IC package with metal interconnect structure implemented between metal layers of die and interposer
View Patent ↗An integrated circuit package includes a die having a first substrate implementing an integrated circuit comprising circuit elements. The die includes a first plurality of metal layers implementing a first portion of a metal interconnect structure for the integrated circuit. The die also includes a first plurality of pads at or overlying a top metal layer of the first plurality of metal layers. The integrated circuit package includes an interposer having a second plurality of metal layers implementing a second portion of the metal interconnect structure. The interposer includes a second plurality of pads at or overlying a top metal layer of the second plurality of metal layers. A plurality of solder structures couple the first and second pluralities of pads. The first and second portions of the metal interconnect structure together complete a signal path between two or more circuit blocks of the integrated circuit.
1. An integrated circuit package comprising:
a die comprising:
a first substrate implementing an integrated circuit comprising circuit elements at a surface of the first substrate;
a first plurality of metal layers disposed at the surface of the first substrate, the first plurality of metal layers implementing a first portion of a metal interconnect structure for the integrated circuit; and
a first plurality of pads at or overlying a top metal layer of the first plurality of metal layers;
wherein the first portion of the metal interconnect structure comprises a first metal interconnect path coupled between a first circuit block of the integrated circuit and a first pad of the first plurality of pads and comprises a second metal interconnect path coupled between a second circuit block of the integrated circuit and a second pad of the plurality of pads, wherein the second metal interconnect path does not connect to the first metal interconnect path within the first plurality of metal layers; and
an interposer comprising:
a second plurality of metal layers disposed at a first surface of the interposer, the second plurality of metal layers implementing a second portion of the metal interconnect structure; and
a second plurality of pads at or overlying a top metal layer of the second plurality of metal layers;
wherein the second portion of the metal interconnect structure comprises a third metal interconnect path coupled between a third pad of the second plurality of pads and a fourth pad of the second plurality of pads; and
a first plurality of solder structures coupling the first plurality of pads and the second plurality of pads, the first plurality of solder structures comprising a first solder structure coupling the first pad and the third pad and a second solder structure coupling the second pad and the fourth pad.
2. The integrated circuit package of claim 1 , further comprising:
a second plurality of pads disposed at a second surface of the interposer.
3. The integrated circuit package of claim 2 , further comprising:
a plurality of through-substrate vias extending from the second surface of the interposer to the second plurality of metal layers, the second surface opposite the first surface.
4. The integrated circuit package of claim 3 , wherein:
a component of the integrated circuit is identified as inoperative;
a subset of the through-substrate vias of the plurality of through-substrate vias are configured to provide supply voltages from an external source; and
the second portion of the metal interconnect structure is configured to electrically isolate the component of the integrated circuit from the subset of the through-substrate vias.
5. The integrated circuit package of claim 1 , wherein the second portion of the metal interconnect structure is configured to electrically isolate conductive features of the first portion of the metal interconnect structure that are connected to a component of the integrated circuit.
6. A method of fabricating an integrated circuit package comprising:
fabricating a die comprising a first substrate implementing an integrated circuit comprising circuit elements at a surface of the first substrate, a first plurality of metal layers disposed at the surface of the first substrate, the first plurality of metal layers implementing a first portion of a metal interconnect structure for the integrated circuit, and a first plurality of pads at or overlying a top metal layer of the first plurality of metal layers, wherein the first portion of the metal interconnect structure comprises a first metal interconnect path coupled to a first circuit block of the integrated circuit and a second metal interconnect path coupled to a second circuit block of the integrated circuit;
fabricating an interposer comprising a second plurality of metal layers disposed at a first surface of the interposer, the second plurality of metal layers implementing a second portion of the metal interconnect structure, and a second plurality of pads at or overlying a top metal layer of the second plurality of metal layers, wherein the second portion of the metal interconnect structure comprises a third metal interconnect path; and
bonding the die and interposer via the first plurality of pads and the second plurality of pads, wherein bonding the die and interposer couples the first, second, and third metal interconnect paths together to form a signal path between the first circuit block and the second circuit block.
7. The method of claim 6 , wherein fabricating the interposer comprises:
forming a plurality of through-substrate vias extending from a second surface of the interposer to the second plurality of metal layers, the second surface opposite the first surface.
8. The method of claim 7 , wherein fabricating the interposer further comprises:
forming a plurality of package leads at the second surface of the interposer, each package lead coupled to a corresponding through-substrate via of the plurality of through-substrate vias.
9. The method of claim 7 , further comprising:
identifying a component of the integrated circuit as inoperative; and
wherein fabricating the interposer comprises fabricating the second plurality of metal layers so as to isolate conductive features of the first plurality of metal layers that are connected to the component from those through-substrate vias that are configured to couple to supply voltages.
10. The method of claim 9 , wherein identifying the component as inoperative comprises:
probe testing the integrated circuit via the first plurality of pads; and
identifying the component as inoperative based on the probe testing.
11. The method of claim 6 , wherein fabricating the interposer further comprises:
forming a plurality of package leads; and
forming a plurality of wirebond leads coupled between the package leads and corresponding wirebond pads at a second surface of the interposer.
12. The method of claim 6 , further comprising:
identifying a component of the integrated circuit as inoperative; and
wherein fabricating the interposer comprises fabricating the second plurality of metal layers so as to isolate the component from supply voltages.
13. The method of claim 12 , wherein identifying the component as inoperative comprises:
probe testing the integrated circuit via the first plurality of pads; and
identifying the component as inoperative based on the probe testing.
14. A method of fabricating an integrated circuit package, the method comprising:
fabricating a die comprising a first substrate implementing an integrated circuit comprising circuit elements at a surface of the first substrate, a first plurality of metal layers disposed at the surface of the first substrate, the first plurality of metal layers implementing a first portion of a metal interconnect structure for the integrated circuit, and a first plurality of pads at or overlying a top metal layer of the first plurality of metal layers;
probe testing the integrated circuit via the first plurality of pads to determine an operational status of a set of components of the integrated circuit;
selecting an interposer from a plurality of available interposers based on the operational status, the selected interposer comprising a second plurality of metal layers implementing a second portion of the metal interconnect structure, the second plurality of metal layers comprising a second top metal layer comprising a second plurality of pads at a first surface of the interposer; and
bonding the die to the interposer via solder structures joining the first plurality of pads to the second plurality of pads.
15. The method of claim 14 , wherein selecting the interposer comprises:
selecting as the interposer a first interposer responsive to the operational status indicating a first component of the integrated circuit is operative, the first interposer comprising the second plurality of metal layers configuring the second portion of the metal interconnect structure so as to electrically couple the first component to at least one supply voltage.
16. The method of claim 15 , wherein selecting the interposer further comprises:
selecting as the interposer a second interposer responsive to the operational status indicating the first component of the integrated circuit is inoperative, the second interposer comprising the second plurality of metal layers configuring the second portion of the metal interconnect structure so as to electrically isolate the first component from the at least one supply voltage.
17. The method of claim 14 , wherein selecting the interposer comprises:
selecting as the interposer a first interposer responsive to the operational status indicating a first component of the integrated circuit is inoperative, the first interposer comprising the second plurality of metal layers configuring the second portion of the metal interconnect structure so as to electrically isolate the first component from at least one supply voltage.
18. The method of claim 14 , wherein fabricating the interposer comprises:
forming a plurality of through-substrate vias extending from a second surface of the interposer to the second plurality of metal layers, the second surface opposite the first surface.
19. The method of claim 18 , wherein fabricating the interposer further comprises:
forming a plurality of package leads at the second surface of the interposer, each package lead coupled to a corresponding through-substrate via of the plurality of through-substrate vias.
20. The method of claim 19 , wherein the package leads comprise solder structures.