IP Library Granted Patent US 9,450,043
Granted Patent B2
US 9,450,043 · App. 14/155,010 · Granted Sep 20, 2016

Methods and devices for fabricating and assembling printable semiconductor elements

Inventors: Ralph G. Nuzzo (Champaign, IL); John A. Rogers (Champaign, IL); Etienne Menard (Voglans, FR); Keon Jae Lee (Daejeon, KR); Dahl-Young Khang (Urbana, IL); Yugang Sun (Champaign, IL); Matthew Meitl (Durham, NC); Zhengtao Zhu (Rapid City, SD)
Assignee: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
H01L29/06B82Y10/00H01L21/02521H01L21/02603H01L21/02628H01L21/308H01L21/6835H01L24/03H01L24/80H01L24/83H01L24/97H01L27/1285H01L27/1292H01L29/04H01L29/068H01L29/0665H01L29/0673H01L29/0676H01L29/12H01L29/78696H01L31/0392H01L31/03926H01L31/1804H01L31/1864H01L31/1896B81C2201/0185H01L24/05H01L24/08H01L24/29H01L24/32H01L24/94H01L29/78603H01L29/78681H01L2221/68368H01L2221/68381H01L2224/0332H01L2224/0345H01L2224/0362H01L2224/03614H01L2224/05073H01L2224/05082H01L2224/05124H01L2224/05144H01L2224/05155H01L2224/05166H01L2224/05552H01L2224/05553H01L2224/05554H01L2224/05555H01L2224/05644H01L2224/05666H01L2224/08225H01L2224/2919H01L2224/32225H01L2224/80006H01L2224/80121H01L2224/80862H01L2224/80895H01L2224/83005H01L2224/8385H01L2224/83121H01L2224/83192H01L2224/83193H01L2224/83862H01L2224/9202H01L2224/94H01L2224/95H01L2224/97H01L2924/10253H01L2924/10329H01L2924/12032H01L2924/12036H01L2924/12041H01L2924/12042H01L2924/12043H01L2924/12044H01L2924/1305H01L2924/1306H01L2924/13091H01L2924/1461H01L2924/1579H01L2924/15159H01L2924/15162H01L2924/15788Y02E10/547Y02P70/521Y10S977/707Y10S977/724
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,450,043
App. No.
14/155,010
Granted
Sep 20, 2016
Kind
B2
Abstract

The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

Claims (19)

1. A stretchable semiconductor element comprising:

an elastic substrate having a supporting surface; and

a stretchable semiconductor structure having a curved internal surface, wherein said stretchable semiconductor structure is a single crystalline semiconductor material, wherein said curved internal surface is continuously bonded to said supporting surface while said elastic substrate is in an expanded state, wherein said curved internal surface has at least one convex region and at least one concave region, and wherein said stretchable semiconductor structure comprises a bent structure under strain resulting from application of a force arising from allowing said elastic substrate to relax from the expanded state.

2. The stretchable semiconductor element of claim 1 wherein said stretchable semiconductor structure is in a bent conformation.

3. The stretchable semiconductor element of claim 1 wherein said curved internal surface has a contour profile characterized by a periodic wave.

4. The stretchable semiconductor element of claim 1 wherein said curved internal surface has a contour profile characterized by an aperiodic wave.

5. The stretchable semiconductor element of claim 1 wherein said stretchable semiconductor structure comprises a ribbon in a bent configuration having a contour profile characterized by a periodic wave extending the length of said ribbon.

6. The stretchable semiconductor element of claim 5 wherein said bent ribbon has a width selected over the range of about 5 microns to about 50 microns and a thickness selected over the range of about 50 nanometers to about 500 nanometers.

7. The stretchable semiconductor element of claim 1 wherein said elastic substrate comprises poly(dimethylsiloxane).

8. The stretchable semiconductor element of claim 1 wherein said elastic substrate has a thickness equal to about 1 millimeter.

9. The stretchable semiconductor element of claim 1 wherein said stretchable semiconductor structure is an inorganic semiconductor material.

10. The stretchable semiconductor element of claim 1 wherein said stretchable semiconductor structure comprises single crystalline silicon.

11. A stretchable electrical circuit comprising:

an elastic substrate having a supporting surface; and

an electrical circuit having a curved internal surface, wherein the electrical circuit comprises at least one stretchable semiconductor structure, wherein said at least one stretchable semiconductor structure is a single crystalline semiconductor material, wherein said curved internal surface of said electrical circuit is continuously bonded to said supporting surface of said elastic substrate while said elastic substrate is in an expanded state, wherein said electrical circuit is in a bent conformation, and wherein said electrical circuit having said curved internal surface is under strain resulting from application of a force arising from allowing said elastic substrate to relax from the expanded state.

12. The stretchable electrical circuit of claim 11 wherein said electrical circuit comprises a plurality of integrated device components.

13. The stretchable electrical circuit of claim 11 wherein said integrated device components are selected from the group consisting of: a semiconductor element; a dielectric element; an electrode; a conductor element; and a doped semiconductor element.

14. The stretchable electrical circuit of claim 11 wherein said curved internal surface has a contour profile characterized by a periodic wave.

15. The stretchable electrical circuit of claim 11 wherein said curved internal surface has a contour profile characterized by an aperiodic wave.

Assignments (3)
CONFIRMATORY LICENSE Recorded Nov 4, 2021
From: UNIVERSITY OF ILLINOIS AT URBANA-CHAMPAIGN
To: UNITED STATES DEPARTMENT OF ENERGY
Reel/Frame 058028/0699 →
CONFIRMATORY LICENSE Recorded Jun 1, 2016
From: BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS, THE
To: ENERGY, UNITED STATES DEPARTMENT OF
Reel/Frame 038990/0540 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 30, 2014
From: NUZZO, RALPH G.; ROGERS, JOHN A.; MENARD, ETIENNE; LEE, KEON JAE; KHANG, DAHL-YOUNG; SUN, YUGANG; MEITL, MATTHEW; ZHU, ZHENGTAO
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 033420/0473 →
Continuity (10)
Continuation 13801868 · Mar 13, 2013
Continuation 13113504 · May 23, 2011
Continuation 12564566 · Sep 22, 2009
Division 11145574 · Jun 2, 2005
Provisional Application 60577077 · Jun 4, 2004
Provisional Application 60601061 · Aug 11, 2004
Provisional Application 60650305 · Feb 24, 2005
Provisional Application 60663391 · Mar 18, 2005
Provisional Application 60677617 · May 4, 2005
Related Publication 20140191236A1 · Jul 10, 2014