Configuration bit architecture for programmable integrated circuit device

1. An array of memory cells on an integrated circuit device, comprising:

a plurality of memory cells arranged in at least one column, wherein:

each of said memory cells comprises a plurality of transistors forming two complementary memory nodes, one of said complementary memory nodes storing a value and another of said complementary memory nodes storing a complement of said value;

each respective one of said complementary memory nodes is connected to a respective pair of pull-up or pull-down transistors, said respective pair of pull-up or pull-down transistors being connected in series and having a respective shared node therebetween;

for a particular one of said memory cells, one of said respective shared nodes associated with one of said complementary memory nodes is directly connected to a corresponding respective shared node associated with a corresponding complementary memory node in a second one of said memory cells, and another of said respective shared nodes associated with another of said complementary memory nodes is directly connected to a corresponding respective shared node associated with a corresponding complementary memory node in a third one of said memory cells.

2. The array of memory cells of claim 1 wherein:

said second one of said memory cells is above said particular one of said memory cells; and

said third one of said memory cells is below said particular one of said memory cells.

3. The array of memory cells of claim 2 wherein said second one of said memory cells and said third one of said memory cells are adjacent said particular one of said memory cells; whereby:

complementary memory nodes of said memory cells in said column are connected in an alternating complementary pattern.

4. The array of memory cells of claim 1 wherein each of said transistors is a non-planar multigate field-effect transistor.

5. The array of memory cells of claim 1 wherein:

said respective pair of pull-up or pull-down transistors is a pair of PMOS pull-up transistors; and

each of said complementary memory nodes is formed between a single NMOS pull-down transistor and said pair of PMOS pull-up transistors.

6. The array of memory cells of claim 5 wherein each of said transistors is a non-planar multigate field-effect transistor.

7. The array of memory cells of claim 1 wherein:

said respective pair of pull-up or pull-down transistors is a pair of NMOS pull-down transistors; and

each of said complementary memory nodes is formed between a single PMOS pull-up transistor and said pair of NMOS pull-down transistors.

8. The array of memory cells of claim 7 wherein each of said transistors is a non-planar multigate field-effect transistor.

9. The array of memory cells of claim 1 wherein:

said integrated circuit device is a programmable integrated circuit device; and

said array of memory cells forms configuration memory of said programmable integrated circuit device.

10. A programmable integrated circuit device comprising:

areas of programmable logic;

configurable interconnect resources; and

configuration memory storing configuration bits that program said areas of programmable logic and that configure said configurable interconnect resources, said configuration memory comprising a plurality of memory cells arranged in at least one column, wherein:

each of said memory cells comprises a plurality of transistors forming two complementary memory nodes, one of said complementary memory nodes storing a value and another of said complementary memory nodes storing a complement of said value;

each respective one of said complementary memory nodes is connected to a respective pair of pull-up or pull-down transistors, said respective pair of pull-up or pull-down transistors being connected in series and having a respective shared node therebetween;

for a particular one of said memory cells, one of said respective shared nodes associated with one of said complementary memory nodes is directly connected to a corresponding respective shared node associated with a corresponding complementary memory node in a second one of said memory cells, and another of said respective shared nodes associated with another of said complementary memory nodes is directly connected to a corresponding respective shared node associated with a corresponding complementary memory node in a third one of said memory cells.

11. The programmable integrated circuit device of claim 10 wherein:

said second one of said memory cells is above said particular one of said memory cells; and

said third one of said memory cells is below said particular one of said memory cells.

12. The programmable integrated circuit device of claim 11 wherein said second one of said memory cells and said third one of said memory cells are adjacent said particular one of said memory cells; whereby:

complementary memory nodes of said memory cells in said column are connected in an alternating complementary pattern.

13. The programmable integrated circuit device of claim 10 wherein each of said transistors is a non-planar multigate field-effect transistor.

14. The programmable integrated circuit device of claim 10 wherein:

said respective pair of pull-up or pull-down transistors is a pair of PMOS pull-up transistors; and

each of said complementary memory nodes is formed between a single NMOS pull-down transistor and said pair of PMOS pull-up transistors.

15. The programmable integrated circuit device of claim 14 wherein each of said transistors is a non-planar multigate field-effect transistor.

16. The programmable integrated circuit device of claim 10 wherein:

said respective pair of pull-up or pull-down transistors is a pair of NMOS pull-down transistors; and

each of said complementary memory nodes is formed between a single PMOS pull-up transistor and said pair of NMOS pull-down transistors.

17. The programmable integrated circuit device of claim 16 wherein each of said transistors is a non-planar multigate field-effect transistor.

18. A method of forming a memory array on an integrated circuit device, said memory having a plurality of memory cells arranged in at least one column, each of said memory cells including a plurality of transistors forming two complementary memory nodes, and each respective one of said complementary memory nodes being connected to a respective pair of pull-up or pull-down transistors, said respective pair of pull-up or pull-down transistors being connected in series and having a respective shared node therebetween, said method comprising:

for each particular one of said memory cells, directly connecting one of said respective shared nodes associated with one of said complementary memory nodes to a corresponding respective shared node associated with a corresponding complementary memory node in a second one of said memory cells, and directly connecting another of said respective shared nodes associated with another of said complementary memory nodes to a corresponding respective shared node associated with a corresponding complementary memory node in a third one of said memory cells.

19. The method of claim 18 wherein:

said second one of said memory cells is above said particular one of said memory cells; and

said third one of said memory cells is below said particular one of said memory cells.

20. The method of claim 19 wherein:

said second one of said memory cells and said third one of said memory cells are adjacent said particular one of said memory cells; and

complementary memory nodes of said memory cells in said column are connected in an alternating complementary pattern.