Lead frame and substrate semiconductor package
A semiconductor chip package includes a lead frame having a die paddle, leads surrounding the paddle and a central window through the paddle. A substrate has a base side and a superior side. A peripheral portion of the base side is secured to the paddle and a central portion of the base side is exposed through the central window. A semiconductor chip is secured to the superior side of the substrate. The semiconductor chip is electrically connected to the plurality of leads and the substrate. A mold compound covers at least portions of the lead frame, the substrate and the semiconductor chip. The chip package can be electrically connected to other devices or a circuit board by way of the leads and BGA pads of the substrate exposed in the central window.
1. A semiconductor chip package, comprising:
a lead frame having a paddle, a plurality of leads surrounding the paddle and a central window through the paddle;
a packaged device including a first semiconductor chip attached and electrically connected to a substrate and a first mold compound covering at least portions of the first semiconductor chip and the substrate, the packaged device having a base side and a superior side, a peripheral portion of the base side secured to the paddle and a central portion of the base side exposed through the central window;
a second semiconductor chip secured to the superior side of the packaged device, wherein the second semiconductor chip is electrically connected to the plurality of leads; and
a second mold compound covering the packaged device, the second semiconductor chip and at least portions of the lead frame,
wherein the central portion of the packaged device includes a substrate ball grid array pad.
2. The semiconductor chip package of claim 1 , wherein the first semiconductor chip is electrically connected to the substrate with solder balls.
3. The semiconductor chip package of claim 1 , wherein the first semiconductor chip is electrically connected to the substrate with bond wires.
4. The semiconductor chip package of claim 1 , wherein the second semiconductor chip is electrically connected to the plurality of leads with bond wires.
5. The semiconductor chip package of claim 1 , wherein the peripheral portion of the base side of the packaged device is secured to the paddle with an adhesive.
6. The semiconductor chip package of claim 1 , wherein the substrate includes multi-layer metal interconnections and a multi-input/output layout.
7. A semiconductor chip package, comprising:
a lead frame having a paddle, a plurality of leads surrounding the paddle and a central window through the paddle;
a packaged device including a first semiconductor chip attached and electrically connected to a substrate and a first mold compound covering at least portions of the first semiconductor chip and the substrate, the packaged device having a base side and a superior side, a peripheral portion of the base side secured to the paddle and a central portion of the base side exposed through the central window, the central portion including a substrate ball grid array pad, and the first semiconductor chip electrically connected to the substrate with first bond wires;
a second semiconductor chip secured to the superior side of the packaged device, wherein the second semiconductor chip is electrically connected to the plurality of leads with second bond wires; and
a second mold compound covering the packaged device, the second semiconductor chip, the second bond wires, and at least portions of the lead frame.
8. The semiconductor chip package of claim 7 , wherein the peripheral portion of the base side of the packaged device is secured to the paddle with an adhesive.
9. The semiconductor chip package of claim 7 , wherein the substrate includes multi-layer metal interconnections and a multi-input/output layout.