about 1 micron.

5. The semiconductor device of claim 1 , further comprising a coating of silver disposed between the conductive material and the insulative layer on at least the first main surface of the lead at least proximate the second end of the lead.

6. The semiconductor device of claim 1 , wherein the conductive material of the lead is copper.

Assignments (22)