IP Library Granted Patent US 9,182,490
Granted Patent B2
US 9,182,490 · App. 14/092,611 · Granted Nov 10, 2015

Video and 3D time-of-flight image sensors

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Quick Facts
Patent No.
US 9,182,490
App. No.
14/092,611
Granted
Nov 10, 2015
Kind
B2
Abstract

Electronic devices may include time-of-flight (ToF) image pixels. Each ToF pixel may include a photodiode, a first capacitor coupled to the photodiode via a first transfer gate, a second capacitor coupled to the photodiode via a second transfer gate, and a third capacitor coupled to the photodiode via a third transfer gate. The first transfer gate may be turned on for a given duration to store a first charge in the first capacitor. The second transfer gate may be turned on for the given duration to store a second charge in the second capacitor. The third transfer gate may be turned on for a duration that is longer than the given duration to store a third charge in the third capacitor. Depth information may be computed based on the first, second, and third stored charges and a corresponding pixel constant.

Claims (54)

1. An image sensor for imaging a scene having at least some background light, comprising:

a non-visible light emitter that emits non-visible light; and

a time-of-flight (ToF) image pixel, comprising:

a floating diffusion node;

a photosensitive element;

a first storage element coupled between the floating diffusion node and the photosensitive element that receives charge generated at least partially from reflected portions of the non-visible light; and

a second storage element coupled between the floating diffusion node and the photosensitive element that receives charge generated only from the background light.

2. The image sensor defined in claim 1 , wherein the non-visible light emitter comprises an infrared pulse emitter.

3. The image sensor defined in claim 1 , wherein the first and second storage elements comprise capacitors.

4. The image sensor defined in claim 1 , wherein the time-of-flight image pixel further includes:

a third storage element that receives charge generated at least partially from the reflected emitter non-visible light;

a first charge transfer gate coupled between the first storage element and the photosensitive element;

a second charge transfer gate coupled between the second storage element and the photosensitive element; and

a third charge transfer gate coupled between the third storage element and the photosensitive element.

5. The image sensor defined in claim 4 , further comprising:

a first control line on which a first control signal that controls the first charge transfer gate is provided;

a second control line on which, a second control signal that controls the second charge transfer gate is provided; and

a third control line on which a third control signal that controls the third charge transfer gate is provided.

6. The image sensor defined in claim 5 , wherein the second storage element has a storage capacity that is at bigger than that of the first storage element, wherein the first control signal is pulsed high for a first duration, wherein the third control signal is pulsed high for the first duration, and wherein the second control signal is pulsed high for a second duration that is longer than the first duration.

7. The image sensor defined in claim 1 , further comprising:

processing circuitry operable to compute depth information based on charges stored in the first and second storage elements.

8. The image sensor defined in claim 1 , further comprising:

a dual-band filter-formed on top of the time-of-flight image pixel, wherein the dual-band filter passes at least some visible light and at least some non-visible light.

9. A method of operating an image sensor that includes a non-visible light emitter and a time-of-flight (ToF) Image pixel the method comprising:

while the non-visible light emitter is activated, transferring charge to a first memory element in the time-of-flight image pixel;

while the non-visible light emitter is deactivated, transferring charge to a second memory element in the time-of-flight image pixel; and

while the non-visible light emitter is deactivated, transferring charge to a third memory element in the time-of-flight image pixel immediately after transferring charge to the first memory element, wherein transferring charge to the second memory element occurs after a predetermined wait time following the transfer of charge to the third memory element.

10. The method-defined in claim 9 , wherein:

the time-of-flight image pixel further includes a photodiode;

transferring the charge to the first memory element comprises asserting a first control signal for a first duration to turn on a first charge transfer gate coupled between the photodiode and the first memory element;

transferring the charge to the second memory element comprises asserting a second control signal for a second duration that is different than the first duration to turn on a second charge transfer gate coupled between the photodiode and the second memory element; and

transferring the charge to the third memory element comprises asserting a third control signal for the first duration to turn on a third charge transfer gate coupled between the photodiode and the third memory element.

11. The method defined in claim 10 , wherein the second duration is longer than the first duration.

12. The method defined in claim 10 , further comprising:

retrieving a pixel constant associated with the time-of-flight image pixel; and

computing depth information based on the retrieved pixel constant and the charges stored in the first, second, and third memory elements.

13. The method defined in claim 12 , wherein computing the depth information comprises computing a ratio of the first duration to the second duration and computing a-weighted difference between the charges stored in the second and third memory elements and between the charges stored in the first and second memory elements.

14. A system, comprising:

a central processing unit;

memory;

a lens;

input-output circuitry; and

an imaging device for imaging a scene having at least some backlight light, comprising:

an infrared illuminator that emits infrared light;

a time-of-flight (ToF) pixel that includes a first storage element for receiving charge generated while the infrared illuminator is activated, a second storage element for receiving charge generated while the infrared illuminator is deactivated, and a third storage element for receiving charge generated while the infrared illuminator is deactivated, wherein the charge received by the third storage element corresponds only to charge generated by the background light; and

processing circuitry configured to compute depth information based on charges stored in the first, second, and third storage elements and further configured to obtain color video information based only on charge stored in the third storage element.

15. The system defined in claim 14 , wherein the first storage element has a storage capacity that is equal to that of the second storage element and that is smaller than that of the third storage element.

16. The system defined in claim 14 , wherein the time-of-flight pixel further includes:

a photodiode;

a first transistor interposed between the first storage element and the photodiode;

a second transistor interposed between the second storage element and the photodiode; and

a third transistor Interposed between the third storage element and the photodiode, wherein the first and second transistors receive pulse control signals having a given pulse width, and wherein the third transistor receives another pulse control signal having a pulse width that is longer than the given pulse width.

17. The system defined in claim 14 , further comprising:

a dual-band filter formed over the imaging device.

Assignments (5)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2014
From: APTINA IMAGING CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 034673/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 3, 2013
From: VELICHKO, SERGEY; AGRANOV, GENNADIY
To: APTINA IMAGING CORPORATION
Reel/Frame 031709/0162 →