Method for controlling plasma processing apparatus
View Patent ↗There is provided a method for controlling a plasma processing apparatus that eliminates a preliminary study on a resonance point while maintaining a low contamination and a high uniformity even in multi-step etching. In a method for controlling a plasma processing apparatus including the step of adjusting a radio frequency bias current carried to a counter antenna electrode, the method includes the steps of: setting a reactance of a variable element to an initial value; detecting a bias current carried to the counter antenna electrode; searching for a maximum value of the detected electric current; and adjusting a value of the reactance of the variable element from the maximum value to the set value and then fixing the value.
1. A method for controlling a plasma processing apparatus including a plasma processing chamber in which an object to be processed is plasma-processed, a first electrode which emits a radio frequency into the plasma processing chamber, a first radio frequency power supply which supplies radio frequency power to the first electrode, a second electrode arranged to face the first electrode and on which the object to be processed is placed, a second radio frequency power supply which supplies radio frequency power to the second electrode, the method comprising the steps of:
detecting a radio frequency current flowing from the second electrode toward the first electrode or a radio frequency voltage on a path in which the radio frequency current flows; and
controlling a reactance for controlling the detected radio frequency current or the detected radio frequency voltage so that the detected radio frequency current or the detected radio frequency voltage takes a value of the resonance point.
2. The method for controlling a plasma processing apparatus according to claim 1 , wherein the initial value of the reactance is greater than the value of the resonance point so that the radio frequency current takes a maximum value or the radio frequency voltage takes a maximum value.
3. A method for controlling a plasma processing apparatus including a plasma processing chamber in which an object to be processed is plasma-processed, a first electrode which emits a radio frequency into the plasma processing chamber, a first radio frequency power supply which supplies radio frequency power to the first electrode, a second electrode arranged to face the first electrode and on which the object to be processed is placed, a second radio frequency power supply which supplies radio frequency power to the second electrode, the method comprising steps of:
detecting a first phase difference between a first radio frequency current flowing from the second radio frequency power supply toward the second electrode and a second radio frequency current flowing from the second electrode toward the first electrode or a second phase difference between a first radio frequency voltage applied to the second electrode and a second radio frequency voltage on a path in which the second radio frequency current flows, and
controlling a reactance for controlling the second radio frequency current or the second radio frequency voltage based on the detected first phase difference or the detected second phase difference.
4. The method for controlling a plasma processing apparatus according to claim 3 , wherein the value of the first or second phase difference is a value within a desired permissible value with respect to an angle of 90 degrees.
5. The method for controlling a plasma processing apparatus according to claim 3 , wherein the reactance is a variable capacitor.