Semiconductor device and method of assembling same
View Patent ↗A semiconductor device includes a lead frame having a down bond area, a die attach area and a dam formed between the down bond area and the die attach area. A bottom of the dam is attached on a surface of the lead frame. The dam prevents contamination of the down bond area from die attach material, which may occur during a die attach process.
1. A semiconductor device, comprising:
a lead frame having a down bond area and a die attach area; and
a dam formed between the down bond area and the die attach area, wherein a bottom of the dam is attached on a surface of the lead frame, and wherein the dam prevents contamination of the down bond area from die attach material, wherein the dam comprises a wire having a series of abutting stitch bonds.
2. The semiconductor device of claim 1 , further comprising:
a first die attached on the die attach area; and
a bond wire electrically connecting the first die to the down bond area.
3. The semiconductor device of claim 1 , further comprising:
a first die attached on the die attach area;
a second lead frame having a second die attach area;
a second die attached to the second die attach area; and
a bond wire electrically connecting the second die to the down bond area.
4. The semiconductor device of claim 1 , wherein the dam is attached seamlessly on the surface of the lead frame.
5. The semiconductor device of claim 1 , wherein the wire is one of an Al, Cu and Au wire.
6. The semiconductor device of claim 1 , wherein the wire is attached to the surface of the first lead frame with a wedge bonding apparatus.
7. The semiconductor device of claim 1 , wherein adjacent stitch bonds at least partially overlap.
8. A method for packaging a semiconductor device, the method comprising:
providing a lead frame having a die attach area and a down bond area; and
forming a dam between a down bond area and a die attach area of the lead frame, wherein a bottom of the dam is attached on a surface of the lead frame, and wherein the dam prevents contamination of the down bond area from die attach material, wherein the dam is a wire that is attached to the surface of the lead frame with a stitch bonding process.
9. The method of claim 8 , further comprising:
attaching a first die on the die attach area; and
electrically connecting the first die to the down bond area with a bond wire.
10. The method of claim 8 , further comprising:
attaching a first die on the die attach area; and
electrically connecting a second die attached on a second die attach area of a second lead frame to the down bond area with a bond wire.
11. The method of claim 8 , wherein the dam is attached seamlessly on the surface of the first lead frame.
12. The method of claim 8 , wherein the wire is one of an Al, Cu and Au wire.
13. The method of claim 8 , wherein the wire is attached to the surface of the first lead frame with a wedge bonding apparatus.