IP Library Granted Patent US 9,407,039
Granted Patent B2
US 9,407,039 · App. 14/159,271 · Granted Aug 2, 2016

Interconnection systems

Inventors: Michael George (Pleasanton, CA); Jonathan J. Hubert (Los Gatos, CA); John S. Geldman (Los Gatos, CA)
Assignee: Micron Technology, Inc.
H01R13/631H01R2201/06
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Quick Facts
Patent No.
US 9,407,039
App. No.
14/159,271
Granted
Aug 2, 2016
Kind
B2
Abstract

Interconnection systems are shown that include communication contacts, and a guide. Configurations are shown with a guide that locates a male portion with respect to a female portion and guides their engagement before any communication contacts are engaged. Configurations are also shown with a guide that includes one or more power contacts.

Claims (43)

1. An interconnection system, comprising:

a female portion and a male portion;

a plurality of first communication contacts located within the female portion;

a plurality of corresponding second communication contacts located on the male portion, to interface with the first communication contacts;

a guide on one of the portions, separate from the communication contacts, to engage with a guide hole on the other portion, the guide including:

a leading taper section;

a tolerance fit section;

wherein the tolerance fit section is configured to engage with the guide hole before the first communication contacts interface with the second communication contacts; and

a port coupling between the female portion and the male portion for transmission of cooling media.

2. The interconnection system of claim 1 , wherein the guide further includes a power contact surface and a ground contact surface.

3. The interconnection system of claim 2 , wherein the leading taper section is non-conductive.

4. The interconnection system of claim 2 , wherein the power contact surface is configured to engage with the guide hole before the first communication contacts interface with the second communication contacts.

5. The interconnection system of claim 1 , wherein the guide includes two different power contacts, each assigned to operate at different voltages.

6. An interconnection system, comprising:

a female portion and a male portion;

a hydrogen fuel cell device coupled to one of the female or male portions;

a plurality of first communication contacts located within the female portion;

a plurality of corresponding second communication contacts located on the male portion, to interface with the first communication contacts;

a guide on one of the portions, separate from the communication contacts, to engage with a guide hole on the other portion, the guide including:

a leading taper section;

a tolerance fit section;

wherein the tolerance fit section is configured to engage with the guide hole before the first communication contacts interface with the second communication contacts; and

a port coupling between the female portion and the male portion for transmission of hydrogen gas.

7. The interconnection system of claim 6 , wherein the plurality of first communication contacts and the plurality of corresponding second communication contacts includes a plurality of USB ports of different configurations.

8. The interconnection system of claim 7 , wherein the plurality of USB ports of different configurations includes a USB standard configuration.

9. The interconnection system of claim 7 , wherein the plurality of USB ports of different configurations includes a mini USB standard configuration.

10. The interconnection system of claim 7 , wherein the plurality of USB ports of different configurations includes a micro USB standard configuration.

11. The interconnection system of claim 7 , wherein the plurality of USB ports of different configurations includes a USB 2.0 standard configuration.

12. The interconnection system of claim 6 , wherein the first and second communication contacts include optical communication contacts.

13. An interconnection system, comprising:

a female portion;

a plurality of USB ports of different configurations within the female portion;

a plurality of corresponding USB ports located on a common male portion;

a guide on one of the portions, separate from the communication contacts, to engage with a guide hole on the other portion, the guide including:

a leading taper section;

a tolerance fit section;

a power contact surface and a ground contact surface; and

wherein the tolerance fit section is configured to engage with the guide hole before the plurality of USB ports interface with the corresponding USB ports.

14. The interconnection system of claim 13 , wherein the plurality of USB ports includes at least two port configurations chosen from a group consisting of USB 2.0, USB 3.0, mini USB, and micro USB.

15. The interconnection system of claim 13 , wherein the plurality of USB ports includes at least three port configurations chosen from a group consisting of USB 2.0, USB 3.0, mini USB, and micro USB.

16. The interconnection system of claim 13 , wherein the leading taper section is non-conductive.

17. The interconnection system of claim 13 , wherein the power contact surface is configured to engage with the guide hole before the first communication contacts interface with the second communication contacts.

18. The interconnection system of claim 13 , wherein the guide includes two different power contacts, each assigned to operate at different voltages.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Continuity (2)
Continuation 13211103 · Aug 16, 2011
Related Publication 20140148042A1 · May 29, 2014