Semiconductor device packages using a thermally enhanced conductive molding compound
View Patent ↗A heat transportation mechanism that is thermally conductive, but not electrically conductive, is provided so as to permit transportation of heat generated by a semiconductor device die to the exterior of a semiconductor device package. Embodiments can use a thermally conductive polymer structure, added to the package mold compound, to transport heat through the mold compound. The thermally conductive polymer structure can be fixed to the semiconductor device die prior to molding or can be included in an overmolding compound slug prior to performing the overmolding process. Flexibility of placement of the thermally conductive polymer structure is provided by using dielectric compounds.
1. A method for packaging an electronic device assembly, the method comprising:
placing a first electronic device in a first area of a package substrate for the electronic device assembly;
affixing a thermally conductive structure to a major surface of the first electronic device, wherein
the thermally conductive structure comprises thermally conductive polymers,
the thermally conductive polymers are dielectric materials, and
the thermally conductive structure is affixed at a first end to the first electronic device and is free at a second end of the thermally conductive structure;
forming an encapsulant over and around sides of the first electronic device and over and around sides of the thermally conductive structure;
exposing a portion of the thermally conductive polymers at the second end of the thermally conductive structure at a first major surface of the encapsulated electronic device assembly; and
affixing a heat sink to the first major surface of the encapsulated electronic device assembly, wherein
the heat sink is configured to dissipate heat transported from the first electronic device through the thermally conductive structure, and
said affixing is performed by applying a thermally conductive adhesive directly to the second end of the thermally conductive structure and the heat sink coupled directly to the thermally conductive adhesive.
2. The method of claim 1 wherein said exposing further comprises removing a portion of the encapsulant from the electronic device assembly.
3. The method of claim 2 wherein said removing further comprises one of:
grinding the encapsulant from the electronic device assembly to a depth matching the second end of the thermally conductive structure; and
laser ablating the encapsulant from the electronic device assembly to a depth matching the end of the thermally conductive structure.
4. The method of claim 1 wherein said exposing further comprises performing said forming the encapsulant such that the second end of the thermally conductive structure is exposed without removing a portion of the encapsulant.
5. The method of claim 1 further comprising:
forming the thermally conductive structure to provide a directional thermal conduction path from the first electronic device to the first major surface of the encapsulated electronic device assembly.
6. The method of claim 5 wherein said forming the thermally conductive structure comprises:
forming the thermally conductive structure such that the thermally conductive polymers are in one of a strain, nanofiber, or plane formation.
7. The method of claim 1 wherein said affixing the thermally conductive structure to the major surface of the first electronic device comprises using an adhesive layer to attach the thermally conductive structure to the major surface, wherein the adhesive layer is thermally conductive.
8. The method of claim 1 further comprising:
performing said packaging the electronic device assembly in a pressure molding device;
providing the encapsulant to the pressure molding device in a slug comprising the encapsulant and the thermally conductive structure, wherein the thermally conductive structure is suspended in the encapsulant within the slug.
9. The method of claim 8 wherein said affixing the thermally conductive structure to the major surface of the first electronic device comprises:
heating the slug and applying pressure to the slug such that the encapsulant fills a mold of the pressure molding device;
locating the thermally conductive structure on the first major surface during said applying pressure; and
cooling the encapsulant such that the thermally conductive structure remains in contact with the major surface of the first electronic device.