Formation of a high aspect ratio trench in a semiconductor substrate and a bipolar semiconductor device having a high aspect ratio trench isolation region
Disclosed is a trench formation technique wherein a first etch process forms an opening through a semiconductor layer into a semiconductor substrate and then a second etch process expands the portion of the opening within the substrate to form a trench. However, prior to the second etch, a doped region is formed in the substrate at the bottom surface of the opening. Then, the second etch is performed such that an undoped region of the substrate at the sidewalls of the opening is etched at a faster etch rate than the doped region, thereby ensuring that the trench has a relatively high aspect ratio. Also disclosed is a bipolar semiconductor device formation method. This method incorporates the trench formation technique so that a trench isolation region formed around a collector pedestal has a high aspect ratio and, thereby so that collector-to-base capacitance C cb and collector resistance R c are both minimized.
1. A method comprising:
providing a semiconductor substrate;
depositing a semiconductor layer on a top surface of said semiconductor substrate;
performing a first etch process to form an opening extending vertically through said semiconductor layer into said semiconductor substrate such that said opening has sidewalls and a bottom surface within said semiconductor substrate, said semiconductor substrate comprising a first semiconductor material and said semiconductor layer comprising a second semiconductor material different from said first semiconductor material;
implanting a dopant into said semiconductor substrate to form a doped region immediately adjacent to said bottom surface of said opening; and
performing a second etch process such that an undoped region of said semiconductor substrate immediately adjacent to said sidewalls is etched at a faster etch rate than said semiconductor layer and said doped region in order to form a trench within said semiconductor substrate below said semiconductor layer.
2. The method of claim 1 , said faster etch rate of said undoped region ensures that, after said second etch process, said trench has a relatively high aspect ratio with a depth of said trench being less than a width of said trench.
3. The method of claim 1 , said trench having a center portion extending a first depth into said semiconductor substrate and edges portions extending a second depth into said semiconductor substrate, said second depth being greater than said first depth.
4. The method of claim 1 , said first semiconductor material comprising silicon and said second semiconductor material comprising a silicon germanium.
5. The method of claim 1 , said dopant comprising any of germanium, boron, arsenic, argon, neon, and silicon.
6. The method of claim 1 , said second etch process having an etch selectivity of approximately 5:1 to 200:1 for said undoped region over said doped region.
7. The method of claim 1 , further comprising, before said forming of said opening, forming at least one protective layer on said semiconductor layer such that, during said implanting, said semiconductor layer is protected from dopant implantation.
8. The method of claim 1 , further comprising filling said trench with at least one isolation material to form a trench isolation region.
9. A method comprising:
providing a semiconductor substrate;
forming a first semiconductor layer on said semiconductor substrate;
forming a second semiconductor layer on said first semiconductor layer, said semiconductor substrate and said second semiconductor layer comprising a first semiconductor material and said first semiconductor layer comprising a second semiconductor material that is different from said first semiconductor material;
performing a first etch process so as to form an opening extending vertically through said second semiconductor layer and said first semiconductor layer into said semiconductor substrate such that said opening has sidewalls and a bottom surface within said semiconductor substrate;
implanting a dopant into said semiconductor substrate to form a doped region immediately adjacent to said bottom surface of said opening;
performing a second etch process such that said second semiconductor layer and an undoped region of said semiconductor substrate immediately adjacent to said sidewalls are etched at a faster etch rate than said first semiconductor layer and said doped region in order to form a trench within said semiconductor substrate below said first semiconductor layer; and
after said forming of said trench, filling said trench with at least one isolation material in order to form a trench isolation region.
10. The method of claim 9 , said faster etch rate of said undoped region ensures that, after said second etch process, said trench has a relatively high aspect ratio with a depth of said trench being less than a width of said trench.
11. The method of claim 9 , said trench having a center portion extending a first depth into said semiconductor substrate and edges portions extending a second depth into said semiconductor substrate, said second depth being greater than said first depth.
12. The method of claim 9 , said first semiconductor material comprising silicon and said second semiconductor material comprising a silicon germanium.
13. The method of claim 9 , said dopant comprising any of germanium, boron, arsenic, argon, neon, and silicon.
14. The method of claim 9 , said second etch process having an etch selectivity of approximately 5:1 to 200:1 for said undoped region over said doped region.
15. The method of claim 9 , further comprising, before said forming of said opening, forming at least one protective layer on said second semiconductor layer such that, during said implanting, said second semiconductor layer is protected from dopant implantation.
16. The method of claim 9 , further comprising:
before said forming of said first semiconductor layer, forming a first terminal region for a bipolar semiconductor device in said semiconductor substrate, said trench being formed so as to be positioned laterally adjacent to said first terminal region; and
after said forming of said trench, forming a second terminal region for said bipolar semiconductor device in said first semiconductor layer above said first terminal region and a third terminal region for said bipolar semiconductor device in said second semiconductor layer above said second terminal region.
17. A method comprising:
performing a first etch process to form an opening extending vertically through a semiconductor layer into a semiconductor substrate such that said opening has sidewalls and a bottom surface within said semiconductor substrate, said semiconductor substrate comprising silicon and said semiconductor layer comprising silicon germanium;
implanting a dopant into said semiconductor substrate to form a doped region immediately adjacent to said bottom surface of said opening; and
performing a second etch process such that an undoped region of said semiconductor substrate immediately adjacent to said sidewalls is etched at a faster etch rate than said semiconductor layer and said doped region in order to form a trench within said semiconductor substrate below said semiconductor layer.
18. The method of claim 17 , said faster etch rate of said undoped region ensures that, after said second etch process, said trench has a relatively high aspect ratio with a depth of said trench being less than a width of said trench.
19. The method of claim 17 , said trench having a center portion extending a first depth into said semiconductor substrate and edges portions extending a second depth into said semiconductor substrate, said second depth being greater than said first depth.