IP Library Patent Application 14137530
Patent Application
App. No. 14/137,530

SEMICONDUCTOR MANUFACTURING USING DESIGN VERIFICATION WITH MARKERS

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
14/137,530
Abstract

A first circuit design is entered in an electronic design automation (EDA) computer system. The first circuit design includes a first feature with a first node. A marker is associated with the first node and represents a voltage associated with the first node as an algebraic expression of a numerical value representing a property of the circuit design. The marker is used to determine if the component of the circuit design violates a design rule.

Claims (39)

1 . A method comprising:

entering a first circuit design in an electronic design automation (EDA) computer system, wherein the first circuit design includes a first feature with a first node;

providing a marker that represents a voltage associated with the first node as an algebraic expression of a first numerical value, wherein the first numerical value represents a property of the first circuit design; and

using the marker for a determination if the first feature of the first circuit design causes a design rule violation.

2 . The method of claim 1 further comprising resolving the design rule violation if the determination is that a design rule violation has occurred.

3 . The method of claim 2 wherein:

the resolving the design rule violation comprises increasing spacing between the first feature and a second feature that is adjacent to the first feature.

4 . The method of claim 1 further comprising manufacturing a system using the first circuit design after resolving the design rule violation.

5 . The method of claim 4 further comprising:

supplying the first circuit design to a semiconductor manufacturer to perform the manufacturing.

6 . The method of claim 1 , wherein the determination if a design rule violation has occurred is based on a spacing between the first feature and a second feature of the first circuit design.

7 . The method of claim 1 , wherein the first feature comprises one of a group consisting of a conductive line, a via, a well, and a circuit element.

8 . The method of claim 1 wherein the first node is one of a group consisting of a terminal, a sub-circuit pin, a location on a well, a location on a conductive line, a location in a circuit element, and a location on a via.

9 . The method of claim 1 further comprising:

entering a plurality of circuit designs in addition to the first circuit design in the EDA computer system, each of the plurality of circuit designs including at least one feature with a marker node;

associating one of a plurality of markers with the marker node of the at least one feature in each of a respective one of the plurality of circuit designs, each of the markers representing a voltage associated with the marker node as an algebraic function;

evaluating voltage levels represented by each of the markers; and

using the voltage levels represented by each of the markers to verify design rules in the EDA computer system.

10 . The method of claim 9 further comprising:

adjusting the circuit designs if at least one of the circuit designs violates the design rules.

11 . The method of claim 1 wherein the marker represents the voltage associated with the first node as a function of the first numerical value representing the first property of the first circuit design and a second numerical value representing a second property of the first circuit design.

12 . The method of claim 1 further comprising:

copying the marker associated with the first node to other nodes connected to the first node.

13 . A method comprising:

receiving at least one circuit layout file, the at least one circuit layout file includes:

a circuit design having a first feature that includes a first node, wherein the first feature is spaced from a second feature by a first distance;

a marker associated with the first node, wherein the marker represents a voltage which is calculated with an algebraic expression using a numerical representation of a property of the circuit design; and

checking design rules for the circuit design in an electronic design automation (EDA) computer system using the marker to determine if the first distance is in compliance with the design rules.

14 . The method of claim 13 wherein the algebraic function is one of a group consisting of: a non-linear function and a linear function.

15 . The method of claim 13 wherein the first feature comprises one of a group consisting of a conductive line, a via, a well, and a circuit element.

16 . The method of claim 13 wherein the property of the circuit design comprises one of a group consisting of a voltage and a current.

17 . The method of claim 13 further comprising:

if the checking design rules determines that the first distance is adequate, making an integrated circuit using the circuit design; and

if the checking design rules determines that the first distance is inadequate, modifying the circuit design until a modified circuit design provides adequate spacing and making an integrated circuit using the modified circuit design.

18 . An apparatus comprising:

a tangible computer storage medium including at least one circuit layout file, the at least one circuit layout file is readable by an electronic design automation (EDA) computer system and includes a circuit design having a feature with a node and a marker associated with the node, wherein the marker specifies a voltage associated with the node calculated with an algebraic expression using a numerical representation of a property of the circuit design.

19 . The apparatus of claim 18 further comprising:

at least one circuit schematic file on the tangible computer storage medium, the at least one circuit layout file is based on the at least one circuit schematic file, the at least one schematic file includes the marker associated with the node.

20 . The apparatus of claim 18 wherein the feature comprises one of a group consisting of: a conductive line, a via, a well, and a circuit element.

Assignments (22)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040626 FRAME: 0683. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME EFFECTIVE NOVEMBER 7, 2016. Recorded Jan 12, 2017
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 041414/0883 →
CHANGE OF NAME Recorded Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE FILING AND REMOVE APPL. NO. 14085520 REPLACE IT WITH 14086520 PREVIOUSLY RECORDED AT REEL: 037515 FRAME: 0390. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Mar 1, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037926/0642 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT APPL. NO. 14/085,520 PREVIOUSLY RECORDED AT REEL: 037515 FRAME: 0420. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 11, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037879/0581 →
CORRECTIVE ASSIGNMENT OF INCORRECT NUMBER 14085520 PREVIOUSLY RECORDED AT REEL: 037458 FRAME: 0420. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTON OF SECURITY INTEREST IN PATENTS. Recorded Feb 11, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037785/0568 →
CORRECTIVE ASSIGNMENT OF INCORRECT PATENT APPLICATION NUMBER 14085520 ,PREVIOUSLY RECORDED AT REEL: 037458 FRAME: 0399. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 11, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037785/0454 →
CORRECTIVE ASSIGNMENT OF INCORRECT APPL. NO. 14/085,520 PREVIOUSLY RECORDED AT REEL: 037515 FRAME: 0390. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 11, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037792/0227 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED ON REEL 037458 FRAME 0420. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Jan 14, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037515/0420 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED ON REEL 037458 FRAME 0399. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Jan 14, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037515/0390 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 7, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FOUNDING, INC.
Reel/Frame 037458/0420 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 7, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FOUNDING, INC.
Reel/Frame 037458/0399 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0790 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Mar 13, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., COLLATERAL AGENT
Reel/Frame 032445/0689 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Mar 13, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 032445/0577 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Mar 13, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 032445/0493 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2013
From: DEMIRCAN, ERTUGRUL; REBER, DOUGLAS M.; STOCKINGER, MICHAEL A.; TRAVIS, EDWARD O.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 031834/0638 →