Methods of making semiconductor devices with low leakage Schottky contacts
View Patent ↗Embodiments include methods of making semiconductor devices with low leakage Schottky contacts. An embodiment includes providing a partially completed semiconductor device including a substrate, a semiconductor on the substrate, and a passivation layer on the semiconductor, and using a first mask, locally etching the passivation layer to expose a portion of the semiconductor. Without removing the first mask, a Schottky contact is formed of a first material on the exposed portion of the semiconductor, and the mask is removed. Using a further mask, a step-gate conductor of a second material electrically coupled to the Schottky contact is formed overlying parts of the passivation layer adjacent to the Schottky contact. By minimizing the process steps between opening the Schottky contact window in the passivation layer and forming the Schottky contact material in this window, the gate leakage of a resulting field effect device having a Schottky gate may be substantially reduced.
1. A method of making a semiconductor device, the method comprising:
providing a semiconductor having a semiconductor surface that includes a mesa, wherein the mesa is defined by a first portion of the semiconductor that is thicker than a second portion of the semiconductor;
forming a passivation layer on the mesa;
providing a first mask overlying the passivation layer with a first mask opening over the mesa and adapted to define a Schottky contact;
etching through the passivation layer under the first mask opening to expose part of the semiconductor surface;
depositing through the first mask opening the Schottky contact having a first width on the exposed part of the semiconductor surface, wherein the Schottky contact directly contacts the semiconductor surface, and wherein the passivation layer top surface is at a first height above the semiconductor surface, and the Schottky contact has a second height above the semiconductor surface that is less than the first height;
providing a second mask overlying the passivation layer with a second mask opening encompassing the Schottky contact, the second mask opening having a second width that is greater than the first width;
forming a further conductor within the second mask opening on the Schottky contact and extending over portions of the passivation layer on either side of the Schottky contact, wherein the further conductor has the second width; and
forming spaced apart Ohmic source and drain contacts on the mesa before or after depositing the Schottky contact.
2. The method of claim 1 , wherein the semiconductor comprises a type IV, III-V, II-VI material or a combination thereof.
3. The method of claim 2 , wherein the semiconductor comprises GaN.
4. The method of claim 1 , wherein the semiconductor device is a field effect transistor.
5. A method of making a semiconductor device with a Schottky contact, the method comprising:
providing a partially completed field effect transistor comprising
a semiconductor and a passivation layer on a surface of the semiconductor, wherein the semiconductor includes a mesa that is defined by an upper portion of the semiconductor that is thicker than a lower portion of the semiconductor, and the passivation layer covers the mesa and has a first height above the surface of the semiconductor;
providing a first mask with a first opening therein overlying part of the passivation layer, the first opening having a first width, and the first opening located above the mesa;
etching the passivation layer through the first opening to expose a first portion of the surface of the semiconductor under the first opening, and to define an opening in the passivation layer having the first width, and to define passivation layer sidewalls adjacent to the first portion of the surface of the semiconductor;
without removing the first mask, forming the Schottky contact of a first conductive material on the first portion of the surface of the semiconductor, wherein the Schottky contact directly contacts the upper portion of the surface of the semiconductor, and the Schottky contact has a contact top surface and contact sidewalls along an extent from the surface of the semiconductor to the contact top surface, wherein the contact sidewalls are in direct contact with the passivation layer sidewalls, a width of the Schottky contact equals the first width, and the Schottky contact has a second height above the semiconductor surface that is less than the first height;
removing the first mask;
providing a second mask on the passivation layer with a second opening encompassing the Schottky contact, the second opening having a second width that is greater than the first width;
forming a step-gate conductor through the second opening, electrically coupled to the Schottky contact, the step-gate conductor having the second width and overlying parts of the passivation layer adjacent to the Schottky contact; and
forming spaced apart Ohmic source and drain contacts on the mesa before or after depositing the Schottky contact.
6. The method of claim 5 , wherein the semiconductor comprises a type IV, III-V, II-VI material or combinations thereof.
7. The method of claim 5 , wherein the semiconductor comprises GaN, SiC, AlGaN or combinations thereof.
8. The method of claim 5 , wherein the step-gate conductor is formed to directly contact the passivation layer.