Semiconductor devices with integrated Schottky diodes and methods of fabrication
View Patent ↗An embodiment of a semiconductor device includes a semiconductor substrate that includes an upper surface and a channel, a gate electrode disposed over the substrate electrically coupled to the channel, and a Schottky metal layer disposed over the substrate adjacent the gate electrode. The Schottky metal layer includes a Schottky contact electrically coupled to the channel which provides a Schottky junction and at least one alignment mark disposed over the semiconductor substrate. A method for fabricating the semiconductor device includes creating an isolation region that defines an active region along an upper surface of a semiconductor substrate, forming a gate electrode over the semiconductor substrate in the active region, and forming a Schottky metal layer over the semiconductor substrate. Forming the Schottky metal layer includes forming at least one Schottky contact electrically coupled to the channel and providing a Schottky junction, and forming an alignment mark in the isolation region.
1. A semiconductor device comprising:
a semiconductor substrate that includes an upper surface and a channel;
a gate electrode disposed over the semiconductor substrate electrically coupled to the channel;
a Schottky contact disposed over the semiconductor substrate in an active region adjacent the gate electrode, wherein the Schottky contact is formed from a Schottky metal layer, and the Schottky contact is electrically coupled to the channel forming a Schottky junction; and
at least one alignment mark disposed over the semiconductor substrate outside of the active region, wherein the at least one alignment mark also is formed from the Schottky metal layer and forms a metal-semiconductor contact with the semiconductor substrate.
2. The semiconductor device of claim 1 , further comprising an active region that includes the gate electrode and the Schottky contact.
3. The semiconductor device of claim 1 , further comprising an isolation region that includes the alignment mark.
4. The semiconductor device of claim 1 , wherein the Schottky metal layer further comprises a metal with a work function of at least 4.5 electron volts in contact with the upper surface of the semiconductor substrate.
5. The semiconductor device of claim 1 , wherein the gate electrode is configured as a Schottky gate.
6. The semiconductor device of claim 1 , further comprising an ohmic contact electrically coupled to the channel.
7. The semiconductor device of claim 1 , wherein the Schottky contact forms a drain terminal.
8. The semiconductor device of claim 1 , wherein the Schottky contact forms a source terminal.
9. The semiconductor device of claim 1 , wherein the semiconductor substrate further comprises one or more layers selected from Ga-polar group III-nitride semiconductors or N-polar group III-nitride semiconductors.
10. The semiconductor device of claim 1 , wherein the semiconductor substrate further comprises:
a channel layer; and
a barrier layer adjacent the channel layer, wherein the upper surface of the semiconductor substrate is over the barrier layer.
11. A gallium nitride (GaN) transistor device comprising:
a semiconductor substrate with an upper surface comprising a host substrate and a group III nitride semiconductor epitaxial layer disposed over the host substrate and configured to include a channel;
an isolation region defining an active region along an upper surface of the semiconductor substrate;
a gate electrode disposed over the semiconductor substrate in the active region;
at least one Schottky contact disposed over the semiconductor substrate in the active region adjacent the gate electrode, wherein the at least one Schottky contact is formed from a Schottky metal layer, and the at least one Schottky contact is electrically coupled to the channel in the active region forming at least one Schottky junction in the active region; and
at least one alignment mark disposed over the semiconductor substrate in the isolation region, wherein the at least one alignment mark also is formed from the Schottky metal layer and forms a metal-semiconductor contact with the semiconductor substrate.
12. The GaN transistor device of claim 11 wherein the Schottky metal layer comprises a nickel layer in contact with the upper surface of the semiconductor substrate.
13. The GaN transistor device of claim 11 further comprising a first dielectric layer disposed over the semiconductor substrate.
14. The GaN transistor of claim 13 wherein the semiconductor substrate further comprises:
a channel layer; and
a barrier layer adjacent the channel layer, wherein the upper surface of the semiconductor substrate is over the barrier layer.
15. A method of fabricating a semiconductor device, the method comprising:
creating an isolation region that defines an active region along an upper surface of a semiconductor substrate;
forming a gate electrode over the semiconductor substrate in the active region; and
forming both a Schottky contact in the active region and an alignment mark in the isolation region from a Schottky metal layer disposed over the semiconductor substrate, wherein the at least one Schottky contact is electrically coupled to a channel and provides a Schottky junction.
16. The method of claim 15 further comprising defining the channel by depositing a group III-nitride channel layer over a host substrate and a group III-nitride barrier layer over the channel layer.
17. The method of claim 15 further comprising depositing a first dielectric layer over the semiconductor substrate wherein the first dielectric layer comprises low pressure chemical vapor deposition silicon nitride.
18. The method of claim 17 further comprising etching openings in the first dielectric layer to form a Schottky contact opening and an alignment mark opening.
19. The method of claim 15 further comprising forming the Schottky contact and the alignment mark using a same mask level.