Integrated circuit packaging system with under bump metallization and method of manufacture thereof
View Patent ↗An integrated circuit packaging system and method of manufacture thereof including: providing a substrate; forming contact pads on top of the substrate; forming a protection layer on top of the contact pads and the substrate; exposing the contact pads from the protection layer; printing under bump metallization (UBM) layers over the exposed contact pads extended over the protection layer with conductive inks; and forming bumps on top of the under bump metallization layers. It also including: printing an adhesion layer using conductive ink, wherein the adhesion layer comprises interconnected adhesion layer pads; forming additional under bump metallization (UBM) layers and bumps on top of the adhesion layer pads utilizing an electro-deposition process; and removing connections among the interconnected adhesion layer pads.
1. A method of manufacture of a semiconductor packaging system comprising:
providing a substrate;
forming contact pads on top of the substrate;
forming a protection layer on top of the contact pads and the substrate;
exposing the contact pads from the protection layer;
printing an adhesion layer using conductive ink, wherein the adhesion layer comprises interconnected adhesion layer pads;
forming additional under bump metallization (UBM) layers and bumps on top of the adhesion layer pads utilizing an electro-deposition process; and
removing connections among the interconnected adhesion layer pads.
2. The method as claimed in claim 1 wherein printing the adhesion layers includes ink jet printing or stencil printing with the conductive ink.
3. The method as claimed in claim 1 wherein printing the adhesion layers includes printing a selectively deposited adhesion layer, wherein the selectively deposited adhesion layer comprises adhesion layer pads, and adhesion layer bars connecting the adhesion layer pads.
4. The method as claimed in claim 1 wherein printing the adhesion layers includes using a UV curable conductive ink.
5. The method as claimed in claim 1 wherein removing the connections includes removing a portion of the adhesion layer bars.
6. A method of manufacture of an integrated circuit packaging system comprising:
providing a silicon substrate;
forming aluminum pads on top of the silicon substrate;
forming a passivation layer on top of the aluminum pads and the silicon substrate;
exposing the aluminum pads from the passivation layer;
printing an adhesion layer using conductive ink, wherein the adhesion layer comprises interconnected adhesion layer pads;
forming additional under bump metallization (UBM) layers and solder bumps on top of the adhesion layer pads utilizing an electro-deposition process; and
removing connections among the interconnected adhesion layer pads.
7. The method as claimed in claim 6 wherein printing the adhesion layers includes ink jet printing or stencil printing with the conductive ink.
8. The method as claimed in claim 6 wherein printing the adhesion layers includes printing a selectively deposited adhesion layer, wherein the selectively deposited adhesion layer comprises adhesion layer pads, and adhesion layer bars connecting the adhesion layer pads.
9. The method as claimed in claim 6 wherein printing the adhesion layers includes using a UV curable conductive ink.
10. The method as claimed in claim 6 wherein removing the connections includes removing a portion of the adhesion layer bars.